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41. 发明申请

US20150108202A1 Automatic Soldering System 审中-公开
标题翻译：自动焊接系统
公开(公告)号：US20150108202A1
公开(公告)日：2015-04-23
申请号：US14519945
申请日：2014-10-21
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD., , SHENZHEN AMI TECHNOLOGY CO. LTD.
发明人： Yingcong Deng , Dandan Zhang , Lvhai Hu , Qinglong Zeng
IPC分类号： B23K3/08 , B23K37/04 , B23K3/02
CPC分类号： B23K1/0016 , B23K2101/38
摘要： A program controlled automatic soldering system is disclosed having a vision system, a first manipulator, and a second manipulator. The first manipulator is controlled by the vision system, and has a first gripper. The second manipulator is controlled by the vision system, and has a heater.
摘要翻译：公开了一种具有视觉系统，第一操纵器和第二操纵器的程序控制的自动焊接系统。第一个操纵器由视觉系统控制，并具有第一个夹具。第二个操纵器由视觉系统控制，并具有一个加热器。

42. 发明申请

US20200015359A1 Carrier 审中-公开
公开(公告)号：US20200015359A1
公开(公告)日：2020-01-09
申请号：US16571541
申请日：2019-09-16
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
IPC分类号： H05K3/30 , H05K7/10
摘要： A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

43. 发明授权

US11064614B2 Carrier 有权
公开(公告)号：US11064614B2
公开(公告)日：2021-07-13
申请号：US16571541
申请日：2019-09-16
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
IPC分类号： H05K1/00 , H05K3/32 , H05K7/10 , H05K13/02 , G01R1/02 , G01R1/04 , H05K3/30
摘要： A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

44. 发明授权

US09317023B2 Wire sorting machine and method of sorting wires 有权
标题翻译：电线分拣机及电线分拣方法
公开(公告)号：US09317023B2
公开(公告)日：2016-04-19
申请号：US13833404
申请日：2013-03-15
申请人： Tyco Electronics Corporation , Shenzhen AMI Technology Co. Ltd.
发明人： Roberto Francisco-Yi Lu , Qinglong Zeng , Charles David Fry , Bicheng Chen
IPC分类号： G05B15/02 , H01R43/28
CPC分类号： G05B15/02 , H01R43/28
摘要： A wire sorting machine includes a frame and a fixture held by the frame. The fixture is configured to support a cable having a plurality of wires. A positioning system is supported by the frame. A guidance system is supported by the positioning system. The guidance system has a camera viewing the fixture that is movable relative to the fixture. A wire manipulator is supported by the positioning system and is moved by the positioning system relative to the fixture. The wire manipulator is configured to engage the wires of the cable to position the wires relative to the fixture. A controller communicates with the positioning system and the guidance system. The controller operates the positing system to control a position of the wire manipulator relative to the fixture based on an image obtained by the camera.
摘要翻译：线分选机包括框架和由框架固定的固定件。固定装置构造成支撑具有多条电线的电缆。定位系统由框架支撑。定位系统支持引导系统。引导系统具有观察可相对于固定装置移动的夹具的相机。线控制器由定位系统支撑并且被定位系统相对于固定装置移动。电线操纵器被配置为接合电缆的电线以相对于固定装置定位电线。控制器与定位系统和引导系统通信。控制器基于由相机获得的图像操作定位系统以控制线操纵器相对于固定装置的位置。

45. 发明授权

US09962728B2 Fluid dispensing machine and method of dispensing fluid 有权
公开(公告)号：US09962728B2
公开(公告)日：2018-05-08
申请号：US13833645
申请日：2013-03-15
申请人： Tyco Electronics Corporation , Shenzhen AMI Technology Co., Ltd.
发明人： Roberto Francisco-Yi Lu , Qinglong Zeng , Charles David Fry , Bicheng Chen
IPC分类号： B05C9/10 , B05D1/00 , H05K3/34 , H05K13/04 , B05C5/02 , B05C11/10 , B05B12/12
CPC分类号： B05C9/10 , B05B12/122 , B05C5/0216 , B05C11/1021 , B05D1/00 , H05K3/3484 , H05K13/0469 , H05K2203/0126 , H05K2203/163
摘要： A fluid dispensing machine includes a frame and a fixture held by the frame. The fixture is configured to support a substrate. A positioning system is supported by the frame. A guidance system is supported by the positioning system. The guidance system has a camera viewing the fixture that is movable relative to the fixture. A fluid dispenser is supported by the positioning system and is moved by the positioning system relative to the fixture. The fluid dispenser is configured to dispense fluid onto the substrate. A controller communicates with the positioning system and the guidance system. The controller operates the positing system to control a position of the fluid dispenser relative to the fixture based on an image obtained by the camera.

