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41. 发明授权

US07125059B2 Hand device for working robot 有权
标题翻译：工作机器人手动装置
公开(公告)号：US07125059B2
公开(公告)日：2006-10-24
申请号：US10798952
申请日：2004-03-12
申请人： Toshio Miyamoto
发明人： Toshio Miyamoto
IPC分类号： B66C1/00
CPC分类号： B25J15/0206
摘要： A hand device for working robot which can be downsized is provided. The device consists of a robot hand 10, a link means 40 and a workpiece drop prevention means. The robot hand 10 includes a hand base 20, a pair of fingers 21, 21 protruding from the hand base 20 and a movable core 25 provided with a cylinder 24. The link means 40 includes a lever and a connecting pad 43 for connecting the lever and the movable core 25. A workpiece drop prevention means 60 includes a protrusion stick 50 which is supported by a supporting rail 51, a coil spring and an air cylinder for recess 53.
摘要翻译：提供了一种可以减小尺寸的工作机器人的手动装置。该装置由机械手10，连杆装置40和工件落下预防装置组成。机械手10包括手基座20，从手基座20突出的一对手指21,21和设置有气缸24的可动铁芯25。连杆装置40包括杠杆和连接杆43，用于连接杠杆和可动芯25。工件脱落装置60包括由支撑轨51支撑的突起杆50，螺旋弹簧和用于凹部53的气缸。

42. 发明授权

US06949416B2 Method of manufacturing a semiconductor integrated circuit device 失效
标题翻译：制造半导体集成电路器件的方法
公开(公告)号：US06949416B2
公开(公告)日：2005-09-27
申请号：US10765916
申请日：2004-01-29
申请人： Toshio Miyamoto , Ichiro Anjo , Asao Nishimura , Yoshihide Yamaguchi
发明人： Toshio Miyamoto , Ichiro Anjo , Asao Nishimura , Yoshihide Yamaguchi
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/82 , H01L21/822 , H01L21/8242 , H01L23/12 , H01L23/31 , H01L23/525 , H01L27/04 , H01L27/108 , H01L27/10
CPC分类号： H01L23/5258 , H01L23/3114 , H01L27/10814 , H01L27/10897 , H01L2224/0392 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/15311 , H01L2924/19041 , H01L2224/05644 , H01L2924/00014 , H01L2224/05147 , H01L2224/05171
摘要： Disclosed is a technique capable of enhancing the degree of freedom in the layout of a rerouting layer in a wafer level CSP in which defect repairing is performed by cutting a fuse. More specifically, after the defect repairing is performed by irradiating a laser beam to a fuse, an organic passivation layer (photo-sensitive polyimide layer) is filled in a fuse opening. Thereafter, a rerouting layer, a bump land, an uppermost wiring layer, and a solder bump are formed on the organic passivation layer. In the following steps of the defect repairing, the baking process to cure an elastomer layer and the uppermost protection layer is conducted at a temperature below 260° C. in order to prevent the variance of the refresh times of memory cells.
摘要翻译：公开了一种能够提高晶片级CSP中的重新布线层的布局自由度的技术，其中通过切割熔丝进行缺陷修复。更具体地，在通过将激光束照射到熔丝进行缺陷修复之后，将有机钝化层（光敏聚酰亚胺层）填充在保险丝开口中。此后，在有机钝化层上形成重路由层，凸起焊盘，最上布线层和焊料凸块。在缺陷修复的以下步骤中，在低于260℃的温度下进行固化弹性体层和最上层保护层的烘烤过程，以防止存储单元的更新时间的变化。

43. 发明授权

US06656829B2 Semiconductor integrated circuit device and manufacturing method of that 失效
公开(公告)号：US06656829B2
公开(公告)日：2003-12-02
申请号：US10331874
申请日：2002-12-31
申请人： Toshio Miyamoto
发明人： Toshio Miyamoto
IPC分类号： H01L2144
CPC分类号： H01L21/2885 , H01L21/288 , H01L21/76802 , H01L24/11 , H01L24/13 , H01L2224/02166 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/1357 , H01L2224/1369 , H01L2224/16105 , H01L2224/45124 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/3011 , H01L2224/13099 , H01L2924/00 , H01L2224/48
摘要： A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

