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41. 外观设计

USD298256S Toner cartridge 失效
公开(公告)号：USD298256S
公开(公告)日：1988-10-25
申请号：US822096
申请日：1986-01-24
申请人： Kiyoshi Shibata
设计人： Kiyoshi Shibata

42. 发明授权

US4533233A Electrostatic copying apparatus 失效
标题翻译：静电复印机
公开(公告)号：US4533233A
公开(公告)日：1985-08-06
申请号：US485082
申请日：1983-04-14
申请人： Hiroshi Kimura , Masahiko Hisajima , Kiyoshi Shibata , Yoichiro Irie , Kiyoshi Morimoto , Takashi Nagashima , Yasuhiko Yoshikawa , Kiyonori Yamamoto , Masahiro Watashi , Shinsuke Yoshinaga , Toshihiko Yamamoto
发明人： Hiroshi Kimura , Masahiko Hisajima , Kiyoshi Shibata , Yoichiro Irie , Kiyoshi Morimoto , Takashi Nagashima , Yasuhiko Yoshikawa , Kiyonori Yamamoto , Masahiro Watashi , Shinsuke Yoshinaga , Toshihiko Yamamoto
IPC分类号： G03B27/34 , G03B27/50 , G03B27/52 , G03G15/04 , G03G15/041 , G03G15/28
CPC分类号： G03G15/041 , G03B27/527 , G03G15/28
摘要： A variable magnification electrostatic copying apparatus comprising a transparent plate on which to place a document to be copied, an optical system for projecting the image of the document onto an electrostatographic photosensitive member at any desired projecting ratio selected from a plurality of projecting ratios in an exposure zone located along the moving path of the photosensitive member, and a driving means for moving at least a part of the optical system and the transparent plate relative to each other. The optical system includes at least one position-variable optical element assembly adapted to be held at any of a plurality of positions corresponding to the aforesaid plurality of projecting ratios. The variable magnification electrostatic copying apparatus includes a unique improved means for varying the projecting ratio of the optical system by moving the position-variable optical element assembly.
摘要翻译：一种可变放大型静电复印设备，包括在其上放置要复印的文件的透明板，用于以曝光中的多个投影比率选择的任何期望的投影比率将文件的图像投影到静电感光元件上的光学系统区域，以及用于相对于彼此移动光学系统和透明板的至少一部分的驱动装置。光学系统包括至少一个位置可变的光学元件组件，其适于保持在对应于上述多个突出比例的多个位置中的任一位置。可变倍率静电复印装置包括通过移动位置可变光学元件组件来改变光学系统的投影比率的独特的改进装置。

43. 发明授权

US4395112A Latent electrostatic image developing device 失效
标题翻译：潜在静电图像显影装置
公开(公告)号：US4395112A
公开(公告)日：1983-07-26
申请号：US300525
申请日：1981-09-09
申请人： Nobuhiro Miyakawa , Kiyoshi Shibata , Toshio Watanabe , Yosuke Ohata
发明人： Nobuhiro Miyakawa , Kiyoshi Shibata , Toshio Watanabe , Yosuke Ohata
IPC分类号： G03G15/00 , G03G15/06 , G03G15/09
CPC分类号： G03G15/065
摘要： A latent electrostatic image developing device for developing a latent electrostatic image formed on an image-bearing member by applying a developer thereto. The developing device comprises a developer applicator means for holding the developer on its surface, carrying the developer to a developing zone and applying it to the latent electrostatic image in the developing zone and a bias voltage applying means for applying a bias voltage to the developer held on the surface of the developer applicator means. The developing device further includes a detector means for detecting the relative humidity of the environmental atmosphere and a control means for changing the magnitude of the applied bias voltage to a lower value when the detected relative humidity of the atmosphere exceeds a predetermined value.
摘要翻译：一种静电潜像显影装置，用于通过将显影剂施加到图像承载部件上来形成静电潜像。显影装置包括用于将显影剂保持在其表面上的显影剂施加装置，将显影剂携带到显影区域并将其施加到显影区域中的静电潜像;以及偏置电压施加装置，用于向显影剂施加偏置电压在显影剂施加装置的表面上。显影装置还包括用于检测环境气氛的相对湿度的检测器装置和当所检测的大气相对湿度超过预定值时将所施加的偏置电压的大小改变为较低值的控制装置。

