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    • 41. 发明授权
    • Finger identification apparatus
    • 手指识别装置
    • US07561257B2
    • 2009-07-14
    • US11976528
    • 2007-10-25
    • Akio NagasakaTakafumi MiyatakeNaoto MiuraYoshiaki AmanoYoshimi KasaiShinichiro UmemuraMiyuki Kono
    • Akio NagasakaTakafumi MiyatakeNaoto MiuraYoshiaki AmanoYoshimi KasaiShinichiro UmemuraMiyuki Kono
    • G06K9/74
    • G06K9/00067G06K9/00013G06K9/00362G06K9/00919G06K2009/00932
    • An identification apparatus that keeps the conditions for imaging uniform among successive identifications and requires a user to perform only a series of simple maneuvers. An identification apparatus comprising a guide member, a light source, and an imaging unit. The guide member includes a pattern or a structure that inspires a user to position his/her finger thereon or to approach his/her specific finger region thereto. A contact member such as a button switch is preferably located at a position in the guide member at which a fingertip is to be positioned. An optical opening is formed at a position coincident with a position at which a portion of a finger to be imaged for identification should be placed. The light source radiates near-infrared light through the portion of the finger to be imaged. The imaging means acquires an image of the finger, and the apparatus compares the image to previously registered images. The apparatus may also include dual light sources power saving functionality, and means for limiting the interference of external light sources.
    • 一种识别装置,其在连续标识之间保持成像的条件均匀,并且要求用户仅执行一系列简单的操作。 一种识别装置,包括导向件,光源和成像单元。 引导构件包括启动使用者将他/她的手指放置在其上或用于接近他/她的特定手指区域的图案或结构。 诸如按钮开关的接触构件优选地位于引导构件中位于指尖处的位置。 在与待成像的手指的一部分要被放置的位置重合的位置处形成光学开口。 光源通过要被成像的手指的部分辐射近红外光。 成像装置获取手指的图像,并且该装置将图像与先前登记的图像进行比较。 该装置还可以包括双光源节电功能,以及用于限制外部光源的干扰的装置。
    • 42. 发明申请
    • PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME
    • 压电振动装置及其制造方法
    • US20090077781A1
    • 2009-03-26
    • US12203035
    • 2008-09-02
    • Yoshiaki Amano
    • Yoshiaki Amano
    • H01L41/22
    • H01L41/332H01L41/29H03H3/02H03H2003/026Y10T29/42Y10T29/49147Y10T29/49156
    • Methods are disclosed for manufacturing tuning-fork type piezoelectric vibrating devices. In an exemplary method a metal film is formed on both surfaces of a piezoelectric wafer, followed by application of photoresist. A first metal-film-etching step etches the metal film after removal of the photoresist layer outside the profile outline of the devices. A first piezoelectric-etching step etches the wafer surface but not through to the rear surface; thus, outside the profile outline the metal film is removed. A second metal-film-etching step etches the metal film after removal of the photoresist layer from first groove regions. A second piezoelectric-etching step etches outside the profile outline and the groove regions through to the rear surface.
