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41. 发明授权

US09644906B2 Method for selecting heat medium of use side heat exchanger in installing air-conditioning system 有权
公开(公告)号：US09644906B2
公开(公告)日：2017-05-09
申请号：US14360712
申请日：2011-11-30
申请人： Daisuke Shimamoto , Osamu Morimoto , Takayoshi Honda , Koji Azuma , Koji Nishioka
发明人： Daisuke Shimamoto , Osamu Morimoto , Takayoshi Honda , Koji Azuma , Koji Nishioka
IPC分类号： F28F27/02 , F25D17/02 , F25B45/00 , F25B13/00 , F25B25/00 , F25B49/00 , F24F3/06 , F24F11/00
CPC分类号： F28F27/02 , F24F3/065 , F24F11/30 , F24F11/62 , F25B13/00 , F25B25/005 , F25B45/00 , F25B49/005 , F25B2313/003 , F25B2313/0231 , F25B2339/047 , F25B2500/19 , F25D17/02
摘要： A method for selecting a heat medium in installing an air-conditioning system includes: determining power required for use side heat exchangers corresponding to a plurality of air-conditioned spaces; calculating a total refrigerant amount required when a refrigerant is circulated through all the use side heat exchangers having the determined power; calculating a refrigerant concentration when the total refrigerant amount leaks to each air-conditioned space using the refrigerant, for each air-conditioned space; determining the refrigerant concentration for each air-conditioned space exceeds a predetermined limit concentration; when any air-conditioned space exceeds the limit concentration, selecting, as a nontoxic medium, the circulation heat medium of the use side heat exchanger installed in one of the air-conditioned spaces; and calculating a total refrigerant amount required when the refrigerant is circulated through all other use side heat exchangers.

42. 发明授权

US08167629B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US08167629B2
公开(公告)日：2012-05-01
申请号：US12926537
申请日：2010-11-24
申请人： Dai Ito , Takayoshi Honda , Mitsuhiko Mizuno
发明人： Dai Ito , Takayoshi Honda , Mitsuhiko Mizuno
IPC分类号： H01R12/00
CPC分类号： H01R12/70
摘要： An electronic device has: a connector having plural kinds of terminals with respectively different cross section shapes; and a substrate having a plurality of through-holes with lands formed therein. In the electronic device, a width W1 of an insertion portion of the first terminal, a width W2 of an insertion portion of the second terminal, a land-inclusive hole diameter D1 of the first through-hole, and a land-inclusive hole diameter D2 of the second through-hole are configured to fulfill conditions of W1 D2−D1, for the improvement of connection reliability between the land and the terminal while restraining dropping of reflow solder in a connector mounting process.
摘要翻译：电子装置具有：具有分别具有不同截面形状的多种端子的连接器; 以及具有多个通孔的基板，其中形成有焊盘。在电子设备中，第一端子的插入部分的宽度W1，第二端子的插入部分的宽度W2，第一通孔的平台包含孔径D1和包含平台的孔直径第二通孔的D2被配置为满足W1 D2-D1的条件，以提高焊盘与端子之间的连接可靠性，同时抑制回流焊料在连接器安装过程。

43. 发明申请

US20110189870A1 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US20110189870A1
公开(公告)日：2011-08-04
申请号：US12926537
申请日：2010-11-24
申请人： Dai Ito , Takayoshi Honda , Mitsuhiko Mizuno
发明人： Dai Ito , Takayoshi Honda , Mitsuhiko Mizuno
IPC分类号： H01R12/70
CPC分类号： H01R12/70
摘要： An electronic device has: a connector having plural kinds of terminals with respectively different cross section shapes; and a substrate having a plurality of through-holes with lands formed therein. In the electronic device, a width W1 of an insertion portion of the first terminal, a width W2 of an insertion portion of the second terminal, a land-inclusive hole diameter D1 of the first through-hole, and a land-inclusive hole diameter D2 of the second through-hole are configured to fulfill conditions of W1 D2−D1, for the improvement of connection reliability between the land and the terminal while restraining dropping of reflow solder in a connector mounting process.
摘要翻译：电子装置具有：具有分别具有不同截面形状的多种端子的连接器; 以及具有多个通孔的基板，其中形成有焊盘。在电子设备中，第一端子的插入部分的宽度W1，第二端子的插入部分的宽度W2，第一通孔的平台包含孔径D1和包含平台的孔直径第二通孔的D2被配置为满足W1 D2-D1的条件，以提高焊盘和端子之间的连接可靠性，同时抑制回流焊料在连接器安装过程。

