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41. 发明授权

US07271034B2 Semiconductor device with a high thermal dissipation efficiency 有权
标题翻译：具有高散热效率的半导体器件
公开(公告)号：US07271034B2
公开(公告)日：2007-09-18
申请号：US11148737
申请日：2005-06-09
申请人： Thomas J. Brunschwiler , Michel Despont , Mark A. Lantz , Bruno Michel , Peter Vettiger
发明人： Thomas J. Brunschwiler , Michel Despont , Mark A. Lantz , Bruno Michel , Peter Vettiger
IPC分类号： H01L21/00
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译：提供用于制造具有高散热效率的器件的半导体器件和方法。示例性装置包括通过焊接附接到半导体器件的表面的导热结构。导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。

42. 发明授权

US07235464B2 Patterning method 有权
标题翻译：图案化方法
公开(公告)号：US07235464B2
公开(公告)日：2007-06-26
申请号：US10485419
申请日：2003-05-28
申请人： Gian-Luca Bona , Bruno Michel , Hugo Eric Rothuizen , Peter Vettiger , Han Biebuyck
发明人： Gian-Luca Bona , Bruno Michel , Hugo Eric Rothuizen , Peter Vettiger , Han Biebuyck
IPC分类号： H01L21/78 , H01L21/46 , H01L21/76 , C03C1/22 , C03C25/68
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/00 , Y10S438/975
摘要： The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.
摘要翻译：本发明涉及一种用于在包括第一对准结构的基板上形成图案的方法，该方法使用包括图案化结构和第二对准结构的弹性印模。该方法包括用于将弹性体印模移动到基板的移动步骤，以及用于通过第一对准结构和第二对准结构的协作产生的拉伸或压缩力使图案化结构变形的变形步骤。

43. 发明授权

US06453679B1 Dehumidifier and control system for a disk drive 失效
标题翻译：除湿机和磁盘驱动器的控制系统
公开(公告)号：US06453679B1
公开(公告)日：2002-09-24
申请号：US09712592
申请日：2000-11-14
申请人： Akihiko Aoyagi , Kohki Noda , Mark I. Lutwyche , Peter Vettiger
发明人： Akihiko Aoyagi , Kohki Noda , Mark I. Lutwyche , Peter Vettiger
IPC分类号： F25B2102
CPC分类号： H05K5/0213 , B01D53/26 , F25B21/02 , G11B33/1453
摘要： To provide a dehumidification apparatus which can perpetually maintain the internal humidity of a disk drive low and can be installed on a cover or the like of the disk drive with a small space. Also, the dehumidification apparatus is controlled based on the internal humidity or the temperature condition inside and outside the disk drive, by which stable dehumidification can be effected without condensation etc. occurring inside and outside of the disk drive. There are provided a glass fiber which is arranged penetrating a cover of a hard disk drive (HDD) and extends inside and outside the HDD, and a heating member provided outside the HDD, so that the glass fiber on the outside is bonded to the heating member and is heated. Also, a cooling member is provided inside the HDD, and the glass fiber on the inside is bonded to the cooling member. Also, there is provided an apparatus for circulating air that is in contact with a heating portion and a cooling portion.
摘要翻译：提供一种可以将盘驱动器的内部湿度永久地维持在较低的空间内的除湿装置，并且能够安装在盘驱动器的盖等上。此外，除湿装置根据内部湿度或磁盘驱动器的内部和外部的温度条件进行控制，借此可以进行稳定的除湿，而不会在盘驱动器内外产生冷凝等。提供一种玻璃纤维，其布置成贯穿硬盘驱动器（HDD）的盖并在HDD内部和外部延伸，以及设置在HDD外部的加热构件，使得外部的玻璃纤维被接合到加热会员并加热。此外，在HDD内部设置有冷却部件，内部的玻璃纤维与冷却部件接合。另外，提供了一种与加热部和冷却部接触的循环空气的装置。

44. 发明授权

US06291140B1 Low-cost photoplastic cantilever 失效
标题翻译：低成本的光塑性悬臂梁
公开(公告)号：US06291140B1
公开(公告)日：2001-09-18
申请号：US09300990
申请日：1999-04-28
申请人： Cornel Andreoli , Jürgen P. Brugger , Ute Dreschler , Peter Vettiger
发明人： Cornel Andreoli , Jürgen P. Brugger , Ute Dreschler , Peter Vettiger
IPC分类号： G03C500
CPC分类号： G01Q70/14 , G01Q70/16 , G03F7/2049 , Y10S977/879
摘要： A method of manufacturing a cantilever with tip comprising the steps of forming a tip-like indent in a substrate, depositing a photoresist layer which fills said tip-like indent and covers at least a part of said substrate, and photolithographically structuring said photoresist layer to form said cantilever with tip out of said photoresist.
摘要翻译：一种制造具有尖端的悬臂的方法，包括以下步骤：在衬底中形成尖端状凹陷，沉积填充所述尖端状凹陷并覆盖所述衬底的至少一部分的光致抗蚀剂层，以及将所述光致抗蚀剂层光刻地构造成用所述光致抗蚀剂的尖端形成所述悬臂。