46. 发明授权

US09787046B2 Wire sorting fixture and method of sorting wires 有权
公开(公告)号：US09787046B2
公开(公告)日：2017-10-10
申请号：US13834439
申请日：2013-03-15
申请人： Tyco Electronics Corporation , Shenzhen AMI Technology Co., Ltd.
发明人： Roberto Francisco-Yi Lu , Qinglong Zeng , Charles David Fry , Bicheng Chen
IPC分类号： H05K1/00 , H01R43/28 , H01R43/02 , H01R4/02
CPC分类号： H01R43/28 , H01R4/027 , H01R43/0263 , Y10T29/49998
摘要： A wire sorting fixture includes a cable support configured to support a multi-wire cable and a wire support configured to support wires of the cable. The wire support has a top surface. The wire support has cradles open at the top surface. The wire support has separating walls between corresponding cradles. A top plate is positioned above the wire support. The top plate is moved toward the wire support to a clamping position after the wires are positioned in the corresponding cradles. The top plate holds the wires between the top plate and the wire support in the clamping position.

47. 发明申请

US20160074909A1 Mechanism and Method For Sorting Components, Component Feeding System 有权
标题翻译：组件供料系统分选机构及方法
公开(公告)号：US20160074909A1
公开(公告)日：2016-03-17
申请号：US14950475
申请日：2015-11-24
申请人： Tyco Electronics (Shanghai) Co. Ltd. , Shenzhen Shengli Jingji Tech Co., Ltd. , Tyco Electronics Corporation
发明人： Dandan Zhang , Roberto Francisco-Yi Lu , Qinglong Zeng
IPC分类号： B07B1/28 , B25J11/00
CPC分类号： B07B1/28 , B07B13/003 , B07B13/04 , B07B13/10 , B25J11/00
摘要： A component sorting mechanism is disclosed. The component sorting mechanism includes a vibrating plate, a feeding tray having a plurality of grooves in an inner bottom surface thereof, the feeding tray mounted on the vibrating plate, and a first driving device connected to the feeding tray. The first driving device drives the feeding tray to swing within a predetermined angle range.
摘要翻译：公开了一种部件分选机构。部件分选机构包括振动板，在其内底面具有多个槽的进给盘，安装在振动板上的进给盘以及连接到进给盘的第一驱动装置。第一驱动装置驱动进给托盘在预定角度范围内摆动。

48. 发明授权

US11351622B2 Laser soldering system 有权
公开(公告)号：US11351622B2
公开(公告)日：2022-06-07
申请号：US15234091
申请日：2016-08-11
申请人： Tyco Electronics (Shanghai) Co. Ltd. , Tyco Electronics Corporation , Tyco Electronics (Dongguan) Ltd
发明人： Hongzhou Shen , Dandan Zhang , Roberto Francisco-Yi Lu , George J. Dubniczki , Qinglong Zeng
IPC分类号： B23K1/005 , B23K26/08 , B23K20/00 , B23K26/00 , H05K3/34 , B23K3/08 , B23K101/32 , B23K101/42
摘要： A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

49. 发明申请

US20160346858A1 Laser Soldering System 审中-公开
标题翻译：激光焊接系统
公开(公告)号：US20160346858A1
公开(公告)日：2016-12-01
申请号：US15234091
申请日：2016-08-11
申请人： Tyco Electronics (Shanghai) Co. Ltd. , Tyco Electronics Corporation , Tyco Electronics (Dongguan) Ltd
发明人： Hongzhou Shen , Dandan Zhang , Roberto Francisco-yi Lu , George J. Dubniczki , Qinglong Zeng
IPC分类号： B23K1/005 , B23K3/08
CPC分类号： B23K1/0056 , B23K3/087 , B23K20/004 , B23K26/009 , B23K26/0884 , B23K2101/32 , B23K2101/42 , H01L2224/78 , H05K3/3421 , H05K3/3489 , H05K3/3494 , H05K2201/10287 , H05K2203/107
摘要： A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.
摘要翻译：公开了一种激光焊接系统。激光焊接系统具有移动系统，安装在移动系统上的夹持器，安装在移动系统上并具有透明构件的压脚和激光器。夹具抓住一个物体，并将物体放置在要焊接的产品上的目标位置。透明构件将物体压靠在产品上。激光器通过透明构件发射激光束，以将物体焊接到目标位置，同时将物体压靠在产品上。

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