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41. 发明授权

US08033314B2 Method for producing sintered magnet 有权
标题翻译：烧结磁铁的制造方法
公开(公告)号：US08033314B2
公开(公告)日：2011-10-11
申请号：US12382985
申请日：2009-03-27
申请人： Masashi Gotoh , Yoshihiko Minachi , Yoshihiro Enda , Shunichi Kudo , Tomohiko Aida
发明人： Masashi Gotoh , Yoshihiko Minachi , Yoshihiro Enda , Shunichi Kudo , Tomohiko Aida
IPC分类号： B22D27/09 , C04B35/00
CPC分类号： H01F41/0266 , C04B35/2633 , C04B35/2641 , C04B35/6261 , C04B35/6262 , C04B35/62685 , C04B35/632 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3275 , C04B2235/3277 , C04B2235/3284 , C04B2235/3296 , C04B2235/3298 , C04B2235/3418 , C04B2235/5409 , C04B2235/5445 , C04B2235/6022 , C04B2235/605 , C04B2235/767 , C04B2235/77 , C04B2235/788 , H01F1/11
摘要： A method for producing a sintered magnet comprising steps of; wet-pulverizing a magnetic powder under the presence of a surface active agent, drying said wet-pulverized magnetic powder 20 for obtaining magnetic powder to which said surface active agent is adhered, heating and kneading said dried magnetic powder 20 with binder resin to form pellet, melting said pellet and injecting said pellet in a mold to which magnetic field is applied, to form a preform body, and firing said preform body.
摘要翻译：一种制造烧结磁体的方法，包括以下步骤：在表面活性剂的存在下对磁性粉末进行湿式粉碎，干燥所述湿式粉碎磁性粉末20，以获得附着有所述表面活性剂的磁性粉末，加热和捏合所述干燥的磁粉20与粘合剂树脂形成颗粒熔化所述颗粒并将所述颗粒注射到施加有磁场的模具中，以形成预成型体本体，并且对所述预成型体进行烧制。

42. 发明授权

US07939627B2 Peptides comprising an epitope of the wilms tumor gene product 有权
标题翻译：包含wilms肿瘤基因产物的表位的肽
公开(公告)号：US07939627B2
公开(公告)日：2011-05-10
申请号：US12095418
申请日：2006-11-29
申请人： Toshio Nishihara , Masashi Gotoh
发明人： Toshio Nishihara , Masashi Gotoh
IPC分类号： A61K38/08
CPC分类号： C07K7/06 , A61K38/00 , A61K39/00 , A61K39/0011 , C07K14/4748 , C07K16/44 , C07K2317/10
摘要： A compound of formula (1): wherein X is a tyrosine residue or a methionine residue; Y and Z each are a single bond; R1 is a hydrogen atom; R2 is a hydroxy group; R3 is a hydrogen atom, alkyl group, amino group substituted alkylcarbonylamino; R4 is a hydrogen atom, alkyl group, carboxy group a group of formula (2): wherein W is an amino acid residue; m is 1 or 2; and n is an integer of 0 to 2, with the proviso that when n is 0, R3 is a hydrogen atom or an alkyl group, or a pharmaceutically acceptable salt thereof, and its use in cancer immunotherapy.
摘要翻译：式（1）的化合物：其中X是酪氨酸残基或甲硫氨酸残基; Y和Z各自为单键; R1是氢原子; R2是羟基; R3是氢原子，烷基，氨基取代的烷基羰基氨基; R4是氢原子，烷基，羧基，式（2）的基团：其中W是氨基酸残基; m为1或2; n为0〜2的整数，条件是当n为0时，R 3为氢原子或烷基，或其药学上可接受的盐及其在癌症免疫治疗中的用途。

43. 发明授权

US07589416B2 Substrate, electronic component, and manufacturing method of these 失效
标题翻译：基板，电子部件及其制造方法
公开(公告)号：US07589416B2
公开(公告)日：2009-09-15
申请号：US11420219
申请日：2006-05-24
申请人： Hajime Kuwajima , Masashi Gotoh
发明人： Hajime Kuwajima , Masashi Gotoh
IPC分类号： H01L23/12 , H01L23/053
CPC分类号： H05K1/116 , H05K1/0293 , H05K3/421 , H05K3/423 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0394 , H05K2201/09809 , H05K2203/0733 , H05K2203/1476 , H05K2203/173
摘要： To fill a conductive material in an opening portion formed in a base of an electronic component, a groove is formed to surround an opening in an upper conductor, and the upper conductor is divided into a first conductive portion and a second conductive portion surrounding the first conductive portion. A mask is formed such that a conductor to be filled in the opening portion may not contact the second conductive portion. Metal plate is grown from the side of a lower conductor in the opening portion by using the lower conductor as electrode to fill the opening portion with metal plate. The metal plate filled in the opening portion and the upper conductor are joined by plating by using the upper conductor or the lower conductor as electrode.
摘要翻译：为了填充形成在电子部件的基部中的开口部分中的导电材料，形成沟槽以包围上导体中的开口，并且上导体被分成第一导电部分和围绕第一导体部分的第二导电部分导电部分。形成掩模，使得填充在开口部分中的导体可以不接触第二导电部分。金属板通过使用下导体作为电极从开口部分中的下导体的侧面生长，以用金属板填充开口部分。填充在开口部分的金属板和上导体通过使用上导体或下导体作为电极通过电镀而接合。

