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41. 发明申请

US20060147719A1 Curable composition, underfill, and method 审中-公开
标题翻译：可固化组合物，底部填充剂和方法
公开(公告)号：US20060147719A1
公开(公告)日：2006-07-06
申请号：US11368146
申请日：2006-03-03
申请人： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
发明人： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
IPC分类号： B32B27/38 , B32B15/02 , C08K3/22
CPC分类号： C08K3/22 , Y10T428/2995 , Y10T428/31511
摘要： A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
摘要翻译：提供可固化组合物及其相关方法。可固化组合物可以包括可固化树脂和细碎的耐火固体。固体可以具有大于约5平方米/克的表面积，并且确定每平方毫米表面积的活性表面终止位点的密度。

42. 发明申请

US20060135705A1 Curable encapsulant composition, device including same, and associated method 失效
标题翻译：可固化密封剂组合物，包括其的装置和相关方法
公开(公告)号：US20060135705A1
公开(公告)日：2006-06-22
申请号：US11167843
申请日：2005-06-24
申请人： Michael Vallance , John Campbell , Kenneth Zarnoch , Prameela Susarla , Bryan Duffey , Gary Yeager , Michael O'Brien
发明人： Michael Vallance , John Campbell , Kenneth Zarnoch , Prameela Susarla , Bryan Duffey , Gary Yeager , Michael O'Brien
IPC分类号： C08L71/00 , B32B27/00 , H01L21/56 , B32B33/00
CPC分类号： C08F290/06 , C08F283/08 , C08F283/085 , C08F290/062 , C08G65/48 , C08G65/485 , C08K9/06 , C08L33/08 , C08L71/126 , C09D163/00 , H01L23/293 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , Y10T428/31504 , C08L2666/04 , H01L2924/00014
摘要： An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.
摘要翻译：可以提供用于封装电子部件的密封剂和制造和/或使用密封剂的方法。可以提供包括密封剂的电子设备。可固化的密封剂组合物可以包括官能化聚合物和至少一种反应性单体组合物的混合物。反应性单体组合物可以包括反应性单体组分，其可以是低温固体，并且可以反应性单体组合物中的量存在，基于反应性单体组合物的总重量大于约20重量％。该混合物在约低温下可以是固体或无粘性的，或固体和无粘性的。

43. 发明申请

US20050278927A1 Fan mount 审中-公开
标题翻译：风扇安装
公开(公告)号：US20050278927A1
公开(公告)日：2005-12-22
申请号：US10874936
申请日：2004-06-22
申请人： John Campbell
发明人： John Campbell
IPC分类号： B23P11/02 , F04D29/60
CPC分类号： F04D29/601 , Y10T29/49863 , Y10T29/49876
摘要： In one embodiment, a fan mount has a unitary elastomeric structure. The unitary elastomeric structure has a number of fan assembly retainers molded therein, and a number of mounting feet molded therein. In another embodiment, a fan mount has an elastomeric band, shaped to follow a perimeter of a fan assembly, with a number of elastomeric mounting feet extending therefrom. A related method includes 1) deforming an elastomeric fan mount to capture a fan assembly therein, and 2) engaging a number of mounting feet, which extend from the elastomeric fan mount, with installation capture slots on an installation surface.
摘要翻译：在一个实施例中，风扇安装座具有单一的弹性体结构。整体弹性体结构具有多个模制在其中的风扇组件保持器，并且其中模制了多个安装脚。在另一个实施例中，风扇安装座具有成形为跟随风扇组件的周边的弹性体带，其中多个弹性体安装脚从其延伸。一种相关的方法包括：使弹性风扇安装座变形以将风扇组件收纳在其中，以及2）将多个从弹性风扇安装座延伸的安装脚与安装表面上的安装捕获槽接合。

