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    • 44. 发明授权
    • Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
    • 薄膜半导体器件,多晶半导体薄膜生产工艺及生产设备
    • US06756614B2
    • 2004-06-29
    • US09791853
    • 2001-02-26
    • Mutsuko HatanoShinya YamaguchiYoshinobu KimuraSeong-Kee Park
    • Mutsuko HatanoShinya YamaguchiYoshinobu KimuraSeong-Kee Park
    • H01L31072
    • H01L29/04B23K26/0622H01L21/02686H01L21/02691H01L27/1281H01L27/1285H01L27/1296H01L29/78675
    • In an MIS field effect transistor having a gate electrode formed on a first semiconductor layer which is a polycrystalline silicon film on an insulating substrate through a gate insulating film, a channel region formed in the semiconductor layer and a source region and a drain region arranged on both sides of the channel region, a thin film semiconductor device has a main orientation of at least the channel region of {110} with respect to the surface of the gate insulating film. Further, a polycrystalline semiconductor film having a main orientation of the surface almost perpendicular to a direction for connecting the source and drain regions of {100} is preferably used in the channel of a semiconductor device. According to the present invention, a semiconductor device having a high-quality polycrystalline semiconductor film whose grain boundary, grain size and crystal orientation can be controlled and whose film roughness and crystal defects formed by crystallization have been reduced can be obtained on the insulating substrate.
    • 在具有通过栅极绝缘膜在绝缘基板上形成在多晶硅膜的第一半导体层上的栅电极的MIS场效应晶体管中,形成在半导体层中的沟道区和布置在该半导体层上的源极区和漏极区 通道区域的两侧,薄膜半导体器件相对于栅极绝缘膜的表面至少具有{110}的沟道区域的主取向。 此外,优选在半导体器件的沟道中使用具有与用于连接{100}的源极和漏极区域的方向几乎垂直的表面的主取向的多晶半导体膜。 根据本发明,可以在绝缘基板上获得具有可以控制其晶界,晶粒尺寸和晶体取向并且通过结晶形成的膜粗糙度和晶体缺陷已经降低的高品质多晶半导体膜的半导体器件。
    • 45. 发明授权
    • Image display
    • 图像显示
    • US08294869B2
    • 2012-10-23
    • US12509673
    • 2009-07-27
    • Shinya YamaguchiMutsuko HatanoTakashi HattoriNaoya Okada
    • Shinya YamaguchiMutsuko HatanoTakashi HattoriNaoya Okada
    • G02F1/1333
    • G02F1/133305G02F1/13452
    • To provide an image display which is capable of preventing fracturing of a substrate which is attributable to a substrate expansion arising from heating or humidification during a manufacture process, impact in use, or distortion when curved display is conducted, a connection failure between a semiconductor chip and a wiring terminal which are mounted on the substrate, and crack occurring in the substrate in the vicinity of an area where the semiconductor chip is mounted, with no need to add members and with no limit of pulling the wiring around. An image display part is formed on one surface of a flexible substrate, and a groove with a depth not reaching a thickness of the substrate is continuously or intermittently defined in another surface of the substrate.
    • 为了提供能够防止在制造过程中由于加热或加湿引起的基板膨胀导致基板压裂的图像显示器,当进行弯曲显示时,使用中的冲击或失真,半导体芯片之间的连接故障 以及安装在基板上的布线端子和在安装半导体芯片的区域附近的基板中发生的裂纹,而不需要添加构件,并且没有限制拉动布线。 在柔性基板的一个表面上形成图像显示部分,并且在基板的另一个表面上连续或间断地限定具有未达到基板厚度的深度的凹槽。
    • 50. 发明授权
    • Thin film semiconductor device containing polycrystalline Si—Ge alloy and method for producing thereof
    • 含有多晶Si-Ge合金的薄膜半导体器件及其制造方法
    • US06716726B2
    • 2004-04-06
    • US10277140
    • 2002-10-22
    • Shinya YamaguchiTakeo ShibaMutsuko HatanoSeong-Kee Park
    • Shinya YamaguchiTakeo ShibaMutsuko HatanoSeong-Kee Park
    • H01L2120
    • H01L29/78696H01L29/66757H01L29/78675H01L29/78684Y10S438/933
    • The present invention relates to a thin film transistor, in a low-temperature poly-Si thin film becoming an elemental material of the thin film transistor, an object of the invention is to provide the thin film transistor suitable for realizing an image display device having a high performance and a large area at low cost by realizing a poly-crystalline thin film having a crystal structure restraining current scattering in a grain boundary, lessening surface roughness, and capable of realizing high mobility even to a positive hole current. The object described above is achieved by realizing a TFT with high mobility by restraining a current scattering factor in a grain boundary of crystal with an introduction of Ge into the poly-crystalline Si thin film and with a difference in ratios of Ge compositions between an interior grain of crystal and a grain boundary of crystal resulted from a phase separation involved in crystallization, and by restraining surface roughness using a difference in volumes in a crystal.
    • 薄膜晶体管本发明涉及一种成为薄膜晶体管的元素材料的低温多晶硅薄膜中的薄膜晶体管,其目的在于提供一种薄膜晶体管,其适用于实现具有 通过实现具有抑制晶界中的电流散射的晶体结构的多晶薄膜,降低表面粗糙度,并且即使对于空穴电流也能实现高迁移率,因此具有高性能和大面积的低成本。目的描述 通过在晶体的晶界中抑制电流散射因子,通过在多晶Si薄膜中引入Ge并且在晶体的内部晶粒之间的Ge组成的比率的差异来实现具有高迁移率的TFT, 并且晶体的晶界由结晶涉及的相分离产生,并且通过使用差异来抑制表面粗糙度 在一个水晶体积。