44. 发明申请

US20070178184A1 Molding die unit 有权
标题翻译：成型模具单元
公开(公告)号：US20070178184A1
公开(公告)日：2007-08-02
申请号：US11655068
申请日：2007-01-19
申请人： Sadaki Satoh , Masashi Gotoh , Ken Kikuchi , Takeshi Itoh , Takuo Kataho
发明人： Sadaki Satoh , Masashi Gotoh , Ken Kikuchi , Takeshi Itoh , Takuo Kataho
IPC分类号： B29C47/08
CPC分类号： B22F3/03 , B29C43/361 , B29C2043/3618 , B29K2105/251
摘要： A molding die unit has a shell and a die. The die is located inside the shell. A die hole is formed in the die. The die has first and second portions. The first and second portions include their respective surfaces defining the die hole and facing each other. A first through hole is formed in the shell and penetrates so as to open in an outside surface and in an inside surface of the shell. A second through hole continuing to the first through hole is formed at a position corresponding to the first through hole and in the first portion. The second through hole includes a first region and a second region. The first region opens in a surface of the first portion facing the inside surface of the shell and has a first sectional area. The second region opens in the surface defining the die hole and has a second sectional area smaller than the first sectional area.
摘要翻译：成型模具单元具有壳体和模具。模具位于壳体内。在模具中形成模孔。模具具有第一和第二部分。第一和第二部分包括它们各自的表面，其界定模具孔并面对彼此。第一通孔形成在壳体中并穿透以在壳体的外表面和内表面中打开。在与第一通孔相对应的位置和第一部分中形成有连续到第一通孔的第二通孔。第二通孔包括第一区域和第二区域。第一区域在面向壳体的内表面的第一部分的表面中开口并且具有第一截面积。第二区域在限定模孔的表面中开口，并且具有小于第一截面积的第二截面面积。

45. 发明授权

US07237331B2 Electronic part manufacturing method and electronic part 失效
标题翻译：电子零件制造方法和电子零件
公开(公告)号：US07237331B2
公开(公告)日：2007-07-03
申请号：US10540249
申请日：2003-12-17
申请人： Masashi Gotoh , Kaoru Kawasaki , Mutsuko Nakano , Hiroshi Yamamoto
发明人： Masashi Gotoh , Kaoru Kawasaki , Mutsuko Nakano , Hiroshi Yamamoto
IPC分类号： H05K3/36
CPC分类号： H05K3/4647 , H05K3/4652 , H05K2203/0733 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155
摘要： Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of forming a wiring pattern and a columnar conductor and a second step of forming a layer having a uniform thickness by bonding an insulating sheet from above and pressing the insulating sheet to the height of the columnar conductor with the columnar conductor as a stopper so as to conform the thickness of the insulating sheet to the height of the columnar conductor are repeated.
摘要翻译：提供一种制造具有多个布线图案的电子部件的方法和插入在布线图案之间的绝缘层，并且用于通过穿透绝缘层的层间连接部分在布线图案之间建立电连接。在该方法中，形成布线图案和柱状导体的第一步骤和通过从上方粘合绝缘片而形成具有均匀厚度的层的第二步骤，并且用柱状物将绝缘片材压制成柱状导体的高度导体作为止动器，以使绝缘片的厚度与柱状导体的高度一致。