44. 发明申请

US20050178521A1 Lost pattern mold removal casting method and apparatus 有权
标题翻译：脱模图案脱模铸造方法及装置
公开(公告)号：US20050178521A1
公开(公告)日：2005-08-18
申请号：US11093077
申请日：2005-03-29
申请人： John Grassi , John Campbell , George Kuhlman
发明人： John Grassi , John Campbell , George Kuhlman
IPC分类号： B22C7/02 , B22C9/04 , B22D27/04
CPC分类号： B22C7/023 , B22C9/046
摘要： A method and apparatus for the lost pattern casting of metals is disclosed. In the method, a pattern is formed from a material and a mold is formed around at least a portion of the pattern. The mold includes a particulate material and a binder. The pattern is removed from the mold and molten metal is delivered into the mold. The mold is contacted with the solvent and the molten metal is cooled such that it at least partially solidifies to form a casting. The step of cooling includes contacting a shell of solidifying metal around the molten metal with the solvent. An apparatus is also disclosed.
摘要翻译：公开了一种用于金属损失图案铸造的方法和装置。在该方法中，由材料形成图案，并且在图案的至少一部分周围形成模具。模具包括颗粒材料和粘合剂。模具从模具中取出，熔融金属被输送到模具中。模具与溶剂接触并且熔融金属被冷却，使得其至少部分地固化以形成铸件。冷却步骤包括使熔融金属周围的凝固金属壳与溶剂接触。还公开了一种装置。

45. 发明申请

US20050102871A1 Photoluminescent adhesive, signs using photoluminescent adhesives and method of making a photoluminescent adhesive 审中-公开
标题翻译：光致发光粘合剂，使用光致发光粘合剂的标志和制备光致发光粘合剂的方法
公开(公告)号：US20050102871A1
公开(公告)日：2005-05-19
申请号：US10987357
申请日：2004-11-12
申请人： Richard Merle , John Campbell , Robert Jessup
发明人： Richard Merle , John Campbell , Robert Jessup
IPC分类号： G09F13/20
CPC分类号： G09F13/20
摘要： The present invention is directed to signs which emit light in the dark after being exposed to ambient light by using photoluminescent adhesives. The sign comprises a clear acrylic substrate, a photoluminescent adhesive placed over the substrate and a protective layer over the photoluminescent adhesive.
摘要翻译：本发明涉及通过使用光致发光粘合剂在暴露于环境光之后在黑暗中发光的标志。标志包括透明的丙烯酸基材，放置在基材上的光致发光粘合剂和在光致发光粘合剂上的保护层。

46. 发明申请

US20050075463A1 Poly (arylene ether) composition and method 失效
标题翻译：聚（亚芳基醚）组合物和方法
公开(公告)号：US20050075463A1
公开(公告)日：2005-04-07
申请号：US10678459
申请日：2003-10-03
申请人： Kenneth Zarnoch , John Campbell , Glen Merfeld , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
发明人： Kenneth Zarnoch , John Campbell , Glen Merfeld , John Rude , Prameela Susarla , Michael Vallance , Gary Yeager
IPC分类号： C08F283/08 , C08F293/00 , C08F297/02 , C08G65/48 , C08L53/00 , C08L71/12
CPC分类号： C08G65/48 , C08F293/005 , C08F297/02 , C08F297/026 , C08G65/485 , C08L53/00
摘要： A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.
摘要翻译：可固化组合物包括官能化的聚（亚芳基醚），烯属不饱和单体，每100重量份官能化聚（亚芳基醚）和烯属不饱和单体的总量为约0.2至约5重量份的固化引发剂，以及官能化聚（亚芳基醚）和烯属不饱和单体总量相对于100重量份固化抑制剂为约0.005〜约1重量份。固化引发剂与固化抑制剂的重量比为约1.2:1至约50:1。该组合物在模制的早期阶段提供了改进的和可重复的流动，而不损害固化时间。该组合物可用于制备塑料封装的电子器件。

47. 发明申请

US20050049352A1 Solvent-modified resin compositions and methods of use thereof 审中-公开
标题翻译：溶剂改性树脂组合物及其使用方法
公开(公告)号：US20050049352A1
公开(公告)日：2005-03-03
申请号：US10737943
申请日：2003-12-16
申请人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
发明人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
IPC分类号： C08K9/06 , C08L63/00 , C09C1/30 , H01L21/56 , H01L23/29 , C08K3/34
CPC分类号： B82Y30/00 , C01P2004/64 , C08K9/06 , C08L63/00 , C09C1/3081 , H01L21/563 , H01L23/293 , H01L23/295 , H01L2224/73203 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/00
摘要： A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
摘要翻译：提供了用作底部填充材料的溶剂改性树脂组合物。所述组合物具有至少一种环氧树脂，至少一种溶剂和官能化胶体二氧化硅的填料。溶剂改性树脂组合物可用于制备透明的B阶树脂膜。本公开的实施例包括用作晶片级底部填充物，以及用于电子芯片的密封剂。

