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    • 41. 发明申请
    • Silicone Composition and Cured Silicone Resin
    • 硅酮组合物和固化硅树脂
    • US20070260082A1
    • 2007-11-08
    • US11662857
    • 2005-11-01
    • Michael SmithBizhong Zhu
    • Michael SmithBizhong Zhu
    • C08K5/54C08L83/04
    • C08K5/5403C08G77/12C08G77/20C08K5/5425C08L83/04C08L2205/02C08L83/00
    • A silicone composition according to the present invention comprises (A) an organopolysiloxane resin having an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogensilane in an amount sufficient to cure the composition, (C) an effective amount of a reactive diluent comprising (i) an organosiloxane having an average of at least two alkenyl groups per molecule and a viscosity of from 0.001 to 2 Pa·s at 25° C., wherein the viscosity of (C)(i) is not greater than 20% of the viscosity of component (A), and (ii) an organohydrogensiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule and a viscosity of from 0.001 to 2 Pa·s at 25° C., in an amount sufficient to provide from 0.5 to 3 moles of silicon-bonded hydrogen atoms in (C)(ii) to moles of alkenyl groups in (C)(i), and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone resin prepared by curing the silicone composition.
    • 根据本发明的硅氧烷组合物包含(A)每分子平均具有至少两个硅键合的烯基的有机聚硅氧烷树脂,(B)足以固化组合物的量的有机氢硅烷,(C)有效量 的反应性稀释剂,其包含(i)每分子平均具有至少两个烯基的有机硅氧烷,并且在25℃下的粘度为0.001至2Pa.s,其中(C)(i)的粘度不是 组分(A)的粘度大于20%,和(ii)每分子平均具有至少两个硅键合的氢原子的有机氢硅氧烷,在25℃下的粘度为0.001至2Pa.s, (C)(ⅱ)中足以提供0.5至3摩尔硅键合的氢原子与(C)(ⅰ)中烯基摩尔数的量,和(D)催化量的氢化硅烷化催化剂; 和通过固化硅氧烷组合物制备的固化的硅氧烷树脂。