    • 公开了制造音叉式压电振动装置的方法。 在示例性方法中,在压电晶片的两个表面上形成金属膜,然后施加光致抗蚀剂。 第一金属膜蚀刻步骤在将光致抗蚀剂层移除到器件的外形外形之外蚀刻金属膜。 第一压电蚀刻步骤蚀刻晶片表面但不穿过后表面; 因此,在外形轮廓外,金属膜被去除。 在从第一凹槽区域去除光致抗蚀剂层之后,第二金属膜蚀刻步骤蚀刻金属膜。 第二压电蚀刻步骤在轮廓轮廓外侧和槽区域之间蚀刻到后表面。
    • 47. 发明授权
    • Quartz-crystal devices and methods for manufacturing same
    • 石英晶体器件及其制造方法
    • US08581476B2
    • 2013-11-12
    • US13051730
    • 2011-03-18
    • Yoshiaki AmanoTakehiro TakahashiShuichi Mizusawa
    • Yoshiaki AmanoTakehiro TakahashiShuichi Mizusawa
    • H03H9/17
    • H03H9/172B32B2457/202H03H3/02H03H9/0547H03H9/0595H03H9/1021H03H2003/022
    • Methods are disclosed for manufacturing quartz-crystal devices. In an exemplary method three wafers are prepared. One is a quartz-crystal wafer defining multiple quartz-crystal pieces; a second is a wafer defining multiple package bases; and a third is a wafer defining multiple lids for the package bases. Each quartz-crystal piece has a respective excitation portion that vibrates when electrically energized and a respective frame portion surrounding the excitation portion. The quartz-crystal wafer has main surfaces that are lapped and polished to mirror-finish them. The base wafer defines multiple package bases each having a floor surface, a bonding surface surrounding the floor surface, and a lower main surface. The lid wafer defines multiple lids each having a ceiling surface, a bonding surface surrounding the ceiling surface, and a upper main surface. The quartz-crystal wafer is sandwiched between the base and lid wafers. The wafers are bonded together by bonding respective main surfaces of the frame portion to respective bonding surfaces. At least two of the upper main surface, lower main surface, floor surface, and ceiling surface are rougher than the surfaces of the excitation portion.
    • 公开了制造石英晶体器件的方法。 在示例性方法中,制备三个晶片。 一个是限定多个石英晶片的石英晶片; 第二个是限定多个封装基座的晶片; 并且第三个是限定用于封装基座的多个盖的晶片。 每个石英晶片具有各自的激励部分,其在被激励时振动,以及围绕激励部分的相应的框架部分。 石英晶片的主表面经过研磨和抛光以对其进行镜面加工。 基底晶片限定多个封装基座,每个封装基座具有地板表面,围绕地板表面的接合表面和下部主表面。 盖子晶片限定了多个盖子,每个盖子具有顶部表面,围绕天花板表面的粘结表面和上部主表面。 石英晶片夹在基底和盖子晶片之间。 通过将框架部分的各个主表面粘合到相应的粘合表面,将晶片粘结在一起。 上主表面,下主表面,地板表面和天花板表面中的至少两个比激励部分的表面更粗糙。
    • 48. 发明授权
    • Finger identification apparatus
    • 手指识别装置
    • US08437512B2
    • 2013-05-07
    • US13200857
    • 2011-10-04
    • Akio NagasakaTakafumi MiyatakeNaoto MiuraYoshiaki AmanoYoshimi KasaiShinichiro UmemuraMiyuki Kono
    • Akio NagasakaTakafumi MiyatakeNaoto MiuraYoshiaki AmanoYoshimi KasaiShinichiro UmemuraMiyuki Kono
    • G06K9/00
    • G06K9/00067G06K9/00013G06K9/00362G06K9/00919G06K2009/00932
    • An identification apparatus keeps the conditions for imaging uniform among successive identifications, and requires a user to perform only a series of simple maneuvers. The apparatus comprises a guide member, a light source, and an imaging unit. The guide member includes a pattern or structure for a user to position his/her finger thereon or to approach his/her specific finger region thereto. A contact member is located in the guide member where a fingertip is positioned. An optical opening is formed at a position coincident with where a finger to be imaged should be placed. The light source radiates near-infrared light through the portion of the finger to be imaged. The imaging means acquires an image of the finger, and the apparatus compares the image to previously registered images. The apparatus may also include dual light sources power saving functionality, and means for limiting the interference of external light sources.