44. 发明授权

US07812948B2 Different-kind-of-object detector employing plane spectrometer 有权
标题翻译：采用平面光谱仪的不同种类的物体探测器
公开(公告)号：US07812948B2
公开(公告)日：2010-10-12
申请号：US10576255
申请日：2004-10-15
申请人： Takayoshi Honda , Taichirou Nishiyama , Yasuyuki Suga
发明人： Takayoshi Honda , Taichirou Nishiyama , Yasuyuki Suga
IPC分类号： G01J3/28
CPC分类号： G01N21/9508 , G01N21/359 , G01N21/85 , G01N2021/845 , G01N2201/1293
摘要： A detector for detecting a different kind of object among objects being carried with high resolution using a plane spectrometer irradiates near-infrared ray and performs plane spectroscopy for a reflected light. The detector also detects spectral data of the reflected light and performs preprocessing for averaging and standardizing the spectral data. Then wavelength axis averaging, Lagrangian interpolation and spatial axis averaging are performed. Conversion of first-order/second-order differentiation, smoothing and calculation of the main component score on the basis of previously obtained loading vector data is also performed. Then performing judgment of a different kind of object is performed.
摘要翻译：用于使用平面光谱仪检测以高分辨率携带的物体中的不同种类的物体的检测器照射近红外线并对反射光进行平面光谱分析。检测器还检测反射光的光谱数据，并进行平均化和标准化光谱数据的预处理。然后进行波长轴平均，进行拉格朗日内插和空间轴平均。还执行基于先前获得的加载矢量数据的一阶/二阶微分，平滑和主分量分数的计算的转换。然后执行不同种类的对象的判断。

45. 发明授权

US07677905B2 Electronic device and manufacturing method of the same 有权
标题翻译：电子器件及其制造方法相同
公开(公告)号：US07677905B2
公开(公告)日：2010-03-16
申请号：US11979968
申请日：2007-11-13
申请人： Takayoshi Honda
发明人： Takayoshi Honda
IPC分类号： H01R12/00
CPC分类号： H05K1/116 , H01R12/707 , H01R43/0256 , H05K1/023 , H05K3/3405 , H05K3/3447 , H05K3/3484 , H05K2201/09381 , H05K2201/094 , H05K2201/09709 , H05K2201/09727 , H05K2201/0979 , H05K2201/10189 , H05K2201/10446 , H05K2201/10757 , H05K2201/10787 , H05K2201/10803 , H05K2201/10871 , H05K2201/10901 , H05K2203/1178 , H05K2203/1394
摘要： An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.
摘要翻译：电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。每个端子通过焊料与焊盘连接。焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。端子包括具有插入部件和表面部件的分支端子。插入构件通过焊料与插入平台耦合。表面构件通过焊料与表面焊盘连接。表面构件平行于印刷电路板。插入构件垂直于印刷电路板。所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

46. 发明授权

US07586186B2 Ball grid array 有权
标题翻译：球栅阵列
公开(公告)号：US07586186B2
公开(公告)日：2009-09-08
申请号：US11656431
申请日：2007-01-23
申请人： Takayoshi Honda
发明人： Takayoshi Honda
IPC分类号： H01L23/52
CPC分类号： H01L23/49816 , H01L23/49838 , H01L23/50 , H01L2224/48227 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the first surface and multiple ball terminals on a second surface opposite to the first surface. Each wiring is connected to a corresponding pad of the semiconductor chip, and is electrically connected to a corresponding ball terminal. At least one of ball terminals providing a power supply terminal or a ground terminal provides a common ball terminal for connecting to at least two of the pads of the semiconductor chip through two wirings.
摘要翻译：球栅阵列包括：具有多个焊盘的半导体芯片; 以及用于将半导体芯片安装在第一表面上的插入器。插入器包括第一表面上的多个布线和与第一表面相对的第二表面上的多个球形端子。每个布线连接到半导体芯片的相应的焊盘，并且电连接到相应的球端子。提供电源端子或接地端子的球端子中的至少一个提供了通过两条布线连接到半导体芯片的至少两个焊盘的公共球形端子。