44. 发明授权

US06611012B2 Semiconductor device 有权
公开(公告)号：US06611012B2
公开(公告)日：2003-08-26
申请号：US10050950
申请日：2002-01-22
申请人： Toshio Miyamoto , Asao Nishimura , Koki Noguchi , Satoshi Michishita , Masashi Horiguchi , Masaharu Kubo , Kazuyoshi Shiba
发明人： Toshio Miyamoto , Asao Nishimura , Koki Noguchi , Satoshi Michishita , Masashi Horiguchi , Masaharu Kubo , Kazuyoshi Shiba
IPC分类号： H01L25065
CPC分类号： H01L24/50 , H01L23/49572 , H01L23/49816 , H01L24/06 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L27/10897 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/16245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2225/1029 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12033 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

45. 发明授权

US06531768B2 Semiconductor integrated circuit device with optical wave guides 失效
标题翻译：具有光波导的半导体集成电路器件
公开(公告)号：US06531768B2
公开(公告)日：2003-03-11
申请号：US09951981
申请日：2001-09-14
申请人： Toshio Miyamoto
发明人： Toshio Miyamoto
IPC分类号： H01L2324
CPC分类号： H01L21/2885 , H01L21/288 , H01L21/76802 , H01L24/11 , H01L24/13 , H01L2224/02166 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/1357 , H01L2224/1369 , H01L2224/16105 , H01L2224/45124 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/3011 , H01L2224/13099 , H01L2924/00 , H01L2224/48
摘要： A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.
摘要翻译：在重排之前，将激光束照射到形成在电极部上的光固化树脂层上。通过扫描在重排之前从电极部分延伸到凸块电极接触区域的金属布线形成区域的周边上的树脂被固化。结果，形成了用作引导层的固化树脂部分和用于保护金属布线形成区域具有中空形状的金属线的保护膜。此后，金属线形成在固化树脂部分的内部。

46. 发明授权

US5202729A Developing apparatus having a coated developing roller 失效
标题翻译：具有涂布显影辊的显影装置
公开(公告)号：US5202729A
公开(公告)日：1993-04-13
申请号：US783184
申请日：1991-10-28
申请人： Toshio Miyamoto , Yasushi Sato , Akihiko Takeuchi , Hiroshi Sasame , Katsuhiko Nishimura , Hiroto Hasegawa , Hideyuki Yano , Tatsunori Ishiyama , Hideo Nanataki , Harumi Kugoh
发明人： Toshio Miyamoto , Yasushi Sato , Akihiko Takeuchi , Hiroshi Sasame , Katsuhiko Nishimura , Hiroto Hasegawa , Hideyuki Yano , Tatsunori Ishiyama , Hideo Nanataki , Harumi Kugoh
IPC分类号： G03G15/09
CPC分类号： G03G15/0942 , G03G15/0928
摘要： A developing apparatus having a container for containing a one component developer, and a rotatable developing roller disposed facing an image bearing member to carry developer from the container to a development zone where it is supplied to an electrostatic latent image carried on an image bearing member. The developing roller includes a metal base member and a resin coating layer thereon in which fine conductive particles are dispersed. The developing roller has a surface including an end region adjacent an end of the roller, and an intermediate region. In the end region, the base member is not roughened and the resin layer is not provided. In the intermediate region, inside the end region, the base member is roughened and is coated with the resin layer. A sealing member is provided for preventing leakage of the developer from the container at the end of the developing roller, the sealing member being faced to the end region of the developing roller.
摘要翻译：一种具有用于容纳单组分显影剂的容器的显影装置和面向图像承载部件设置以将显影剂从容器运送到显影区域的可旋转显影辊，在显影区域将其供应到承载在图像承载部件上的静电潜像。显影辊在其上分散有导电性微粒的金属基材和树脂被覆层。显影辊具有包括邻近辊的端部的端部区域和中间区域的表面。在端部区域中，基材不粗化，不设置树脂层。在中间区域中，在端部区域内部，基底部件被粗糙化并涂覆有树脂层。提供一种密封构件，用于防止显影剂在显影辊端部从容器泄漏，密封构件面向显影辊的端部区域。

