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    • 41. 发明授权
    • Global planarization of wafer scale package with precision die thickness control
    • 具有精密模具厚度控制的晶圆级封装的全局平面化
    • US07005319B1
    • 2006-02-28
    • US10993941
    • 2004-11-19
    • Howard Hao ChenLouis L. HsuBrian L. Ji
    • Howard Hao ChenLouis L. HsuBrian L. Ji
    • H01L21/44H01L21/48H01L21/50
    • H01L25/50H01L21/6835H01L23/13H01L23/5389H01L24/24H01L24/29H01L24/82H01L24/83H01L25/0655H01L25/16H01L2221/6835H01L2224/24227H01L2224/83192H01L2224/8385H01L2924/01005H01L2924/01006H01L2924/01023H01L2924/01032H01L2924/01033H01L2924/01043H01L2924/07802H01L2924/14H01L2924/15153H01L2924/1517H01L2924/19041H01L2924/19042Y10S438/977
    • In accordance with the present invention, a method for producing at least two different chips with a controlled total chip thickness such that when these chips are placed into a corresponding pocket of a plurality of pockets located in a wafer chip carrier wherein each of the plurality of pockets have a total pocket depth (Tdp) at least substantially equal to one another, a substantially planarized top surface of said wafer chip carrier is achieved. The method comprises forming at least a first chip on a first dummy carrier and at least a second chip different from the first chip on a separate second dummy carrier using partial wafer bonding and partial wafer dicing. The method further includes using a chip thickness control mechanism in conjunction with said partial wafer bonding and partial wafer dicing in forming the at least a first chip and at least second chip different from the first chip, such that the at least first chip and the at least second different chip formed from each carrier each have a final total chip thickness (FTC) which is substantially equal to one another, and an FTC which is substantially equal to a total pocket depth (Tdp) of each of the uniform pockets of said wafer chip carrier, minus the final thickness of an attaching material (FTG) used within said each respective pocket.
    • 根据本发明,一种用于制造具有受控总芯片厚度的至少两个不同芯片的方法,使得当这些芯片被放置在位于晶片芯片载体中的多个凹穴的相应凹穴中时,其中多个 口袋具有至少基本上彼此相等的总口袋深度(Tdp),实现了所述晶片芯片载体的基本平坦化的顶表面。 该方法包括使用部分晶片接合和部分晶片切割,在第一虚设载体上形成至少第一芯片和至少第二芯片,该第一芯片与第一芯片不同于分开的第二虚设载体。 该方法还包括在形成至少第一芯片和与第一芯片不同的至少第二芯片的同时,使用芯片厚度控制机构与所述部分晶片结合和部分晶片切割相结合,使得至少第一芯片和在 从每个载体形成的最小的第二不同的芯片各自具有彼此基本相等的最终的总芯片厚度(FTC),以及基本上等于所述晶片的每个均匀袋的总袋深度(Tdp)的FTC 芯片载体减去在每个相应的口袋内使用的附着材料(FTG)的最终厚度。
    • 42. 发明授权
    • Method and system for optimizing transmission and reception power levels in a communication system
    • 用于优化通信系统中的发射和接收功率电平的方法和系统
    • US06980824B2
    • 2005-12-27
    • US10249546
    • 2003-04-17
    • Louis L. HsuBrian L. JiKarl D. SelanderMichael A. Sorna
    • Louis L. HsuBrian L. JiKarl D. SelanderMichael A. Sorna
    • H04B7/005H04B7/00
    • H04W52/20
    • A method and system are disclosed herein for determining optimum power level settings for a transmitter and receiver pair of a communication system having a plurality of transmitter and receiver pairs, as determined with respect to bit error rate. In the method disclosed herein, the power levels of a transmitter and a receiver pair coupled to communicate over a duplex communication link are set to initial values. The bit error rate is then determined over the link. Then, the power level of the transmitter, the receiver, or both, is altered, incrementally, and the effect upon the bit error rate is determined. When an improvement appears in the bit error rate at an altered power level, the power level of the transmitter, the receiver or both, are set to the altered power level at which the improvement is found. The steps of incrementally altering power levels, determining the bit error rate, and establishing new power level settings when there is an improvement are repeated until power levels are determined at which the bit error rate is optimized.