46. 发明申请

US20060223307A1 Process for producing electornic component and electronic component 失效
标题翻译：电子部件和电子部件的制造方法
公开(公告)号：US20060223307A1
公开(公告)日：2006-10-05
申请号：US10549571
申请日：2004-03-18
申请人： Masashi Gotoh , Kaoru Kawasaki , Hiroshi Yamamoto , Mutsuko Nakano
发明人： Masashi Gotoh , Kaoru Kawasaki , Hiroshi Yamamoto , Mutsuko Nakano
IPC分类号： H01L21/4763
CPC分类号： B23K26/382 , B23K26/389 , B23K26/40 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K1/0366 , H05K3/0035 , H05K3/421 , H05K3/423 , H05K2201/0347 , H05K2201/0394 , H05K2203/0733 , H05K2203/1476 , Y10T29/49155 , Y10T29/49165
摘要： Provided are a process for producing an electronic component which is superior in heat dissipation property, helps to achieve low resistivity, and makes it possible to prevent detachment of the conductor part from the base material, and an electronic component produced by such a process. The electronic component includes: a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole by the first plating layer, the electroless plating layer, and the second plating layer.
摘要翻译：提供了一种制造电子元件的方法，其具有优异的散热性能，有助于实现低电阻率，并且可以防止导体部件脱离基材，以及通过这种工艺制造的电子部件。电子部件包括：配备有芯材料并在其至少一个表面上具有导体层的基材; 从基材的另一面侧通过激光照射形成的通孔; 通过使用导体层作为电极以覆盖露出在通孔的内壁表面上的芯材形成的第一镀层; 化学镀层，其形成在所述第一镀层的上侧，并且与所述通孔的内壁面紧密接触; 以及通过使用导体层作为电极以覆盖化学镀层而形成的第二镀层。通过第一镀层，无电镀层和第二镀层在导通孔中形成导体部。

47. 发明授权

US06549101B2 Dielectric filter, and method of manufacturing the same 失效
标题翻译：介质滤波器及其制造方法
公开(公告)号：US06549101B2
公开(公告)日：2003-04-15
申请号：US09808166
申请日：2001-03-15
申请人： Masashi Gotoh , Kouji Tashiro
发明人： Masashi Gotoh , Kouji Tashiro
IPC分类号： H01P1205
CPC分类号： H01P11/007 , H01P1/2056
摘要： A plurality of resonators 50 are formed in a dielectric porcelain block 42, wherein each of the resonators 50 is formed by coating an interior surface of a through section with an interior conductor 54, thus constituting a dielectric filter 41. On a side surface 44 of the dielectric block 42 perpendicular to an open end face 43 having the through sections formed therein, there are formed protrusions 45 having a height L lower than that of the through sections. Terminal electrodes 60a and 60b are defined with the protrusions 45 taken as a boundary between the terminal electrodes 60a and 60b, and isolated from an exterior conductor 62.
摘要翻译：多个谐振器50形成在介电瓷块42中，其中每个谐振器50通过用内部导体54涂覆贯通部分的内表面而形成，从而构成介质滤波器41.在侧面44上与形成有贯通部的开放端面43垂直的介质块42形成有比通过部的高度L低的突出部45。端子电极60a和60b被限定为突起45作为端子电极60a和60b之间的边界，并且与外部导体62隔离。

48. 发明授权

US06548758B2 Electronic component and manufacturing method thereof 失效
标题翻译：电子元器件及其制造方法
公开(公告)号：US06548758B2
公开(公告)日：2003-04-15
申请号：US09768622
申请日：2001-01-25
申请人： Masashi Gotoh , Kouji Tashiro
发明人： Masashi Gotoh , Kouji Tashiro
IPC分类号： H01L2302
CPC分类号： H01G4/228 , H01G4/40 , H01P11/00 , H03H3/00 , H03H7/52 , H05K1/092 , H05K3/02 , H05K3/248 , H05K3/403 , H05K2203/0514
摘要： An electronic component including a dielectric block a first electrode conductor section having an exposed and developed photosensitive conductive paste on a principal surface of the dielectric block, and an inner peripheral electrode conductor section formed of a non-photosensitive conductive paste on an inner peripheral face of a through hole that is opened through the principal surface. Further, both electrode conductor sections are overlapped at least partly near an opening portion of the through hole on the principal plane to electrically conduct to make up of dielectric filter.
摘要翻译：一种电子部件，其特征在于，包括介质块，在所述介质块的主面上具有露出和显影的感光性导电膏的第一电极导体部和由所述介电块的内周面上的非感光性导电性糊状物构成的内周电极导体部通过主表面打开的通孔。此外，两个电极导体部分至少部分地重叠在主平面上的通孔的开口部附近，以导电以形成介质滤波器。

