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41. 发明授权

US08877528B2 Producing method of light emitting element transfer sheet, producing method of light emitting device, light emitting element transfer sheet, and light emitting device 有权
标题翻译：发光元件转印片的制造方法，发光元件的制造方法，发光元件转印片及发光元件
公开(公告)号：US08877528B2
公开(公告)日：2014-11-04
申请号：US13446611
申请日：2012-04-13
申请人： Yasunari Ooyabu , Toshiki Naito , Satoshi Sato
发明人： Yasunari Ooyabu , Toshiki Naito , Satoshi Sato
IPC分类号： H01L21/00 , H01L33/56 , H01L33/46 , H01L33/00
CPC分类号： H01L33/56 , H01L24/97 , H01L33/0095 , H01L33/46 , H01L2224/16 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer.
摘要翻译：发光转印片的制造方法包括以下步骤：制备包括连接到一个侧表面上的电极部分的光半导体层和层压在另一个侧表面上的荧光体层的发光元件片材; 将发光元件片分割成多个片以形成多个发光元件; 将多个发光元件设置在基板上以彼此间隔开; 在所述基板上形成包含光反射部件的反射树脂层以覆盖所述发光元件; 并且部分地去除反射树脂层，使得电极部分的一个侧表面从反射树脂层露出。

42. 发明授权

US08647517B2 Producing method of suspension board with circuit 有权
标题翻译：带电路的悬挂板的制作方法
公开(公告)号：US08647517B2
公开(公告)日：2014-02-11
申请号：US12216589
申请日：2008-07-08
申请人： Takahiko Yokai , Yasunari Ooyabu , Toshiki Naito
发明人： Takahiko Yokai , Yasunari Ooyabu , Toshiki Naito
IPC分类号： H01B13/00 , B44C1/22
CPC分类号： G11B5/484 , G11B5/4853 , G11B5/486 , H05K1/0269 , H05K3/0008 , H05K3/0082 , H05K3/064 , H05K3/108 , H05K3/44 , H05K2201/09063 , H05K2201/0969 , H05K2201/09781 , H05K2201/09918 , H05K2203/0323 , H05K2203/056
摘要： A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.
摘要翻译：具有电路的悬挂板的制造方法包括同时形成形成在金属支撑板上的绝缘层上的导电图案，并且具有用于连接到电子部件的端子部分，以及形成在金属支撑板上的标记，所述绝缘层具有用于形成用于安装所述电子部件的基准孔的开口，并且通过蚀刻设置在所述标记的开口中的所述金属支撑板，或者设置在所述绝缘层和所述金属支撑板上而形成所述基准孔打开标记。

43. 发明授权

US08354597B2 Wired circuit board and producing method thererof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US08354597B2
公开(公告)日：2013-01-15
申请号：US12216511
申请日：2008-07-07
申请人： Takahiko Yokai , Toshiki Naito
发明人： Takahiko Yokai , Toshiki Naito
IPC分类号： H05K1/03 , G11B5/48 , H05K1/00
CPC分类号： H05K1/05 , H05K1/056 , H05K3/44 , H05K2201/09745 , H05K2201/10416 , H05K2203/0323 , H05K2203/0369 , H05K2203/0723 , Y10T29/49124
摘要： A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.
摘要翻译：布线电路板包括具有至少一个凹陷部分的金属支撑板，嵌入至少一个凹陷部分中的导电部分并且由具有比金属支撑板的导电性更高的导电性的材料形成，绝缘层形成在金属支撑板以覆盖导电部分，并且以相互间隔的关系形成在绝缘层上以与导电部分相对的多个导线。

44. 发明申请

US20120045170A1 OPTICAL WAVEGUIDE FOR TOUCH PANEL 审中-公开
标题翻译：用于触摸面板的光学波形
公开(公告)号：US20120045170A1
公开(公告)日：2012-02-23
申请号：US13207926
申请日：2011-08-11
申请人： Naoki Shibata , Toshiki Naito
发明人： Naoki Shibata , Toshiki Naito
IPC分类号： G02B6/32
CPC分类号： G06F3/0421 , G02B6/1245 , G02B6/138 , G02B6/30 , G02B2006/12102
摘要： An optical waveguide for a touch panel is capable of causing light beams emitted from a light-emitting optical waveguide section to enter a light-receiving optical waveguide section even when warpage or distortion occurs. Edges of an over cladding layer covering an end surface of a core for emitting a light beams and an end surface of a core for receiving the light beams respectively are configured in the form of light-emitting and light-receiving lens portions each having an outwardly-bulging arcuately curved surface as seen in vertical sectional view. The light-emitting lens portion has one of the following configurations: a configuration in which a light beam emitted from the light-emitting lens portion is adapted to diffuse in the direction of the height of the light-emitting lens portion; and a configuration in which the height of the light-emitting lens portion is less than that of the light-receiving lens portion.
摘要翻译：即使发生翘曲或变形，用于触摸面板的光波导能够使从发光光波导部分发射的光束进入光接收光波导部分。覆盖用于发射光束的芯的端面的上覆层的边缘和用于接收光束的芯的端面分别被配置为发光和光接收透镜部分的形式，每个透镜部分具有向外如垂直剖视图所示，呈弧形弧形曲面。发光透镜部分具有以下配置之一：从发光透镜部分发射的光束适于在发光透镜部分的高度方向上扩散的配置; 以及发光透镜部的高度小于受光透镜部的高度的结构。

