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41. 发明授权

US08552418B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08552418B2
公开(公告)日：2013-10-08
申请号：US13157338
申请日：2011-06-10
申请人： Eiji Sugiyama , Yoshitaka Dozen , Hisashi Ohtani , Takuya Tsurume
发明人： Eiji Sugiyama , Yoshitaka Dozen , Hisashi Ohtani , Takuya Tsurume
IPC分类号： H01L35/24
CPC分类号： H01L27/1266 , H01L23/145 , H01L23/49855 , H01L27/105 , H01L27/115 , H01L27/1248 , H01L27/13 , H01L29/78603 , H01L2223/6677 , H01L2224/16225 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01Q1/2225 , H01Q1/2283 , H01L2924/00
摘要： The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a method for manufacturing a highly-reliable semiconductor device, which is not destructed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element layer having a semiconductor element formed using a non-single crystal semiconductor layer, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element layer and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are firmly fixed together.
摘要翻译：本发明提供一种不容易被外部局部压力损坏的半导体器件。本发明还提供一种以高产率制造不被外部局部压力破坏的高可靠性半导体器件的方法。在具有使用非单晶半导体层形成的半导体元件的元件层上设置有机化合物或无机化合物的高强度纤维被有机树脂浸渍的结构体，加热和压接由此制造半导体器件，将有机化合物或无机化合物的高强度纤维与有机树脂浸渍的元件层和结构体牢固地固定在一起。

42. 发明授权

US08530335B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08530335B2
公开(公告)日：2013-09-10
申请号：US13071629
申请日：2011-03-25
申请人： Tomoko Tamura , Eiji Sugiyama , Yoshitaka Dozen , Koji Dairiki , Takuya Tsurume
发明人： Tomoko Tamura , Eiji Sugiyama , Yoshitaka Dozen , Koji Dairiki , Takuya Tsurume
IPC分类号： H01L21/30 , H01L21/46 , H01L21/302 , H01L21/461 , H01L23/58
CPC分类号： H01L21/02381 , H01L21/84 , H01L27/1214 , H01L27/1266 , H01L27/13 , H01L2221/68359 , H01L2221/68368 , H01L2224/81001
摘要： A release layer formed over a substrate; at least one of thin film integrated circuits is formed over the release layer; a film is formed over each of the at least one of thin film integrated circuits; and the release layer is removed by using an etchant; thus, the at least one of thin film integrated circuits is peeled from the substrate. A semiconductor device is formed by sealing the peeled thin film integrated circuit by lamination or the like.
摘要翻译：形成在衬底上的释放层; 在剥离层上形成薄膜集成电路中的至少一个; 在薄膜集成电路中的至少一个上形成膜; 并通过使用蚀刻剂除去释放层; 因此，薄膜集成电路中的至少一个从基板剥离。半导体器件通过层压等密封剥离的薄膜集成电路而形成。

43. 发明授权

US08436354B2 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device 有权
公开(公告)号：US08436354B2
公开(公告)日：2013-05-07
申请号：US13232011
申请日：2011-09-14
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L29/04 , H01L31/20 , H01L21/331 , H01L21/336
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.

44. 发明申请

US20120326143A1 Light-Emitting Device and Manufacturing Method of the Light-Emitting Device 有权
标题翻译：发光装置及发光装置的制造方法
公开(公告)号：US20120326143A1
公开(公告)日：2012-12-27
申请号：US13530392
申请日：2012-06-22
申请人： Takuya Tsurume , Hideomi Suzawa , Shunpei Yamazaki
发明人： Takuya Tsurume , Hideomi Suzawa , Shunpei Yamazaki
IPC分类号： H01L33/40 , H01L29/12
CPC分类号： H01L27/3246 , H01L27/1225 , H01L27/3262 , H01L51/5237 , H01L51/5259
摘要： A light-emitting device in which reduction in performance due to moisture is suppressed is provided. The light-emitting device has a structure in which a partition having a porous structure surrounds each of light-emitting elements. The partition having a porous structure physically adsorbs moisture; therefore, in the light-emitting device, the partition functions as a hygroscopic film at a portion extremely close to the light-emitting element, so that moisture or water vapor remaining in the light-emitting device or entering from the outside can be effectively adsorbed. Thus, reduction in performance of the light-emitting device due to moisture or water vapor can be effectively suppressed.
摘要翻译：提供抑制湿气性能下降的发光装置。发光装置具有其中具有多孔结构的分隔件围绕每个发光元件的结构。具有多孔结构的分隔物物理吸附水分; 因此，在发光装置中，隔板在与发光元件非常接近的部分处起吸湿性的作用，从而能够有效地吸附残留在发光元件中或从外部进入的水分或水蒸汽。因此，可以有效地抑制由于水分或水蒸气导致的发光装置的性能的降低。