44. 发明授权

US4147426A Electrostatic photographic copying machine 失效
标题翻译：静电复印机
公开(公告)号：US4147426A
公开(公告)日：1979-04-03
申请号：US802530
申请日：1977-06-01
申请人： Hideo Miyoshi , Kiyoshi Shibata , Shogo Fukuoka , Tatsuo Aizawa
发明人： Hideo Miyoshi , Kiyoshi Shibata , Shogo Fukuoka , Tatsuo Aizawa
IPC分类号： G03G15/30 , G03G15/22
CPC分类号： G03G15/30
摘要： An electrostatic photographic copying machine includes a photosensitive body having a photosensitive layer on its surface, a charging apparatus, a developing device and a transfer device arranged along a moving passage of the photosensitive body. An optical system projects an image of an original onto the surface of the charged photosensitive body, and a fixation apparatus fixes a transferred image onto copying paper. The electrostatic photographic copying machine is provided with an original paper inserting port, an original paper carrying passage, a first original paper discharging port for discharging the original paper in a forward direction, a second original paper discharging port for discharging the original paper in a rearward direction, a copying paper supplying apparatus, copying paper carrying passages, a first copying paper discharging port for discharging the copying paper in a forward direction, a second copying paper discharging port for discharging the copying paper in a rearward direction, and changing mechanism for changing the directions of movement of the original paper and the copying paper to the forward and rearward directions thereof, respectively.
摘要翻译：静电复印机包括其表面上具有感光层的感光体，充电装置，显影装置和沿着感光体的移动通道布置的转印装置。光学系统将原稿的图像投影到带电感光体的表面上，并且固定装置将转印的图像固定在复印纸上。静电复印机设置有原纸插入口，原纸输送通道，用于向前方排出原稿的第一原纸排出口，用于将原纸向后排出的第二原纸排出口方向，复印纸供给装置，复印纸携带通道，用于向前方排出复印纸的第一复印纸排出口，向后方排出复印纸的第二复印纸排出口，以及用于改变原纸和复印纸分别向前后方向移动的方向。

45. 发明授权

US09211584B2 Water jacket core 有权
标题翻译：水套芯
公开(公告)号：US09211584B2
公开(公告)日：2015-12-15
申请号：US14381343
申请日：2012-02-22
申请人： Kiyoshi Shibata , Hideaki Yokoyama , Koichi Sato
发明人： Kiyoshi Shibata , Hideaki Yokoyama , Koichi Sato
IPC分类号： B22C9/10 , B22C9/24 , B22C21/14
CPC分类号： B22C9/103 , B22C9/10 , B22C9/24 , B22C21/14
摘要： A water jacket core (10) includes a base part (11) and is provided with an intermediate female thread part (15) in that base within a region surrounded by tangent lines (18, 19) that are parallel to a center line (17) passing through the centers of a plurality of bore pin insertion bores (12) for forming cylinder bores and are in contact with the bore pin insertion bores and by an intermediate position for the adjacent bore pin insertion bores.
摘要翻译：水套芯（10）包括基部（11），并且在由与中心线（17）平行的切线（18,19）包围的区域内的该基座中设有中间阴螺纹部分（15））通过多个钻孔插入孔（12）的中心，用于形成缸孔，并与孔销插入孔和相邻孔销插入孔的中间位置接触。

46. 发明授权

US08440915B2 Device mounting board and semiconductor module 失效
标题翻译：器件安装板和半导体模块
公开(公告)号：US08440915B2
公开(公告)日：2013-05-14
申请号：US12915852
申请日：2010-10-29
申请人： Masayuki Nagamatsu , Kiyoshi Shibata , Takanori Hayashi
发明人： Masayuki Nagamatsu , Kiyoshi Shibata , Takanori Hayashi
IPC分类号： H05K1/11
CPC分类号： H05K3/3452 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/105 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01028 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H05K1/111 , H05K3/3436 , H05K3/368 , H05K2201/0367 , H05K2201/10515 , H05K2201/10734 , H05K2203/0588 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface.
摘要翻译：半导体器件具有PoP结构，使得设置在构成第一半导体模块的第一器件安装板上的第一电极部分和设置在第二半导体器件中的第二电极部分通过焊球接合在一起。具有开口的第一绝缘层设置在作为基板的绝缘树脂层的一个主表面上，并且其顶部突出于第一绝缘层的顶表面上方的电极部分形成在开口中。在第一电极部分的顶部周边的第一绝缘层的顶部上设置第二绝缘层; 第二绝缘层位于与第一电极部分的顶部稍微分开的位置。第一电极部分被成形为使得顶部由弯曲表面形成或由曲面形成并且平坦表面平滑地连接到弯曲表面。

47. 发明授权

US08338946B2 Semiconductor module, method of manufacturing semiconductor module, and mobile device 有权
标题翻译：半导体模块，制造半导体模块的方法和移动设备
公开(公告)号：US08338946B2
公开(公告)日：2012-12-25
申请号：US12961171
申请日：2010-12-06
申请人： Yasuyuki Yanase , Yoshio Okayama , Kiyoshi Shibata , Yasunori Inoue , Hideki Mizuhara , Ryosuke Usui , Tetsuya Yamamoto , Masurao Yoshii
发明人： Yasuyuki Yanase , Yoshio Okayama , Kiyoshi Shibata , Yasunori Inoue , Hideki Mizuhara , Ryosuke Usui , Tetsuya Yamamoto , Masurao Yoshii
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L24/11 , H01L23/3114 , H01L23/525 , H01L24/94 , H01L2221/6834 , H01L2221/68359 , H01L2224/0231 , H01L2224/02319 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05647 , H01L2224/1132 , H01L2224/114 , H01L2224/116 , H01L2224/131 , H01L2224/13147 , H01L2224/274 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01059 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要： An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.
摘要翻译：在半导体模块中的半导体衬底的安装表面（特别是其外周）上形成用于半导体器件的电极。为了确保电极之间的大间隙，在电极上形成绝缘层。还形成有穿过绝缘层并连接到电极的多个凸块，以及与凸块一体形成的重新布线图案。重新布线图案包括凸起区域和与凸起区域相邻延伸的布线区域。绝缘层形成为具有在凸起之间的间隔中的凹的上表面，并且重新布线图案的布线区域形成为适合该上表面。重布线图案的布线区域相对于重新布线图案的凸起区域形成为朝向半导体基板压下。