    • 识别装置在连续标识之间保持成像均匀的条件,并且要求用户仅执行一系列简单的操作。 该装置包括导向件,光源和成像单元。 引导构件包括用于使用者将他/她的手指放置在其上或者使其/特定手指区域接近的图案或结构。 接触构件位于引导构件中,其中指尖被定位。 在与要成像的手指放置的位置重合的位置处形成光学开口。 光源通过要被成像的手指的部分辐射近红外光。 成像装置获取手指的图像,并且该装置将图像与先前登记的图像进行比较。 该装置还可以包括双光源节电功能,以及用于限制外部光源的干扰的装置。
    • 49. 发明授权
    • Methods for manufacturing piezoelectric vibrating devices
    • 制造压电振动装置的方法
    • US08365371B2
    • 2013-02-05
    • US12203035
    • 2008-09-02
    • Yoshiaki Amano
    • Yoshiaki Amano
    • H04R17/10C03C25/70
    • H01L41/332H01L41/29H03H3/02H03H2003/026Y10T29/42Y10T29/49147Y10T29/49156
    • Methods are disclosed for manufacturing tuning-fork type piezoelectric vibrating devices. In an exemplary method a metal film is formed on both surfaces of a piezoelectric wafer, followed by application of photoresist. A first metal-film-etching step etches the metal film after removal of the photoresist layer outside the profile outline of the devices. A first piezoelectric-etching step etches the wafer surface but not through to the rear surface; thus, outside the profile outline the metal film is removed. A second metal-film-etching step etches the metal film after removal of the photoresist layer from first groove regions. A second piezoelectric-etching step etches outside the profile outline and the groove regions through to the rear surface.
    • 公开了制造音叉式压电振动装置的方法。 在示例性方法中,在压电晶片的两个表面上形成金属膜,然后施加光致抗蚀剂。 第一金属膜蚀刻步骤在将光致抗蚀剂层移除到器件的外形外形之外蚀刻金属膜。 第一压电蚀刻步骤蚀刻晶片表面但不穿过后表面; 因此,在外形轮廓外,金属膜被去除。 在从第一凹槽区域去除光致抗蚀剂层之后,第二金属膜蚀刻步骤蚀刻金属膜。 第二压电蚀刻步骤在轮廓轮廓外侧和槽区域之间蚀刻到后表面。
    • 50. 发明申请
    • QUARTZ-CRYSTAL DEVICES AND METHODS FOR MANUFACTURING SAME
    • 石英晶体器件及其制造方法
    • US20110234052A1
    • 2011-09-29
    • US13051730
    • 2011-03-18
    • Yoshiaki AmanoTakehiro TakahashiShuichi Mizusawa
    • Yoshiaki AmanoTakehiro TakahashiShuichi Mizusawa
    • H01L41/053B32B38/10
    • H03H9/172B32B2457/202H03H3/02H03H9/0547H03H9/0595H03H9/1021H03H2003/022
    • Methods are disclosed for manufacturing quartz-crystal devices. In an exemplary method three wafers are prepared. One is a quartz-crystal wafer defining multiple quartz-crystal pieces; a second is a wafer defining multiple package bases; and a third is a wafer defining multiple lids for the package bases. Each quartz-crystal piece has a respective excitation portion that vibrates when electrically energized and a respective frame portion surrounding the excitation portion. The quartz-crystal wafer has main surfaces that are lapped and polished to mirror-finish them. The base wafer defines multiple package bases each having a floor surface, a bonding surface surrounding the floor surface, and a lower main surface. The lid wafer defines multiple lids each having a ceiling surface, a bonding surface surrounding the ceiling surface, and a upper main surface. The quartz-crystal wafer is sandwiched between the base and lid wafers. The wafers are bonded together by bonding respective main surfaces of the frame portion to respective bonding surfaces. At least two of the upper main surface, lower main surface, floor surface, and ceiling surface are rougher than the surfaces of the excitation portion.
    • 公开了制造石英晶体器件的方法。 在示例性方法中,制备三个晶片。 一个是限定多个石英晶片的石英晶片; 第二个是限定多个封装基座的晶片; 并且第三个是限定用于封装基座的多个盖的晶片。 每个石英晶片具有各自的激励部分,其在被激励时振动,以及围绕激励部分的相应的框架部分。 石英晶片的主表面经过研磨和抛光以对其进行镜面加工。 基底晶片限定多个封装基座,每个封装基座具有地板表面,围绕地板表面的接合表面和下部主表面。 盖子晶片限定了多个盖子,每个盖子具有顶部表面,围绕天花板表面的粘结表面和上部主表面。 石英晶片夹在基底和盖子晶片之间。 通过将框架部分的各个主表面粘合到相应的粘合表面,将晶片粘结在一起。 上主表面,下主表面,地板表面和天花板表面中的至少两个比激励部分的表面更粗糙。