45. 发明申请

US20120256227A1 Light Emitting Device and Method for Manufacturing Thereof 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20120256227A1
公开(公告)日：2012-10-11
申请号：US13439298
申请日：2012-04-04
申请人： Takuya Tsurume , Hisao Ikeda
发明人： Takuya Tsurume , Hisao Ikeda
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： H01L51/5228 , H01L2251/5315
摘要： A conductive layer serving as an auxiliary wiring is formed under a first electrode with a first insulating layer interposed therebetween, and the conductive layer and a second electrode are electrically connected to each other through an opening in the first insulating layer and the first electrode. A second insulating layer is formed over a sidewall of the opening so that the first electrode is not directly in contact with the second electrode in the opening. An EL layer is formed by evaporation in a state where a deposition target substrate is inclined to an evaporation source, so that the second insulating layer serves as an obstacle and a region where the EL layer is not formed by the evaporation and the conductive layer is exposed is formed in part of the opening in a self-aligned manner.
摘要翻译：用作辅助布线的导电层形成在第一电极之下，其间介于第一绝缘层之间，并且导电层和第二电极通过第一绝缘层和第一电极中的开口彼此电连接。在开口的侧壁上形成第二绝缘层，使得第一电极不直接与开口中的第二电极接触。在沉积靶基板倾斜于蒸发源的状态下通过蒸发形成EL层，从而第二绝缘层用作障碍物，并且通过蒸发不形成EL层并且导电层为以自对准的方式暴露在开口的一部分中。

46. 发明授权

US08123896B2 Laminating system 有权
标题翻译：复合系统
公开(公告)号：US08123896B2
公开(公告)日：2012-02-28
申请号：US11596582
申请日：2005-05-31
申请人： Ryosuke Watanabe , Hidekazu Takahashi , Takuya Tsurume
发明人： Ryosuke Watanabe , Hidekazu Takahashi , Takuya Tsurume
IPC分类号： B29C65/22 , B29C65/56 , B32B37/06 , B32B37/10 , B32B37/14 , B30B15/34 , B32B37/04 , B32B37/18 , B30B5/02
CPC分类号： H01L21/56 , B32B37/20 , B32B2305/342 , B42D25/45 , B42D2033/46 , G06K19/07718 , G06K19/07749 , G06K19/0775 , H01L21/67126 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L27/1214 , H01L27/1266 , H01L2221/68318 , H01L2221/68354 , H01L2221/68363 , H01L2924/0002 , Y10T156/1089 , Y10T156/1093 , Y10T156/1712 , H01L2924/00
摘要： It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.
摘要翻译：本发明的目的是提高密封薄膜集成电路的生产效率并防止损坏和断裂。此外，本发明的另一个目的是防止薄膜集成电路在运输中受损，并且使得更容易处理薄膜集成电路。本发明提供了一种层压系统，其中辊子用于供应用于密封的基板，接收IC芯片，分离和密封。通过旋转辊可以连续地进行多个薄膜集成电路的分离，密封和接收; 从而可以极大地提高生产效率。此外，由于使用了彼此相对的一对辊，所以能够容易地密封薄膜集成电路。

47. 发明授权

US08030178B2 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device 有权
标题翻译：具有功能的层，具有该层的柔性基板的形成方法以及半导体装置的制造方法
公开(公告)号：US08030178B2
公开(公告)日：2011-10-04
申请号：US12618956
申请日：2009-11-16
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L21/46 , H01L21/469 , H01L21/31 , H01L21/84 , H01L21/205 , H01L21/331 , H01L21/336
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