48. 发明申请

US20050029592A1 Method and structure for buried circuits and devices 失效
公开(公告)号：US20050029592A1
公开(公告)日：2005-02-10
申请号：US10832894
申请日：2004-04-27
申请人： John Campbell , William Devine , Kris Srikrishnan
发明人： John Campbell , William Devine , Kris Srikrishnan
IPC分类号： H01L21/02 , H01L21/3205 , H01L21/336 , H01L21/76 , H01L21/762 , H01L21/8234 , H01L21/8238 , H01L21/8242 , H01L21/84 , H01L23/52 , H01L27/06 , H01L27/08 , H01L27/088 , H01L27/092 , H01L27/108 , H01L27/118 , H01L27/12 , H01L29/786 , H01L31/0392
CPC分类号： H01L29/78648 , H01L21/743 , H01L21/76251 , H01L21/84 , H01L27/10832 , H01L27/10873 , H01L27/11803 , H01L27/1203 , H01L29/66772 , H01L29/78606 , H01L29/78612 , H01L2924/0002 , H01L2924/00
摘要： A method and structure for fabricating an electronic device using an SOI technique that results in formation of a buried oxide layer. The method includes fabricating at least one first component of the electronic device and fabricating at least one second component of the electronic device, wherein the first component and the second component are on opposite sides of the buried oxide layer, thereby causing the buried oxide layer to perform a function within the electronic device. Entire circuits can be designed around this technique.

49. 发明申请

US20050023705A1 Power grid layout techniques on integrated circuits 有权
标题翻译：集成电路电网布局技术
公开(公告)号：US20050023705A1
公开(公告)日：2005-02-03
申请号：US10631471
申请日：2003-07-30
申请人： John Campbell , Kim Stevens , Luigi DiGregorio
发明人： John Campbell , Kim Stevens , Luigi DiGregorio
IPC分类号： H01L21/3205 , H01L21/82 , H01L21/822 , H01L23/52 , H01L23/528 , H01L27/04 , H01L23/48 , G06F17/50 , H01L29/40
CPC分类号： H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： Techniques are provided for reducing power supply voltage drop introduced by routing conductive traces on an integrated circuit. Techniques for reducing variations in the power supply voltages received in different regions of an integrated circuit are also provided. Power supply voltages are routed within an integrated circuit across conductive traces. The conductive traces are coupled to bond pads that receive power supply voltages from an external source. Alternate ones of the traces receive a high power supply voltage VDD and a low power supply voltage VSS. The conductive traces reduce the voltage drop in the power supply voltages by providing shorter paths to route the power supply voltages to circuit elements on the integrated circuit.
摘要翻译：提供了用于减少通过在集成电路上布线导电迹线引入的电源电压降的技术。还提供了用于减少在集成电路的不同区域中接收的电源电压的变化的技术。电源电压在集成电路内跨导线。导电迹线耦合到从外部源接收电源电压的接合焊盘。迹线中的另一个接收高电源电压VDD和低电源电压VSS。导电迹线通过提供较短的路径将电源电压路由到集成电路上的电路元件来减小电源电压中的电压降。

50. 发明授权

US06836553B2 Key identification system 有权
标题翻译：钥匙识别系统
公开(公告)号：US06836553B2
公开(公告)日：2004-12-28
申请号：US09962131
申请日：2001-09-26
申请人： John Campbell , George Heredia , Michael A. Mueller
发明人： John Campbell , George Heredia , Michael A. Mueller
IPC分类号： G06K900
CPC分类号： G06K9/00 , B23C3/35 , B23C2235/41 , E05B19/0011 , G06K9/2036 , G06K9/48
摘要： A method and system for identifying a key blank corresponding to a master key is provided. The system includes a housing. A first source of uniform light is fixed relative to the housing. A second source of uniform light is fixed relative to the housing and is disposed opposite the first source of uniform light such that the master key is disposable therebetween. The first and second sources of uniform light are operable to generate an image of the master key. A receiver captures the image of the master key. A control having a memory configured to store information on a plurality of key blanks identifies the key blank corresponding to the master key based on the captured image.
摘要翻译：提供了一种用于识别对应于主密钥的密钥空白的方法和系统。该系统包括一个外壳。均匀光的第一来源相对于壳体是固定的。均匀光的第二来源相对于壳体固定，并且与第一光源相对设置，使得主密钥在其间是一次性的。第一和第二均匀光源可操作以产生主密钥的图像。接收器捕获主密钥的图像。具有被配置为在多个键空白上存储信息的存储器的控制器基于所捕获的图像来识别对应于主密钥的密钥空白。

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