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41. 发明申请

US20110062134A1 METHOD FOR PRODUCING METALLISED TEXTILE SURFACES USING ELECTRICITY-GENERATING OR ELECTRICITY-CONSUMING ELEMENTS 有权
标题翻译：使用电力产生或电力消耗元素生产金属纺织表面的方法
公开(公告)号：US20110062134A1
公开(公告)日：2011-03-17
申请号：US12527865
申请日：2008-02-19
申请人： Rene Lochtman , Norbert Wagner , Jürgen Kaczun , Jürgen Pfister , Antonino Raffaele Addamo , Ralf Nörenberg
发明人： Rene Lochtman , Norbert Wagner , Jürgen Kaczun , Jürgen Pfister , Antonino Raffaele Addamo , Ralf Nörenberg
IPC分类号： H05B1/00 , B32B37/14 , B32B38/00 , B32B15/14
CPC分类号： D06M11/83 , D06M11/74 , D06M13/52 , D06M15/233 , D06M15/263 , D06M15/285 , D06M15/564 , D06M23/08 , D06M23/16 , H05B3/342 , H05B2203/013 , H05B2203/017 , H05B2203/026 , H05B2203/029 , H05B2203/036 , H05B2214/04 , Y10T156/10 , Y10T428/249921
摘要： Processes for producing a metalized textile surface for one or more articles needing or generating electric current. The process comprises (A) applying a formulation comprising at least one metal powder (a) as a component to a textile surface in a patterned or uniform manner; (B) fixing the one or more articles needing or generating electric current in at least two locations of the textile surface where the formulation was applied in step (A); and (C) depositing a further metal on the textile surface. The formulation may comprise a metal powder, a binder, an emulsifier and, if appropriate, a rheology modifier.
摘要翻译：用于生产需要或产生电流的一个或多个制品的金属化织物表面的方法。该方法包括（A）以图案化或均匀的方式将包含至少一种金属粉末（a）作为组分的制剂施用于织物表面; （B）在步骤（A）中施用所述制剂的纺织品表面的至少两个位置固定需要或产生电流的一个或多个制品; 和（C）在织物表面上沉积另外的金属。制剂可以包含金属粉末，粘合剂，乳化剂和（如果合适的话）流变改性剂。

42. 发明申请

US20100176090A1 METHOD FOR THE PRODUCTION OF METAL-COATED BASE LAMINATES 审中-公开
标题翻译：用于生产金属基层压板的方法
公开(公告)号：US20100176090A1
公开(公告)日：2010-07-15
申请号：US12601581
申请日：2008-05-20
申请人： Rene Lochtman , Jürgen Kaczun , Norbert Wagner , Jürgen Pfister , Deiter Hentschel
发明人： Rene Lochtman , Jürgen Kaczun , Norbert Wagner , Jürgen Pfister , Deiter Hentschel
IPC分类号： B32B37/02 , C23F1/02
CPC分类号： B32B37/24 , B32B38/0008 , B32B38/0036 , B32B38/164 , B32B2037/243 , B32B2038/0072 , B32B2038/0092 , B32B2309/105 , B32B2310/14 , B32B2457/00 , B32B2519/02 , H05K1/095 , H05K3/025 , H05K3/182 , H05K3/207 , H05K2201/0347 , H05K2203/1509
摘要： The invention relates to a method for producing metal-coated base laminates having a support (51) made of an electrically nonconductive material (37), which is coated on at least one side with a metal layer (25, 53). In a first step, a base layer (11) is applied onto a substrate (3) with a dispersion (5), which contains electrolessly and/or electrolytically coatable particles in a matrix material. The matrix material is at least partially cured and/or dried. A metal layer is subsequently formed on the base layer (11) by electroless and/or electrolytic coating. The support (51) made of the electrically nonconductive material (37) is laminated onto the metal layer (25). The support (51) laminated with the metal layer (25) and at least a part of the base layer (11) are subsequently removed from the substrate (3).
摘要翻译：本发明涉及一种用于制造金属涂覆的基底层压板的方法，其具有由非导电材料（37）制成的支撑体（51），其在至少一侧上涂覆有金属层（25,53）。在第一步骤中，将基底层（11）用分散体（5）施加到基底（3）上，所述分散体（5）在基质材料中包含无电解和/或电解涂覆的颗粒。基质材料至少部分固化和/或干燥。随后通过无电解和/或电解涂覆在基底层（11）上形成金属层。由非导电材料（37）制成的支撑体（51）层压到金属层（25）上。随后从衬底（3）移除与金属层（25）和基底层（11）的至少一部分层压的支撑件（51）。

43. 发明申请

US20100006442A1 PROCESS FOR APPLICATION OF A METAL LAYER ON A SUBSTRATE 审中-公开
标题翻译：金属层在基材上的应用过程
公开(公告)号：US20100006442A1
公开(公告)日：2010-01-14
申请号：US12376145
申请日：2007-07-27
申请人： Rene Lochtman , Jürgen Kaczun , Norbert Schneider , Jürgen Pfister , Norbert Wagner , Christoffer Kieburg , Ketan Joshi
发明人： Rene Lochtman , Jürgen Kaczun , Norbert Schneider , Jürgen Pfister , Norbert Wagner , Christoffer Kieburg , Ketan Joshi
IPC分类号： C25D7/00 , C25D3/38
CPC分类号： C25D7/006 , C23C18/1641 , C23C18/2066 , C23C18/31 , C25D5/54
摘要： The present invention relates to processes for application of a metal layer on a substrate via deposition of a metal from a metal salt solution by a chemical and/or electroplating method, a significant factor in these processes being that carbon nanotubes are present in the substrate surface. The present invention moreover relates to the use of carbon nanotubes for application of a metal layer on a substrate.
摘要翻译：本发明涉及通过化学和/或电镀方法从金属盐溶液中沉积金属而在基材上施加金属层的方法，这些方法的重要因素是碳纳米管存在于基材表面。本发明还涉及碳纳米管在基材上施加金属层的用途。

44. 发明申请

US20090178930A1 ELECTROPLATING DEVICE AND METHOD 审中-公开
标题翻译：电镀设备和方法
公开(公告)号：US20090178930A1
公开(公告)日：2009-07-16
申请号：US12297330
申请日：2007-04-05
申请人： Rene Lochtman , Jürgen Kaczun , Norbert Schneider , Jürgen Pfister , Gert Pohl , Norbert Wagner
发明人： Rene Lochtman , Jürgen Kaczun , Norbert Schneider , Jürgen Pfister , Gert Pohl , Norbert Wagner
IPC分类号： C25D5/00 , C25D17/00
CPC分类号： C25D17/12 , C25D7/0657 , C25D17/005 , C25D17/06 , C25D17/28
摘要： The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.
摘要翻译：本发明涉及一种用于至少一个导电基底或非导电基底上的结构化或全表面导电表面的电解涂层的装置，其包括至少一个浴，一个阳极和一个阴极，该浴含有电解质含有至少一种金属盐的溶液，金属离子沉积在基材的导电表面上以形成金属层，同时使阴极与待涂覆的基底表面接触，并且将基底输送通过浴，其中阴极包括安装在相应的轴（1,5,14）上的至少两个盘（2,4,10），使得它们可以旋转，盘（2,4,10）彼此接合。本发明还涉及一种在根据本发明的装置中进行的至少一种基底的电解涂覆的方法。最后，本发明还涉及根据本发明的装置在不导电支撑件上的导电结构的电解涂层的用途。

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