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    • 42. 发明授权
    • Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate
    • 半导体衬底,电子器件和半导体衬底的制造方法
    • US08686472B2
    • 2014-04-01
    • US13122124
    • 2009-10-01
    • Masahiko Hata
    • Masahiko Hata
    • H01L21/02
    • H01L21/8252H01L21/02381H01L21/02433H01L21/0245H01L21/02461H01L21/02463H01L21/02538H01L21/02551H01L21/02645H01L21/02647H01L21/8258H01L21/84H01L27/1203H01L29/20H01L29/66742H01L29/7371H01L29/78681
    • There is provided a semiconductor wafer including a base wafer, an insulating layer, and a Si crystal layer in the stated order. The semiconductor wafer further includes an inhibition layer that is provided on the Si crystal layer and has an opening penetrating therethrough to reach the Si crystal layer. The inhibition layer inhibiting crystal growth of a compound semiconductor. Furthermore, a seed crystal is provided within the opening, and a compound semiconductor has a lattice match or a pseudo lattice match with the seed crystal. There is also provided an electronic device includes a substrate, an insulating layer that is provided on the substrate, a Si crystal layer that is provided on the insulating layer, an inhibition layer that is provided on the Si crystal layer and has an opening penetrating therethrough to reach the Si crystal layer, where the inhibition layer inhibits crystal growth of a compound semiconductor, a seed crystal that is provided within the opening, a compound semiconductor that has a lattice match or a pseudo lattice match with the seed crystal, and a semiconductor device that is formed using the compound semiconductor.
    • 提供了以所述顺序包括基底晶片,绝缘层和Si晶体层的半导体晶片。 半导体晶片还包括设置在Si晶体层上并具有贯穿其的开口以到达Si晶体层的抑制层。 抑制层抑制化合物半导体的晶体生长。 此外,在开口内设置晶种,化合物半导体与晶种具有晶格匹配或伪晶格匹配。 还提供了一种电子器件,包括衬底,设置在衬底上的绝缘层,设置在绝缘层上的Si晶体层,设置在Si晶体层上并具有贯穿其的开口的抑制层 到达Si晶体层,其中抑制层抑制化合物半导体的晶体生长,设置在开口内的晶种,具有晶格匹配或与晶种的伪晶格匹配的化合物半导体以及半导体 使用化合物半导体形成的器件。
    • 43. 发明授权
    • Semiconductor wafer, semiconductor device, and method of manufacturing a semiconductor device
    • 半导体晶片,半导体器件以及半导体器件的制造方法
    • US08431459B2
    • 2013-04-30
    • US12934233
    • 2009-03-26
    • Mitsuru TakenakaShinichi TakagiMasahiko HataOsamu Ichikawa
    • Mitsuru TakenakaShinichi TakagiMasahiko HataOsamu Ichikawa
    • H01L21/00
    • H01L29/7787H01L21/28264H01L29/205H01L29/517H01L29/66462H01L29/66522H01L29/78648H01L29/78681
    • It is an objective of the present invention to form a favorable interface between an oxide layer and a group 3-5 compound semiconductor using a practical and simple method.Provided is a semiconductor wafer comprising a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP; and a second semiconductor layer that is formed to contact the first semiconductor layer, is a group 3-5 compound semiconductor layer that lattice matches or pseudo-lattice matches with InP, and can be selectively oxidized relative to the first semiconductor layer. Also provided is a semiconductor device comprising a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP; an oxide layer formed by selectively oxidizing, relative to the first semiconductor layer, at least a portion of a second semiconductor layer that is a group 3-5 compound formed to contact the first semiconductor layer and that lattice matches or pseudo-lattice matches with InP; and a control electrode that adds an electric field to a channel formed in the first semiconductor layer.