48. 发明申请

US20110174527A1 ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：元件安装板，半导体模块，半导体器件，用于制造元件安装板的方法，以及制造半导体器件的方法
公开(公告)号：US20110174527A1
公开(公告)日：2011-07-21
申请号：US13002189
申请日：2009-06-30
申请人： Masayuki Nagamatsu , Ryosuke Usui , Kiyoshi Shibata
发明人： Masayuki Nagamatsu , Ryosuke Usui , Kiyoshi Shibata
IPC分类号： H05K1/11 , H01L23/488 , H05K3/34 , H01L21/58 , H05K3/10
CPC分类号： H05K1/112 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L27/14618 , H01L2224/05644 , H01L2224/13099 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2225/06568 , H01L2225/1058 , H01L2924/014 , H01L2924/12043 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H05K3/3436 , H05K3/3452 , H05K2201/09436 , H05K2201/09563 , H05K2201/10734 , Y10T29/4916 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having the same thickness as that of a wiring layer provided in an insulating layer, a second conductor formed on the first conductor, a gold plating layer provided on the second conductor.
摘要翻译：半导体器件具有PoP结构，使得设置在第一半导体模块中的第一电极部分和设置在第二半导体模块中的第二电极部分通过焊球接合在一起。第一电极具有与设置在绝缘层中的布线层相同厚度的第一导体，形成在第一导体上的第二导体，设置在第二导体上的镀金层。

49. 发明申请

US20110100696A1 DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE 失效
标题翻译：器件安装板和半导体模块
公开(公告)号：US20110100696A1
公开(公告)日：2011-05-05
申请号：US12915852
申请日：2010-10-29
申请人： Masayuki NAGAMATSU , Kiyoshi Shibata , Takanori Hayashi
发明人： Masayuki NAGAMATSU , Kiyoshi Shibata , Takanori Hayashi
IPC分类号： H05K1/11
CPC分类号： H05K3/3452 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/105 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01028 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H05K1/111 , H05K3/3436 , H05K3/368 , H05K2201/0367 , H05K2201/10515 , H05K2201/10734 , H05K2203/0588 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface.
摘要翻译：半导体器件具有PoP结构，使得设置在构成第一半导体模块的第一器件安装板上的第一电极部分和设置在第二半导体器件中的第二电极部分通过焊球接合在一起。具有开口的第一绝缘层设置在作为基板的绝缘树脂层的一个主表面上，并且其顶部突出于第一绝缘层的顶表面上方的电极部分形成在开口中。在第一电极部分的顶部周边的第一绝缘层的顶部上设置第二绝缘层; 第二绝缘层位于与第一电极部分的顶部稍微分开的位置。第一电极部分被成形为使得顶部由弯曲表面形成或由曲面形成并且平坦表面平滑地连接到弯曲表面。

50. 发明申请

US20110036529A1 CASTING DIE DEVICE 失效
标题翻译：铸造设备
公开(公告)号：US20110036529A1
公开(公告)日：2011-02-17
申请号：US12740592
申请日：2008-10-23
申请人： Kiyoshi Shibata , Toshiro Ichihara , Toshiro Hayashi , Keizou Tanoue , Masamitsu Yamashita
发明人： Kiyoshi Shibata , Toshiro Ichihara , Toshiro Hayashi , Keizou Tanoue , Masamitsu Yamashita
IPC分类号： B22C9/00 , B22D33/04
CPC分类号： B22D17/22 , B22C9/06 , B22D17/24
摘要： A casting die assembly which does not produce any burrs includes a stationary die and a movable die that are clamped in a condition in which a slide core is caused to move toward a center of a movable die, and a back surface of a protrusion of the slide core contacts a stopper section provided on a frame section. The stopper section is subjected to the pressure applied to the slide core during a casting operation. Since the stopper section is provided on part of the frame section, which is integrally formed on the periphery of the stationary die, the stopper section is not caused to retreat or deform by the casting pressure and as a result, the slide core is not moved and burrs are not produced.
摘要翻译：不产生毛刺的铸模组件包括固定模具和可动模具，该固定模具和可移动模具被夹紧在使滑动芯体朝向可动模具的中心移动的状态下，以及可移动模具的后表面滑动芯接触设置在框架部分上的止动部分。在铸造操作期间，止动器部分受到施加到滑动芯的压力。由于止动部设置在一体地形成在固定模的周边上的框架部的一部分上，所以止动部不会由于铸造压力而退缩或变形，结果，滑动芯不会移动并且不产生毛刺。

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