47. 发明授权

US07578681B2 Electronic device including printed circuit board and electronic element mounted on the printed circuit board 有权
公开(公告)号：US07578681B2
公开(公告)日：2009-08-25
申请号：US12222321
申请日：2008-08-07
申请人： Takayoshi Honda , Minoru Hozuka
发明人： Takayoshi Honda , Minoru Hozuka
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： H05K3/3447 , H01R12/57 , H01R12/58 , H01R12/724 , H01R43/0256 , H05K1/116 , H05K2201/09381 , H05K2201/10189 , H05K2201/10787 , H05K2201/1084 , H05K2201/10848 , H05K2201/10856 , H05K2201/10871 , H05K2203/1178
摘要： An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

48. 发明授权

US07563112B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US07563112B2
公开(公告)日：2009-07-21
申请号：US11979972
申请日：2007-11-13
申请人： Takayoshi Honda
发明人： Takayoshi Honda
IPC分类号： H01R12/00
CPC分类号： H05K1/116 , H01R12/707 , H01R43/0256 , H05K1/023 , H05K3/3405 , H05K3/3447 , H05K3/3484 , H05K2201/09381 , H05K2201/094 , H05K2201/09709 , H05K2201/09727 , H05K2201/0979 , H05K2201/10189 , H05K2201/10446 , H05K2201/10757 , H05K2201/10787 , H05K2201/10803 , H05K2201/10871 , H05K2201/10901 , H05K2203/1178 , H05K2203/1394
摘要： An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.
摘要翻译：电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。第一和第二土地提供锯齿形图案。每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

49. 发明申请

US20090075501A1 Electronic device including printed circuit board, connector and case 有权
标题翻译：电子设备包括印刷电路板，连接器和外壳
公开(公告)号：US20090075501A1
公开(公告)日：2009-03-19
申请号：US12222556
申请日：2008-08-12
申请人： Takayoshi Honda , Dai Ito
发明人： Takayoshi Honda , Dai Ito
IPC分类号： H01R12/00
CPC分类号： H05K5/0039 , H01R12/716 , H01R12/724
摘要： An electronic device includes a printed circuit board, a connector mounted on the printed circuit board, and a case housing the printed circuit board. The connector includes a housing and a plurality of terminals arranged in the housing. The case has an opening portion on one side thereof and the housing covers the opening portion. The case includes a wall having a case-side fixing part and a case-side engaging part at a portion adjacent to the opening portion. The housing has a housing-side fixing part and a housing-side engaging part. The case-side fixing part engages with the housing-side fixing part for fixing the housing to the case. The case-side engaging part engages with the housing-side engaging part for restricting the portion of the case adjacent to the opening portion from separating from the housing.
摘要翻译：电子设备包括印刷电路板，安装在印刷电路板上的连接器和容纳印刷电路板的壳体。连接器包括壳体和布置在壳体中的多个端子。壳体的一侧具有开口部，壳体覆盖开口部。壳体包括在与开口部分相邻的部分处具有壳体侧固定部分和壳体侧接合部分的壁。壳体具有壳体侧固定部和壳体侧接合部。壳体侧固定部与壳体侧固定部配合，将壳体固定在壳体上。壳体侧接合部与壳体侧接合部接合，用于限制与开口部相邻的壳体的部分与壳体分离。

50. 发明申请

US20080253096A1 Electronic component mounting structure 有权
标题翻译：电子元件安装结构
公开(公告)号：US20080253096A1
公开(公告)日：2008-10-16
申请号：US12155947
申请日：2008-06-12
申请人： Atsushi Ito , Takayoshi Honda , Hidehiro Mikura , Tadashi Tsuruzawa , Takuya Sakuta
发明人： Atsushi Ito , Takayoshi Honda , Hidehiro Mikura , Tadashi Tsuruzawa , Takuya Sakuta
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
摘要翻译：电子部件安装结构包括安装在板的表面上的板和电子部件。董事会包括土地。电子部件包括主体和从主体延伸的端子。每个端子电连接到板的对应的一个焊盘。端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。

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