45. 发明授权

US07971353B2 Production method of a wired circuit board 有权
标题翻译：有线电路板的生产方法
公开(公告)号：US07971353B2
公开(公告)日：2011-07-05
申请号：US12068502
申请日：2008-02-07
申请人： Yuichi Takayoshi , Kazushi Ichikawa , Toshiki Naito
发明人： Yuichi Takayoshi , Kazushi Ichikawa , Toshiki Naito
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K1/0269 , H05K1/111 , H05K3/303 , H05K3/3452 , H05K2201/094 , H05K2201/09781 , H05K2201/09918 , H05K2203/163 , H05K2203/166 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.
摘要翻译：一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成。此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。

46. 发明申请

US20110063816A1 Wired circuit board, connection structure thereof, and connection method therefor 审中-公开
标题翻译：有线电路板及其连接结构及其连接方法
公开(公告)号：US20110063816A1
公开(公告)日：2011-03-17
申请号：US12805939
申请日：2010-08-25
申请人： Hiroyuki Tanabe , Toshiki Naito
发明人： Hiroyuki Tanabe , Toshiki Naito
IPC分类号： H05K1/11 , H05K3/36
CPC分类号： H05K3/363 , G11B5/484 , H05K1/056 , H05K1/117 , H05K3/366 , H05K2201/09381 , H05K2201/09727 , Y10T29/49126
摘要： A wired circuit board includes a first wired circuit board provided with a first conductive pattern which has first terminals comprising placement surfaces for placing a meltable metal and first wires continuous with the first terminals; and a second wired circuit board provided with a second conductive pattern which has second terminals connected with the first terminals through the meltable metal and second wires continuous with the second terminals. The first wired circuit board and the second wired circuit board are arranged so that a first plane containing the first terminals and a second plane containing the second terminals are intersected with each other, and the placement surfaces are zoned so as to gradually widen toward the second terminals.
摘要翻译：布线电路板包括：第一布线电路板，其具有第一导电图案，第一导电图案具有第一端子，第一端子包括用于放置可熔金属的布置表面和与第一端子连续的第一布线; 以及设置有第二导电图案的第二布线电路板，其具有通过可熔融金属与第一端子连接的第二端子，以及与第二端子连续的第二导线。第一布线电路板和第二布线电路板被布置成使得包含第一端子的第一平面和包含第二端子的第二平面彼此相交，并且放置表面被分区以朝向第二端子逐渐变宽终端。

47. 发明申请

US20100083492A1 Suspension board with circuit and producing method thereof 有权
公开(公告)号：US20100083492A1
公开(公告)日：2010-04-08
申请号：US12591978
申请日：2009-12-07
申请人： Jun Ishii , Hitoki Kanagawa , Toshiki Naito
发明人： Jun Ishii , Hitoki Kanagawa , Toshiki Naito
IPC分类号： H05K3/30
CPC分类号： G11B5/4866 , G02B6/423 , G11B5/486 , H05K1/0274 , H05K1/056 , H05K2201/09909 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49895
摘要： A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.

48. 发明申请

US20090044969A1 Wired circuit board and connection structure between wired circuit boards 有权
标题翻译：有线电路板和有线电路板之间的连接结构
公开(公告)号：US20090044969A1
公开(公告)日：2009-02-19
申请号：US12219343
申请日：2008-07-21
申请人： Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
发明人： Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
IPC分类号： H05K1/14
CPC分类号： H05K3/363 , H05K1/056 , H05K1/117 , H05K1/142 , H05K2201/058 , H05K2201/09145 , H05K2201/09381 , H05K2203/167
摘要： A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.
摘要翻译：布线电路板包括第一布线电路板和布置成与同一平面中的第一布线电路板相对的第二布线电路板。面向第二布线电路板的第一布线电路板的第一相对表面和面对第一布线电路板的第二布线电路板的第二相对表面包括沿不同方向延伸的至少两种类型的配合表面，以便相互配合具有第二相对表面的第一相对表面。

49. 发明申请

US20080115962A1 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US20080115962A1
公开(公告)日：2008-05-22
申请号：US11984733
申请日：2007-11-21
申请人： Noriyuki Juni , Kazunori Mune , Sazzadur Rahman Khan , Toshiki Naito , Yutaka Aoki
发明人： Noriyuki Juni , Kazunori Mune , Sazzadur Rahman Khan , Toshiki Naito , Yutaka Aoki
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： G11B5/4826 , G02B6/1221 , G02B6/43 , G11B5/4833 , G11B5/4853 , G11B5/486 , G11B2005/0021 , H05K1/0274 , H05K1/056 , Y10T29/49124
摘要： A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an optical waveguide.
摘要翻译：具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的绝缘覆盖层，和光波导。

50. 发明授权

US07371971B2 Wired circuit board and producing method thereof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US07371971B2
公开(公告)日：2008-05-13
申请号：US11349188
申请日：2006-02-08
申请人： Yuichi Takayoshi , Kazushi Ichikawa , Toshiki Naito
发明人： Yuichi Takayoshi , Kazushi Ichikawa , Toshiki Naito
IPC分类号： H05K1/03
CPC分类号： H05K1/0269 , H05K1/111 , H05K3/303 , H05K3/3452 , H05K2201/094 , H05K2201/09781 , H05K2201/09918 , H05K2203/163 , H05K2203/166 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.
摘要翻译：一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成。此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。

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