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    • 46. 发明申请
    • Methods and Apparatus for SRAM Bit Cell with Low Standby Current, Low Supply Voltage and High Speed
    • 具有低待机电流,低电源电压和高速的SRAM位单元的方法和装置
    • US20110068400A1
    • 2011-03-24
    • US12748098
    • 2010-03-26
    • Ping-Wei WangChang-Ta YangYuh-Jier Mii
    • Ping-Wei WangChang-Ta YangYuh-Jier Mii
    • H01L27/12H01L29/78
    • G11C11/412H01L27/0207H01L27/105H01L27/11H01L27/1104H01L27/1116
    • Circuits and methods for providing an SRAM or CAM bit cell. In one embodiment, a bit cell portion with thicker gate oxides in the storage cell transistors, and thinner gate oxides in a read port section having transistors are disclosed. The use of the thick gate oxides in the storage cell transistors provides a stable storage of data and lower standby leakage current. The use of the thinner gate oxides in the read port transistors provides fast read accesses and allows a lower Vcc,min in the read port. The methods used to form the dual gate oxide thickness SRAM cells have process steps compatible with the existing semiconductor manufacturing processes. Embodiments using high k gate dielectrics, dual gate dielectric materials in a single bit cell, and using finFET and planar devices in a bit cell are described. Methods for forming the structures are disclosed.
    • 用于提供SRAM或CAM位单元的电路和方法。 在一个实施例中,公开了存储单元晶体管中具有较厚栅极氧化物的位单元部分,以及具有晶体管的读取端口部分中较薄的栅极氧化物。 在存储单元晶体管中使用厚栅极氧化物提供数据的稳定存储和较低待机漏电流。 在读端口晶体管中使用较薄的栅极氧化物提供快速的读取访问,并允许在读取端口中较低的Vcc,min。 用于形成双栅极氧化物厚度SRAM单元的方法具有与现有半导体制造工艺兼容的工艺步骤。 描述了在单个位单元中使用高k栅极电介质,双栅介质材料以及在位单元中使用finFET和平面器件的实施例。 公开了形成结构的方法。