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41. 发明授权

US06431140B1 Intake port shape of internal combustion engine 有权
标题翻译：内燃机进气口形状
公开(公告)号：US06431140B1
公开(公告)日：2002-08-13
申请号：US09719110
申请日：2001-02-22
申请人： Akihiro Nishimura , Hiroshi Omote
发明人： Akihiro Nishimura , Hiroshi Omote
IPC分类号： F02B3104
CPC分类号： F01L3/06 , F02B31/00 , Y02T10/146
摘要： An object of the present invention is to restrict a part of intake flow which is apt to flow in a direction opposite to a counter swirl flow after colliding against a valve stem, and to produce an intense swirl while controlling a worsening of flow coefficient. A valve seat supporting annular stepped surface(14) is formed on an intake port outlet portion of a cylinder head (1), its inner peripheral edge is formed into a shape having an inner peripheral edge (4a) of a valve stem (4)for serving as a base circle, and a extending portion (15) projecting toward a side of a valve stem (11) is provided on a radial intake port inlet side portion. The extending portion (15) is formed into a mountain-like shape which widens from a top portion projecting toward the valve stem side to both peripheral sides and connects to the base circle at its foot ends; or into an arc-like shape; or into a trapezoidal shape. A back wall (16) is formed on a side opposite to the valve seat of the extending portion (15), the back wall decreasing its projecting height toward an upstream side in the intake port to smoothly connect to an inner peripheral wall surface of the intake port 2.
摘要翻译：本发明的一个目的是在与阀杆碰撞之后，限制一个容易流向反向涡流的方向流动的一部分进气流，并且在控制流量系数恶化的同时产生强烈的漩涡。在气缸盖（1）的进气口出口部分上形成有阀座支撑环形阶梯表面（14），其内周边缘形成为具有阀杆（4）的内周边缘（4a）的形状，用作基圆，并且在径向进气口入口侧部分设置有朝向阀杆（11）侧突出的延伸部分（15）。延伸部（15）形成为从朝向阀杆侧突出的顶部朝向两个外周侧变宽的山形状，并且在其端部连接到基部圆; 或成弧形; 或形成梯形。后壁（16）形成在与延伸部（15）的阀座相反的一侧，后壁朝向进气口的上游侧减小其突出高度，以平滑地连接到进气口的内周壁面进气口2。

42. 发明授权

US5443679A Tape bonding apparatus 失效
标题翻译：胶带接合装置
公开(公告)号：US5443679A
公开(公告)日：1995-08-22
申请号：US101775
申请日：1993-08-02
申请人： Akihiro Nishimura , Koji Sato
发明人： Akihiro Nishimura , Koji Sato
IPC分类号： H01L21/60 , B65H20/04 , B65H35/00 , B65H37/04 , B32B31/04
CPC分类号： B65H20/04 , B65H35/0006 , B65H37/04 , B65H2511/30 , B65H2511/512 , B65H2701/1942 , Y10T156/1343 , Y10T156/1734
摘要： A tab tape bonder including a bonding device which bonds semiconductor chips, etc. to a tab tape, a first roller driver which feeds the tab tape into the bonding device, a detector which detects holes or perforations formed in the tab tape fed by the first roller driver, and a controller which controls the feeding pitch of the tab tape by the first roller driver in accordance with the detection results obtained by the detector.
摘要翻译：包括将半导体芯片等接合到接合带的接合装置的标签带接合器，将接片带馈送到接合装置的第一辊驱动器，检测器，其形成在由第一辊驱动器，以及根据检测器获得的检测结果控制第一辊驱动器的拉片带的进给间距的控制器。

43. 发明授权

US5390057A Cassette loading apparatus 失效
标题翻译：纸盒装载装置
公开(公告)号：US5390057A
公开(公告)日：1995-02-14
申请号：US634547
申请日：1990-12-27
申请人： Akihiro Nishimura , Masahiro Yao
发明人： Akihiro Nishimura , Masahiro Yao
IPC分类号： G11B15/17 , G11B15/675 , G11B23/087 , G11B25/06 , G11B15/60
CPC分类号： G11B15/17 , G11B15/67549 , G11B23/08735 , G11B25/066
摘要： A cassette loading apparatus of the present invention is capable of loading a plurality of tape cassettes different in size from each other, while achieving the following effects: A tape damage or a tape break when the lids of the tape cassette are opened/closed can be prevented; the opening height of a rear lid when the lids are opened can be maintained constant, and at the same time, a gap is not produced between the lids when the lids are closed, thereby preventing an increase of drop-outs due to the invasion of dust or the like into the gap; and damage of a rear lid opener or the rear lid when the lids are open/closed can be prevented.
摘要翻译：本发明的盒式磁带装载装置能够装载大小不同的多个磁带盒，同时实现以下效果：当磁带盒的盖子打开/关闭时，磁带损坏或磁带断裂可以是防止打开盖子时的后盖的开口高度可以保持恒定，同时当盖子关闭时盖子之间不会产生间隙，从而防止由于入口引起的脱落增加灰尘等进入间隙; 并且可以防止盖盖打开/关闭时的后盖开启器或后盖的损坏。