45. 发明授权

US5344746A Integrated light deflector and method of fabrication therefor 失效
公开(公告)号：US5344746A
公开(公告)日：1994-09-06
申请号：US62128
申请日：1993-05-14
申请人： Peter Vettiger , Otto Voegeli
发明人： Peter Vettiger , Otto Voegeli
IPC分类号： H01L27/15 , G03F7/00 , G03F7/20 , H01S5/00 , H01S5/042 , H01S5/18 , G03C5/00 , G03C5/04
CPC分类号： H01S5/18 , G03F7/0005 , G03F7/2002 , Y10S430/168
摘要： An integrated light deflector and fabrication method are disclosed. In accordance with the method, a mold is constructed above the surface of a substrate using a thick photo resist and a mask to define a deflector plane. A collimated light beam is applied at an appropriate angle of incidence to the photo resist material and mask. The developed resist provides a mold into which the deflector body is cast, leaving a deflector body whose front surface serves as the deflecting surface.

46. 发明授权

US5319725A Bilithic composite for optoelectronic integration 失效
标题翻译：石墨复合材料用于光电一体化
公开(公告)号：US5319725A
公开(公告)日：1994-06-07
申请号：US995490
申请日：1992-12-23
申请人： Peter Buchmann , David J. Webb , Peter Vettiger
发明人： Peter Buchmann , David J. Webb , Peter Vettiger
IPC分类号： G02B6/122 , G02B6/12 , G02B6/42 , G02B6/43 , H01L27/14 , H01L27/15 , H01S5/022
CPC分类号： G02B6/4231 , G02B6/12004 , G02B6/43 , G02B6/423 , H01S5/02252 , H01S5/02292
摘要： Optoelectronic composite consisting of two chips, the first chip 10 being made of a first material, the second one 13 being made of another material. The first chip 10, for example, comprises a multiplicity of active optoelectronic devices e.g. a laser diode 11 and a photo diode 12, all being monolithically integrated. A multiplicity of other optical devices, e.g. a waveguide 16, is monolithically integrated on the second chip 13. In addition this second chip 13 has depressions of the size of the devices 11,12 integrated on said first chip 10. These devices and the waveguide 16 of the second chip 13 are automatically aligned when flipping both chips together.
摘要翻译：由两个芯片组成的光电复合体，第一芯片10由第一材料制成，第二芯片10由另一材料制成。第一芯片10例如包括多个有源光电器件，例如，激光二极管11和光电二极管12，全部是单片集成的。多个其他光学装置，例如，波导16单片地集成在第二芯片13上。此外，第二芯片13具有集成在所述第一芯片10上的器件11,12的尺寸的凹陷。这些器件和第二芯片13的波导16自动地将两个芯片翻转在一起时对齐。

47. 发明授权

US4591540A Method of transferring a pattern into a radiation-sensitive layer 失效
标题翻译：将图案转印到辐射敏感层中的方法
公开(公告)号：US4591540A
公开(公告)日：1986-05-27
申请号：US603020
申请日：1984-04-23
申请人： Harald Bohlen , Erwin Bretscher , Helmut Engelke , Peter Nehmiz , Peter Vettiger , Johann Greschner
发明人： Harald Bohlen , Erwin Bretscher , Helmut Engelke , Peter Nehmiz , Peter Vettiger , Johann Greschner
IPC分类号： H01L21/30 , G03F1/20 , G03F1/68 , G03F7/20 , H01L21/027 , G03F9/00 , G03C5/00
CPC分类号： G03F1/20 , G03F1/68 , G03F7/70475
摘要： According to this process two partial patterns which, if superimposed upon each other in a predetermined alignment relative to each other yield the desired pattern, with elements of both partial patterns combining to form elements of the pattern, and these partial pattern elements overlapping sectionally, are projected with a suitable radiation onto the radiation-sensitive layers. Overlapping is achieved in that when designing the two partial patterns a pattern corresponding to the desired pattern is used as a basis in that the elements of this pattern are exposed to a negative windage, the negative windage pattern is subsequently partitioned into two negative windage patterns corresponding to the partial patterns, and finally the negative windage partial pattern elements are exposed to a positive windage to the desired size of the partial pattern elements.The method is used in particular when a pattern is to be transferred by means of hole masks, and if it is necessary, e.g. because the pattern shows annular elements, to use instead of one mask only two complementary masks each comprising at least one part of the pattern.
摘要翻译：根据该处理，如果相互相对于彼此以预定的对准彼此重叠的两个部分图案产生期望的图案，则两个部分图案的元素组合以形成图案的元件，并且这些部分图案元素分别重叠以合适的辐射投射到辐射敏感层上。实现重叠是因为当设计两个部分图案时，将与期望图案相对应的图案用作基础，因为该图案的元件暴露于负风挡，然后将负风挡图案划分为相应的两个负风挡图案对于部分图案，最后，负风挡部分图案元件暴露于部分图案元件的期望尺寸的正向风挡。特别是当通过孔掩模传输图案时，特别是使用该方法。因为图案示出了环形元件，而是使用仅包括两个互补掩模的两个互补掩模，每个掩模包括图案的至少一部分。