48. 发明授权

US07928554B2 IC chip, antenna, and manufacturing method of the IC chip and the antenna 有权
标题翻译： IC芯片，天线以及IC芯片和天线的制造方法
公开(公告)号：US07928554B2
公开(公告)日：2011-04-19
申请号：US11667072
申请日：2005-11-04
申请人： Naoto Kusumoto , Takuya Tsurume
发明人： Naoto Kusumoto , Takuya Tsurume
IPC分类号： H01L23/48
CPC分类号： H01Q1/2208 , G06K19/07749 , H01L23/49855 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/76155 , H01L2224/82102 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01Q7/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00
摘要： An antenna used for an ID chip or the like is disclosed with planarized antenna unevenness and an IC chip having such the antenna with a flat surface is disclosed. Manufacturing an integrated circuit mounted with an antenna is facilitated. A laminated body formed by stacking a conductive film 11, a resin film 13, an integrated circuit 12, and a resin film 14 are rolled so that the resin film 14 is outside. Then, the laminated body is integrated in a roll form by softening the resin films 13, 14 by applying heat. By slicing the rolled laminated body along with the direction in which the rolled conductive film 31 appears in the cross section, an IC chip with antenna formed by the rolled conductive film 11 is formed.
摘要翻译：公开了用于ID芯片等的天线，其具有平坦化的天线不均匀性，并且公开了具有平坦表面的天线的IC芯片。制造安装有天线的集成电路变得容易。通过层叠导电膜11，树脂膜13，集成电路12和树脂膜14而形成的层叠体被卷成树脂膜14的外侧。然后，通过施加热量使树脂膜13,14软化，将层叠体整合成卷状。通过将轧制的层压体与轧制导电膜31在横截面中出现的方向切片，形成由卷绕的导电膜11形成的具有天线的IC芯片。

49. 发明授权

US07820495B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07820495B2
公开(公告)日：2010-10-26
申请号：US11448053
申请日：2006-06-07
申请人： Koji Dairiki , Naoto Kusumoto , Takuya Tsurume
发明人： Koji Dairiki , Naoto Kusumoto , Takuya Tsurume
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： H01L27/1266 , H01L27/1285 , H01L27/1292
摘要： An object is to provide a method for manufacturing a semiconductor device which suppresses an influence on a semiconductor element due to entry of an impurity element, moisture, or the like from outside even in the case of thinning or removing a substrate after forming a semiconductor element over the substrate. A feature is to form an insulating film functioning as a protective film on at least one side of the substrate by performing surface treatment on the substrate, to form a semiconductor element such as a thin film transistor over the insulating film, and to thin the substrate. As the surface treatment, addition of an impurity element or plasma treatment is performed on the substrate. As a means for thinning the substrate, the substrate can be partially removed by performing grinding treatment, polishing treatment, or the like on the other side of the substrate.
摘要翻译：本发明的目的是提供一种用于制造半导体器件的方法，其中，即使在形成半导体元件之后减薄或去除衬底的情况下，也可以抑制由于杂质元素，水分等的进入而对半导体元件的影响在基板上。特征在于，在基板的至少一面上形成作为保护膜的绝缘膜，在基板上进行表面处理，在绝缘膜上形成薄膜晶体管等半导体元件，并使基板。作为表面处理，在基板上进行杂质元素或等离子体处理的添加。作为使基板变薄的方法，可以在基板的另一侧进行研磨处理，研磨处理等来部分除去基板。

50. 发明申请

US20100062569A1 LAYER HAVING FUNCTIONALITY, METHOD FOR FORMING FLEXIBLE SUBSTRATE HAVING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：具有功能的层，用于形成具有该功能的柔性基板的方法以及制造半导体器件的方法
公开(公告)号：US20100062569A1
公开(公告)日：2010-03-11
申请号：US12618956
申请日：2009-11-16
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L21/60 , C09D5/20 , B05D5/10
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

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