47. 发明授权

US5185496A Electrostatic latent image device having a coating layer provided on a developer carrying member 失效
标题翻译：具有设置在显影剂承载构件上的涂层的静电潜像装置
公开(公告)号：US5185496A
公开(公告)日：1993-02-09
申请号：US664227
申请日：1991-03-04
申请人： Katsuhiko Nishimura , Keiji Okano , Toshio Miyamoto , Tatsunori Ishiyama
发明人： Katsuhiko Nishimura , Keiji Okano , Toshio Miyamoto , Tatsunori Ishiyama
IPC分类号： G03G15/09
CPC分类号： G03G15/0928
摘要： An electrostatic latent image developing apparatus includes a movable developer carrying member for carrying developer to a developing zone where an electrostatic latent image on an image bearing member is developed. There is an outer coating layer on the developer carrying member wherein the coating layer is of resin in which conductive fine particles are dispersed and which is abraded.
摘要翻译：静电潜像显影装置包括用于将显影剂携带到图像承载部件上的静电潜像被显影的显影区域的可移动显影剂承载部件。在显影剂承载构件上存在外涂层，其中涂层是树脂，其中导电细颗粒分散并被磨损。

48. 发明授权

US5120573A Process for producing metal/polyimide composite article 失效
标题翻译：生产金属/聚酰亚胺复合材料的方法
公开(公告)号：US5120573A
公开(公告)日：1992-06-09
申请号：US416280
申请日：1989-09-27
申请人： Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Yukio Ookoshi , Toshio Miyamoto , Mikio Aizawa , Kazumasa Igarashi , Amane Mochizuki
发明人： Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Yukio Ookoshi , Toshio Miyamoto , Mikio Aizawa , Kazumasa Igarashi , Amane Mochizuki
IPC分类号： C08G73/10 , H01B1/22 , H01B3/30 , H01L21/48 , H05K1/03
CPC分类号： H01B1/22 , C08G73/1007 , H01B3/306 , H01L21/481 , H05K1/0346 , H01L2224/16225
摘要： The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

49. 发明授权

US4043235A Back-splitting apparatus in the production of brochures 失效
标题翻译：分拆装置在生产小册子
公开(公告)号：US4043235A
公开(公告)日：1977-08-23
申请号：US718558
申请日：1976-08-30
申请人： Toshio Miyamoto
发明人： Toshio Miyamoto
IPC分类号： B42C5/00 , B26D3/12
CPC分类号： B42C5/00 , Y10S83/934 , Y10T83/0267 , Y10T83/4453 , Y10T83/446 , Y10T83/4539 , Y10T83/707
摘要： In the process of producing brochures such as account books, textbooks, notebooks and chits, a back-splitting operation which has hitherto been performed by hand is mechanically executed in such a way that a back-splitting cutter knife is attached to a turnable chain and that the cutter knife is thrust into the back portion of sheets of paper for the brochures, whereby the productivity of the process is enhanced and a sharp reduction in the cost thereof is achieved.
摘要翻译：在制作帐册，教科书，笔记本和小旅行的小册子的过程中，以手工执行的反向拆分操作机械地执行，使得分拆刀具被附接到可转动的链条上，切割刀被推入用于小册子的纸张的后部，由此提高了该工艺的生产率并且实现了其成本的大幅降低。

50. 发明授权

US4023512A Thread feeder for sewing machine 失效
标题翻译：缝纫机螺纹给料机
公开(公告)号：US4023512A
公开(公告)日：1977-05-17
申请号：US610057
申请日：1975-09-13
申请人： Toshio Miyamoto
发明人： Toshio Miyamoto
IPC分类号： D05B53/00 , B65H51/16 , D05B87/00 , D05B87/02 , D05C11/00 , D05C11/16 , D05B49/00
CPC分类号： D05B87/00 , D05C11/16 , D05D2207/04
摘要： A thread feeder for sewing machines is disclosed which feeds the thread from one of the bobbins to an automatic threading machine. It includes a movable table over the sewing machine, bobbins mounted thereon, thread tension regulators for adjusting tension to the thread from the bobbin, and feed rollers for feeding the thread from the thread tension regulator to the automatic threading device on a sewing machine. By such an arrangement, threads of different color or material can be fed conveniently one after another in a desired order.
摘要翻译：公开了一种用于缝纫机的螺纹进给器，其将线从一个线轴馈送到自动穿线机。它包括在缝纫机上的可移动的桌子，安装在其上的线轴，用于调节从线轴的线张力的线张力调节器，以及用于将线从线张力调节器馈送到缝纫机上的自动穿线装置的进给辊。通过这样的布置，可以以期望的顺序一个接一个地方便地进给不同颜色或材料的丝线。

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