48. 发明申请

US20090073849A1 HIGH DENSITY DATA STORAGE MEDIUM 失效
标题翻译：高密度数据存储介质
公开(公告)号：US20090073849A1
公开(公告)日：2009-03-19
申请号：US12275547
申请日：2008-11-21
申请人： Jane Frommer , Robert D. Miller , Craig Hawker , Urs T. Duerig , Bernd Gotsmann , Peter Vettiger , Mark A. Lantz
发明人： Jane Frommer , Robert D. Miller , Craig Hawker , Urs T. Duerig , Bernd Gotsmann , Peter Vettiger , Mark A. Lantz
IPC分类号： G11B9/10
CPC分类号： G11B9/14 , B82Y10/00 , G11B9/1409 , G11B9/1472 , G11B9/149
摘要： A data storage system includes a read/write head having a tip connected to a resistive path locally exerting heat at the tip when an electrical current is applied; and a data storage medium from which information is reproduced by scanning a surface of the medium with a tip positioned in contact therewith, the medium comprising: a substrate; and a polymer recording surface within which data bit values are determined by the topographical state at the bit location, characterized in that the polymer contains thermally reversible crosslinkages.
摘要翻译：数据存储系统包括读/写头，其具有连接到电阻路径的尖端，当施加电流时局部地在顶端施加热量; 以及数据存储介质，其中通过用与其接触的尖端扫描介质的表面来再现信息，所述介质包括：基板; 以及聚合物记录表面，其中数据位值由比特位置处的形貌状态确定，其特征在于，所述聚合物含有热可逆交联。

49. 发明申请

US20080017978A1 Semiconductor Device With A High Thermal Dissipation Efficiency 有权
标题翻译：具有高散热效率的半导体器件
公开(公告)号：US20080017978A1
公开(公告)日：2008-01-24
申请号：US11852317
申请日：2007-09-09
申请人： Thomas Brunschwiler , Michel Despont , Mark Lantz , Bruno Michel , Peter Vettiger
发明人： Thomas Brunschwiler , Michel Despont , Mark Lantz , Bruno Michel , Peter Vettiger
IPC分类号： H01L23/34
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor device having a higher thermal dissipation efficiency comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译：具有更高散热效率的半导体器件包括通过焊接附接到半导体器件的表面的导热结构。导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。

50. 发明授权

US07071031B2 Three-dimensional integrated CMOS-MEMS device and process for making the same 有权
标题翻译：三维集成CMOS-MEMS器件及其制造方法
公开(公告)号：US07071031B2
公开(公告)日：2006-07-04
申请号：US10446461
申请日：2003-05-28
申请人： H. Bernhard Pogge , Michel Despont , Ute Drechsler , Peter Vettiger , Roy Yu
发明人： H. Bernhard Pogge , Michel Despont , Ute Drechsler , Peter Vettiger , Roy Yu
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： B81C1/00238 , B81B2203/0307 , H01L21/76898 , H01L2224/16225
摘要： A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.
摘要翻译：垂直集成的结构包括微机电系统（MEMS）和用于将信号传递到MEMS的芯片。该结构包括连接芯片表面和MEMS的金属螺柱; MEMS具有在其下侧具有接触金属螺柱的导电垫的锚固部分。 MEMS与芯片间隔一定距离对应于金属螺柱的高度，并且MEMS包括与导电焊盘接触的掺杂区域。特别地，MEMS可以包括悬臂结构，其中端部包括在垂直方向上延伸的尖端。支撑结构（例如聚酰亚胺）可以围绕金属螺柱并且接触MEMS的下侧和芯片的表面。使用临时载体板来促进MEMS的处理和与芯片的对准。

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