    • 本发明的目的是使用实用和简单的方法在氧化物层和3-5族化合物半导体之间形成良好的界面。 提供了包括第一半导体层的半导体晶片,其是不含砷的组3-5化合物,并且晶格匹配或伪晶格与InP匹配; 和形成为与第一半导体层接触的第二半导体层是与InP晶格匹配或伪晶格匹配的组3-5化合物半导体层,并且可相对于第一半导体层选择性地氧化。 还提供了一种半导体器件,其包括第一半导体层,其是不含砷的组3-5化合物,并且晶格匹配或伪晶格与InP匹配; 通过相对于第一半导体层选择性地氧化形成为与第一半导体层接触的组3-5化合物的第二半导体层的至少一部分,并且晶格匹配或伪晶格匹配的InP形成的氧化物层 ; 以及将电场与形成在第一半导体层中的沟道相加的控制电极。
    • 45. 发明申请
    • METHOD OF MEASURING ELECTRICAL CHARACTERISTICS OF SEMICONDUCTOR WAFER
    • 测量半导体滤波器电气特性的方法
    • US20120032699A1
    • 2012-02-09
    • US13273781
    • 2011-10-14
    • Noboru FUKUHARAMasahiko Hata
    • Noboru FUKUHARAMasahiko Hata
    • G01R31/26
    • G01R31/025G01R31/129
    • There is provided a method of measuring a leakage current or a dielectric breakdown voltage of a semiconductor wafer that has a base wafer and a buffer layer formed on the base wafer. The method includes providing, on the buffer layer, a plurality of electrodes including a hole injection electrode made of a material that injects a hole into the buffer layer when an electric field is applied thereto, measuring an electric current flowing through a pair of electrodes or a voltage between the electrodes when a voltage or an electric current is applied to the pair of electrodes, the electrodes including at least one hole injection electrode, and measuring a leakage current or a dielectric breakdown voltage caused by hole migration in the semiconductor wafer based on the current flowing through the pair of electrodes or the voltage generated between the pair of the electrodes.
    • 提供了一种测量半导体晶片的漏电流或介电击穿电压的方法,该半导体晶片具有形成在基底晶片上的基底晶片和缓冲层。 该方法包括在缓冲层上设置多个电极,该多个电极包括由施加电场的空穴注入到缓冲层中的材料制成的空穴注入电极,测量流过一对电极的电流或 当对一对电极施加电压或电流时,电极之间的电压,所述电极包括至少一个空穴注入电极,并且测量基于半导体晶片中的空穴迁移引起的漏电流或介电击穿电压,基于 流过该对电极的电流或在一对电极之间产生的电压。
    • 48. 发明申请
    • Semiconductor material for electronic device and semiconductor element using same
    • 用于电子器件的半导体材料和使用其的半导体元件
    • US20060249761A1
    • 2006-11-09
    • US10539008
    • 2003-12-16
    • Akira InoueMasahiko Hata
    • Akira InoueMasahiko Hata
    • H01L29/76H01L29/94H01L31/00
    • H01L29/7371H01L29/1004
    • In an epitaxial substrate comprising a bipolar transistor structure having a collector layer (3), base layer (4) and emitter layer (5) on a GaAs substrate (2), the base layer (4) is configured a lower base layer (41) having a required carrier concentration, an upper base layer (42), and a low carrier concentration layer (43) provided between the lower base layer (41) and the upper base layer (42) that has a ballast effect. The lower base layer (41) or the upper base layer (42) may be omitted. The higher the temperature of the low carrier concentration layer (43) portion is, the easier it is for electrons to pass therethrough, which has the effect of raising the amplification factor, thereby helping the transistor heat stability characteristics.
    • 在包括在GaAs衬底(2)上具有集电极层(3),基底层(4)和发射极层(5))的双极晶体管结构的外延衬底中,基底层(4)被构造为下部基底层 )具有设置在具有镇流效应的下基底层(41)和上基底层(42)之间的上基底层(42)和低载流子浓度层(43)。 可以省略下基层(41)或上基层(42)。 低载流子浓度层(43)部分的温度越高,电子越容易通过,这具有提高放大系数的作用,从而有助于晶体管的热稳定性。