会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 47. 发明申请
    • Method for producing a radiation-emitting-and-receiving semiconductor chip
    • 辐射发射和接收半导体芯片的制造方法
    • US20080153189A1
    • 2008-06-26
    • US12072365
    • 2008-02-26
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • H01L33/00
    • H01L27/15H01L31/173
    • A method for producing an integrated semiconductor component comprising a first semiconductor layer construction for emitting radiation and a second semiconductor layer construction for receiving radiation, wherein a substrate is first provided and a first semiconductor layer sequence containing a radiation-generating region is deposited epitaxially on the substrate. A second semiconductor layer sequence containing a radiation-absorbing region is subsequently deposited epitaxially on the first semiconductor layer sequence. The second semiconductor layer sequence is then patterned in order to uncover a first location and a second location. A first semiconductor layer construction is electrically insulated from a second semiconductor layer construction. Finally, a first contact layer is applied to a free surface of the substrate and a second contact layer is applied at least to the first and second locations for contact-connection.
    • 一种用于制造集成半导体部件的方法,包括用于发射辐射的第一半导体层结构和用于接收辐射的第二半导体层结构,其中首先提供衬底,并且包含辐射产生区的第一半导体层序列外延地沉积在 基质。 随后在第一半导体层序列上外延沉积包含辐射吸收区的第二半导体层序列。 然后将第二半导体层序列图案化以便露出第一位置和第二位置。 第一半导体层结构与第二半导体层结构电绝缘。 最后,将第一接触层施加到衬底的自由表面,并且至少将第二接触层施加到第一和第二位置用于接触连接。
    • 50. 发明申请
    • Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip
    • 辐射发射和接收半导体芯片及其制造方法
    • US20050110026A1
    • 2005-05-26
    • US10951525
    • 2004-09-28
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • H01L31/12H01L27/15H01L31/173
    • H01L27/15H01L31/173
    • A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced apart from one another on a common substrate (3) and have at least one first contact layer (4). The first semiconductor layer construction (1) has an electromagnetic-radiation-generating region (5) arranged between p-conducting semiconductor layers (6) and n-conducting semiconductor layers (7) of the first semiconductor layer construction (1). A second contact layer (8) is at least partially arranged on that surface of the first semiconductor layer construction (1) which is remote from the substrate (3) and that of the second semiconductor layer construction (2). The second semiconductor layer construction (2) has an electromagnetic-radiation-absorbing region (9), the composition of the radiation-generating region (5) being different from that of the radiation-absorbing region (9).
    • 辐射发射和接收半导体部件至少具有用于发射辐射的第一半导体层结构(1)和用于接收辐射的第二半导体层结构(2),所述第二半导体层结构(2)以彼此间隔开的方式布置 公共衬底(3)并且具有至少一个第一接触层(4)。 第一半导体层结构(1)具有布置在第一半导体层结构(1)的p导电半导体层(6)和n导电半导体层(7)之间的电磁辐射产生区域(5)。 第二接触层(8)至少部分地布置在远离基板(3)的第一半导体层结构(1)的表面和第二半导体层结构(2)的表面上。 第二半导体层结构(2)具有电磁辐射吸收区域(9),辐射产生区域(5)的组成与辐射吸收区域(9)的组成不同。