49. 发明授权

US09305689B2 Injection molding composition and producing method thereof 有权
标题翻译：注塑组合物及其制备方法
公开(公告)号：US09305689B2
公开(公告)日：2016-04-05
申请号：US14129646
申请日：2012-05-11
申请人： Naoto Tsukamoto , Mitsuaki Sugiyama , Takahiro Mori , Yoshihiko Minachi , Masashi Gotoh , Minao Himeno
发明人： Naoto Tsukamoto , Mitsuaki Sugiyama , Takahiro Mori , Yoshihiko Minachi , Masashi Gotoh , Minao Himeno
IPC分类号： C04B35/622 , C04B35/632 , C04B35/00 , B28B1/24 , H01F1/01 , C04B35/626 , C04B35/628 , C04B35/634
CPC分类号： H01F1/01 , B28B1/24 , C04B35/62685 , C04B35/62802 , C04B35/632 , C04B35/63408 , C04B35/6342 , C04B35/63424 , C04B35/63432 , C04B35/63436 , C04B35/63468 , C04B35/63488 , C04B2235/3274 , C04B2235/5409 , C04B2235/6022 , C04B2235/61 , C04B2235/77
摘要： An injection molding composition includes a ferrite powder which is a collection of ferrite particles, a first binder and a second binder, wherein a softening point of the second binder is lower than that of the first binder, a weight and a specific surface area of the ferrite powders are represented by Wp and S, and a weight and a density of the first binder and the second binder is represented by Wb1, Wb2, and Db1, Db2, and a hypothetical thickness Tb1 of the first binder is 0.6 to 3.0, and a hypothetical thickness Tb2 of the second binder is 5.0 to 16.0. In the composition, it is preferable that coated ferrite particles covering the outer circumference of the ferrite particles with the first binder and the second binder exist. Tb1 [nm]=(Wb1×103)/(Db1×Wp×S) formula (1) Tb2 [nm]=(Wb2×103)/(Db2×Wp×S) formula (2).
摘要翻译：注射成型组合物包括作为铁氧体颗粒的集合的铁氧体粉末，第一粘合剂和第二粘合剂，其中第二粘合剂的软化点低于第一粘合剂的软化点，重量和比表面积铁素体粉末由Wp和S表示，第一粘合剂和第二粘合剂的重量和密度由Wb1，Wb2和Db1，Db2表示，第一粘合剂的假想厚度Tb1为0.6〜3.0，第二粘合剂的假想厚度Tb2为5.0〜16.0。在该组成中，优选存在用第一粘合剂和第二粘合剂覆盖铁氧体颗粒的外周的被覆铁氧体颗粒。 Tb1 [nm] =（Wb1×103）/（Db1×Wp×S）式（1）Tb2 [nm] =（Wb2×103）/（Db2×Wp×S）式（2）。

50. 发明授权

US08765860B2 Injection molding composition and producing method thereof 有权
标题翻译：注塑组合物及其制备方法
公开(公告)号：US08765860B2
公开(公告)日：2014-07-01
申请号：US13595407
申请日：2012-08-27
申请人： Naoto Tsukamoto , Tomohiko Aida , Shinichi Sakano , Yoshihiko Minachi , Masashi Gotoh , Minao Himeno
发明人： Naoto Tsukamoto , Tomohiko Aida , Shinichi Sakano , Yoshihiko Minachi , Masashi Gotoh , Minao Himeno
IPC分类号： C08K5/04 , H01F1/01 , C08K3/22 , C08L25/06 , C08L23/04 , C08L23/10 , C08L27/06 , C08L31/04 , C08L33/08 , C08L77/00 , H01F1/36
CPC分类号： C04B35/26 , C04B35/62802 , C04B35/62894 , C04B35/62897 , C04B35/63408 , C04B35/63416 , C04B35/63424 , C04B35/63432 , C04B35/63436 , C04B35/63468 , C04B2235/5409 , C04B2235/6022 , C04B2235/61 , C04B2235/77
摘要： An injection molding composition, having a small fluctuation characteristic and a better characteristic, is provided. The above composition is the injection molding composition comprising a ferrite powder which is a collection of ferrite particles, a first binder and a second binder. A weight and a specific surface area of the ferrite powders are represented by Wp and S, and a weight and a density of the first binder and the second binder is represented by Wb1, Wb2, and Db1, Db2. A hypothetical thickness Tb1 of the first binder is 2.0 to 15.0, and a hypothetical thickness Tb2 of the second binder is 16.5 to 32.0. In the composition, it is preferable that coated ferrite particles coating the outer circumference of the ferrite particles with the first binder and the second binder exist. Tb1 [nm]=(Wb1×103)/(Db1×Wp×S) formula (1) Tb2 [nm]=(Wb2×103)/(Db2×Wp×S) formula (2)
摘要翻译：提供了具有小的波动特性和更好的特性的注塑组合物。上述组合物是包含作为铁氧体颗粒的集合体的铁氧体粉末，第一粘合剂和第二粘合剂的注塑组合物。铁素体粉末的重量和比表面积由Wp和S表示，第一粘合剂和第二粘合剂的重量和密度由Wb1，Wb2和Db1，Db2表示。第一粘合剂的假想厚度Tb1为2.0〜15.0，第二粘合剂的假想厚度Tb2为16.5〜32.0。在组合物中，优选存在用第一粘合剂和第二粘合剂涂覆铁氧体颗粒的外周的被覆铁氧体颗粒。公式（1）Tb2 [nm] =（Wb1×103）/（Db1×Wp×S）Tb2 [nm] =（Wb2×103）/（Db2×Wp×S）

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