44. 发明授权

US5240200A Tape cassette 失效
标题翻译： TAPE CASSETTE
公开(公告)号：US5240200A
公开(公告)日：1993-08-31
申请号：US677130
申请日：1991-03-29
申请人： Akihiro Nishimura , Toru Ichimura , Shuji Uematsu , Yoshinori Shiomi , Kenji Iwano
发明人： Akihiro Nishimura , Toru Ichimura , Shuji Uematsu , Yoshinori Shiomi , Kenji Iwano
IPC分类号： G11B15/675 , G11B23/087 , G11B25/06
CPC分类号： G11B23/087 , G11B15/675 , G11B25/066
摘要： A set of tape cassettes of successively larger sizes, each cassette having a housing elongated in a longitudinal direction and having a front face with a tape accommodating opening symmetrical about a center line extending in a lateral direction transverse to the longitudinal direction and midway between side faces of the housing, the housing further having a bottom face with a plurality of cassette guide grooves therein parallel to each other and extending transversely of the housing and engagable with guide projections on a cassette holder for guiding the cassette into the cassette holder. The opening and the cassette guide grooves in each cassette are in the same position relative to the center line of the cassette housing, and a distance in the longitudinal direction between neighboring cassette guide grooves and a distance in the longitudinal direction between the cassette guide grooves closest to the side faces and the side faces in the housing of each of the tape cassettes of the set other than the smallest cassette of the set are smaller than a width of the smallest of the cassettes in the set in the lateral direction. Thus, erroneous insertion of the cassettes into the cassette holder in the longitudinal direction of the cassettes is prevented.

45. 发明授权

US5058798A Method for forming bump on semiconductor elements 失效
标题翻译：在半导体元件上形成凸块的方法
公开(公告)号：US5058798A
公开(公告)日：1991-10-22
申请号：US510152
申请日：1990-04-16
申请人： Nobuto Yamazaki , Akihiro Nishimura
发明人： Nobuto Yamazaki , Akihiro Nishimura
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L24/742 , H01L2224/1134 , H01L2224/13099 , H01L2224/45124 , H01L2224/742 , H01L2224/78313 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , Y10S228/904
摘要： Method of forming bumps out of wire on the electrode of a semiconductor element is executed by setting a tip end underneath a vertically movable wedge, lowering the wedge to press the tip end of the wire against the semiconductor element, securely connecting the tip end to the electrode, and then pulling the wire away from the electrode to cut the wire, leaving the tip end on the electrode.
摘要翻译：在半导体元件的电极上形成凸出物的方法通过将尖端设置在可垂直移动的楔形物下方来执行，使楔形物下降以将线的顶端压靠在半导体元件上，将尖端牢固地连接到半导体元件电极，然后将电线从电极拉出以切断电线，将电极末端留在电极上。

46. 发明授权

US5056217A Method for manufacturing semiconductor elements equipped with leads 失效
标题翻译：配备引线的半导体元件的制造方法
公开(公告)号：US5056217A
公开(公告)日：1991-10-15
申请号：US510035
申请日：1990-04-16
申请人： Nobuto Yamazaki , Akihiro Nishimura
发明人： Nobuto Yamazaki , Akihiro Nishimura
IPC分类号： H01L21/60 , H01L21/00 , H01L21/603
CPC分类号： H01L24/85 , H01L24/78 , H01L2224/45014 , H01L2224/45144 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48472 , H01L2224/48475 , H01L2224/49175 , H01L2224/78313 , H01L2224/85051 , H01L2224/85181 , H01L2224/85201 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15165 , H01L2924/30107
摘要： Method of manufacturing semiconductor elements equipped with leads which are connected to electrodes and formed of wires including the steps of positioning each semiconductor element on a bonding stage, feeding a tip end of the wire under a bonding tool so that the bonding tool presses the tip end against the electrode to bond it to the electrode, shifting the bonding tool to away from the tip end and pressing the wire against wire-cutting section of the bonding stage, and pulling the wire away from the bonding tool to cut the wire.
摘要翻译：制造半导体元件的制造方法，该半导体元件配备有与电极连接并由电线形成的引线，包括以下步骤：将每个半导体元件放置在接合台上，将焊丝的末端馈送在接合工具下方，使得接合工具压紧尖端抵靠电极将其粘合到电极上，将接合工具移动到远离尖端并且将线压在接合台的线切割部分上，并且将线从接合工具拉出以切割线。

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