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    • 41. 发明申请
    • INTEGRATED CIRCUIT STRUCTURE
    • 集成电路结构
    • US20100148168A1
    • 2010-06-17
    • US12494304
    • 2009-06-30
    • Chih-Ming LaiChun-Cheng ChengYung-Hui Yeh
    • Chih-Ming LaiChun-Cheng ChengYung-Hui Yeh
    • H01L29/24
    • H01L29/45H01L27/1225H01L27/1233H01L27/1251
    • An integrated circuit structure including a substrate, an insulating layer, a first transistor and a second transistor is provided. The insulating layer, the first transistor and the second transistor are disposed on the substrate. The first transistor includes a first gate, a first oxide semiconductor layer, a first source and a first drain. A portion of the first source and the first drain directly contacting the first oxide semiconductor layer is composed of a Ti-containing metal. The second transistor includes a second gate, a second oxide semiconductor layer, a second source and a second drain. A portion of the second source and the second drain directly contacting the second oxide semiconductor layer is composed of a none-Ti-containing metal. In addition, the first oxide semiconductor layer and the second oxide semiconductor layer may have different thickness or different carrier concentrations.
    • 提供了包括基板,绝缘层,第一晶体管和第二晶体管的集成电路结构。 绝缘层,第一晶体管和第二晶体管设置在基板上。 第一晶体管包括第一栅极,第一氧化物半导体层,第一源极和第一漏极。 与第一氧化物半导体层直接接触的第一源极和第一漏极的一部分由含钛金属构成。 第二晶体管包括第二栅极,第二氧化物半导体层,第二源极和第二漏极。 与第二氧化物半导体层直接接触的第二源极和第二漏极的一部分由不含Ti的金属构成。 此外,第一氧化物半导体层和第二氧化物半导体层可以具有不同的厚度或不同的载流子浓度。
    • 42. 发明授权
    • Method, apparatus, and system for LPC hot spot fix
    • LPC热点修复的方法,设备和系统
    • US07725861B2
    • 2010-05-25
    • US11689197
    • 2007-03-21
    • Yi-Kan ChengChih-Ming LaiRu-Gun Liu
    • Yi-Kan ChengChih-Ming LaiRu-Gun Liu
    • G06F17/50
    • G06F17/5077
    • Efficient and cost-effective systems and methods for detecting and correcting hot spots of semiconductor devices are disclosed. In one aspect, a method for creating a layout from a circuit design is described. The method includes applying a first set of hot spot conditions to a global route to produce a detailed route; applying a second set of hot spot conditions to the detailed route to produce a post-detailed route; and applying a third set of hot spot conditions to the post-detailed route to produce the layout. In another aspect, a method includes providing a circuit design; applying a first hot spot filter to a global routing of the circuit design to produce a detailed route; applying a less pessimistic, second hot spot filter to the detailed route to produce a post-detailed route; and performing a rip-up and reroute of the post-detailed route to produce a final layout.
    • 公开了用于检测和校正半导体器件的热点的高效且成本有效的系统和方法。 在一个方面,描述了一种用于从电路设计创建布局的方法。 该方法包括将第一组热点条件应用于全局路由以产生详细路由; 将第二组热点条件应用于详细路线以产生后详细路线; 以及将第三组热点条件应用于后详细路线以产生布局。 另一方面,一种方法包括提供电路设计; 将第一热点滤波器应用于电路设计的全局路由以产生详细的路由; 在详细的路线上应用较不悲观的第二热点过滤器,以产生详细的路线; 并执行后期详细路线的撤销和重新路线以产生最终布局。
    • 50. 发明申请
    • WHITE LIGHT EMITTING DEVICE AND METHOD FOR MAKING SAME
    • 白光发射装置及其制造方法
    • US20090058263A1
    • 2009-03-05
    • US12135853
    • 2008-06-09
    • Chih-Ming Lai
    • Chih-Ming Lai
    • H01J1/62
    • H01L33/20H01L33/007H01L33/0079H01L33/508
    • A white light emitting device and a method for making the same are provided. The white light emitting device includes a light emitting diode (LED) chip, a fluorescent layer and a reflective layer. The LED chip includes a substrate and a light emitting structure formed on the substrate. The LED chip has a plurality of side walls. The light emitting structure includes a first-type semiconductor layer, an active layer and a second-type semiconductor layer arranged in that order along a direction away from the substrate. The substrate has through hole formed therethrough and the first-type semiconductor layer is partially exposed. The fluorescent layer is formed in the through hole for wavelength conversion. The reflective layer is formed on the side walls and surrounds the LED chip.
    • 提供白色发光器件及其制造方法。 白色发光器件包括发光二极管(LED)芯片,荧光层和反射层。 LED芯片包括形成在基板上的基板和发光结构。 LED芯片具有多个侧壁。 发光结构包括沿着离开衬底的方向依次布置的第一类型半导体层,有源层和第二类型半导体层。 基板具有通过其形成的通孔,并且第一类型半导体层部分地露出。 荧光层形成在用于波长转换的通孔中。 反射层形成在侧壁上并围绕LED芯片。