    • 本文公开了一种用于确定具有多个发射机和接收机对的通信系统的发射机和接收机对的最佳功率电平设置的方法和系统,如针对误码率确定的。 在本文公开的方法中,耦合到通过双工通信链路进行通信的发射机和接收机对的功率电平被设置为初始值。 然后通过链路确定误码率。 然后,发送器,接收器或两者的功率电平被改变,递增地,并且确定对误码率的影响。 当在改变的功率电平上出现比特错误率的改进时,发射机,接收机或两者的功率电平被设置为发现改进的改变的功率电平。 重复改变功率级别,确定误码率和建立新的功率电平设置的步骤,直到确定位误码率被优化的功率电平为止。
    • 44. 发明申请
    • TERNARY CONTENT ADDRESSABLE MEMORY USING PHASE CHANGE DEVICES
    • 使用相位变更设备的内容可寻址存储器
    • US20120120701A1
    • 2012-05-17
    • US13350823
    • 2012-01-16
    • Brian L. JiChung H. LamRobert K. MontoyeBipin Rajendran
    • Brian L. JiChung H. LamRobert K. MontoyeBipin Rajendran
    • G11C15/00
    • G11C15/046G11C13/0004
    • A content addressable memory device with a plurality of memory cells storing ternary data values of high, low, and don't care. An aspect of the content addressable memory device is the use of first memory elements and second memory elements in the memory cells. The first and second memory elements are electrically coupled in parallel circuit to a match-line. The first memory elements are coupled to first word-lines and the second memory elements are coupled to second word-lines. The first memory elements are configured to store low resistance states if the ternary data value is low and high resistance states if the ternary data value is either high or don't care. The second memory elements are configured to store the low resistance states if the ternary data value is high and the high resistance states if the ternary data value is either low or don't care.
    • 一种具有多个存储单元的内容可寻址存储器件,其存储高,低和不关心的三进制数据值。 内容可寻址存储器件的一个方面是在存储器单元中使用第一存储器元件和第二存储器元件。 第一和第二存储器元件以并联电路电耦合到匹配线。 第一存储器元件耦合到第一字线,并且第二存储器元件耦合到第二字线。 如果三进制数据值低,则第一存储器元件被配置为存储低电阻状态,并且如果三进制数据值高或不在乎,则高电阻状态。 如果三进制数据值高,则第二存储器元件被配置为存储低电阻状态,并且如果三进制数据值为低或不关心,则存在高电阻状态。
    • 49. 发明授权
    • Content addressable memory using phase change devices
    • 内容可寻址内存使用相变设备
    • US07751217B2
    • 2010-07-06
    • US12166311
    • 2008-07-01
    • Chung H. LamBrian L. JiRobert K. MontoyeBipin Rajendran
    • Chung H. LamBrian L. JiRobert K. MontoyeBipin Rajendran
    • G11C15/00
    • G11C13/0004G11C15/046
    • Content addressable memory device utilizing phase change devices. An aspect of the content addressable memory device is the use of a comparatively lower power search-line access element and a comparatively higher power word-line access element. The word-line access element is only utilized during write operations and the search-line access element is only utilized during search operations. The word-line access element being electrically coupled to a second end of a phase change memory element and a word-line. The search-line access element also being electrically coupled to the second end of the phase change memory element and a search-line. The search-line being electrically coupled to a match-line. A bit-line is electrically coupled to a first end of the phase change memory element. Additionally, a complementary set of access elements, a complementary phase change memory element, a complementary search-line, and a complementary bit-line are also included in the content addressable memory device.
    • 使用相变装置的内容寻址存储装置。 内容可寻址存储器件的一个方面是使用相对较低功率的搜索线访问元件和相对较高功率的字线访问元件。 字线访问元件仅在写入操作期间使用,并且搜索线访问元件仅在搜索操作期间被使用。 字线访问元件电耦合到相变存储器元件的第二端和字线。 搜索线访问元件还电耦合到相变存储元件的第二端和搜索线。 搜索线电耦合到匹配线。 位线电耦合到相变存储元件的第一端。 此外,内容可寻址存储器件中还包括互补的一组存取元件,互补相变存储器元件,互补搜索线和互补位线。