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41. 发明授权

US07508058B2 Stacked integrated circuit module 有权
标题翻译：堆叠式集成电路模块
公开(公告)号：US07508058B2
公开(公告)日：2009-03-24
申请号：US11330307
申请日：2006-01-11
申请人： James Douglas Wehrly, Jr.
发明人： James Douglas Wehrly, Jr.
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L23/34 , H01L23/04 , H01L29/40
CPC分类号： H05K1/189 , H01L23/13 , H01L23/5385 , H01L23/5387 , H01L25/18 , H01L2924/0002 , H05K1/147 , H05K1/182 , H05K3/326 , H05K2201/056 , H05K2201/091 , H05K2201/10515 , H05K2201/10689 , H01L2924/00
摘要： The present invention provides an improvement on the use of flexible circuit connectors for electrically coupling IC devices to one another in a stacked configuration by use of the flexible circuit to provide the connection of the stacked IC module to other circuits. Use of the flexible circuit as the connection of the IC module allows the flexible circuit to provide strain relief and allows stacked IC modules to be assembled with a lower profile than with previous methods. The IC module can be connected to external circuits through the flexible circuit connectors by a variety of means, including solder pads, edge connector pads, and socket connectors. This allows for IC devices to occupy less space then with previous methods, which is beneficial in modules such as memory modules with multiple, stacked memory devices.
摘要翻译：本发明提供了使用柔性电路连接器来改进使用柔性电路将叠层IC模块连接到其它电路的层叠结构中的IC器件彼此电连接的柔性电路连接器。使用柔性电路作为IC模块的连接允许柔性电路提供应变消除，并允许堆叠的IC模块以比以前的方法更低的轮廓组装。 IC模块可以通过各种方式通过柔性电路连接器连接到外部电路，包括焊盘，边缘连接器焊盘和插座连接器。这允许IC器件占用较少的空间，然后使用先前的方法，这在诸如具有多个堆叠的存储器件的存储器模块的模块中是有益的。

42. 发明授权

US06806120B2 Contact member stacking system and method 有权
公开(公告)号：US06806120B2
公开(公告)日：2004-10-19
申请号：US10092104
申请日：2002-03-06
申请人： James Douglas Wehrly, Jr.
发明人： James Douglas Wehrly, Jr.
IPC分类号： H01L2144
CPC分类号： H01L25/105 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H01L2924/00
摘要： A system and method for selectively stacking and interconnecting individual integrated circuit devices to create a high-density integrated circuit module. In a preferred embodiment, conventional thin small outline packaged (TSOP) memory circuits are vertically stacked one above the other. The constituent IC elements act in concert to provide an assembly of memory capacity approximately equal to the sum of the capacities of the ICs that constitute the assembly. The IC elements of the stack are electrically connected through individual contact members that connect corresponding leads of IC elements positioned adjacently in the stack. In a preferred embodiment, the contact members are composed of lead frame material. Methods for creating stacked integrated circuit modules are provided that provide reasonable cost, mass production techniques to produce modules. In a preferred method, a carrier frame of lead frame material is configured to present an opening into which opening project plural lead-like contact members that correspond to the leads of an IC element. The contact members contact the leads of the lower IC element of the stack while the leads of the upper IC of the assembly contact the upper surfaces of the contact members. The stack is assembled using typical surface mount equipment and, after assembly, the carrier portion of the frame is removed to leave the plurality of contact members in place between selected leads.

43. 发明授权

US06462408B1 Contact member stacking system and method 有权
公开(公告)号：US06462408B1
公开(公告)日：2002-10-08
申请号：US09819171
申请日：2001-03-27
申请人： James Douglas Wehrly, Jr.
发明人： James Douglas Wehrly, Jr.
IPC分类号： H01L2302
CPC分类号： H01L25/105 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H01L2924/00
摘要： A system and method for selectively stacking and interconnecting individual integrated circuit devices to create a high-density integrated circuit module. In a preferred embodiment, conventional thin small outline packaged (TSOP) memory circuits are vertically stacked one above the other. The constituent IC elements act in concert to provide an assembly of memory capacity approximately equal to the sum of the capacities of the ICs that constitute the assembly. The IC elements of the stack are electrically connected through individual contact members that connect corresponding leads of IC elements positioned adjacently in the stack. In a preferred embodiment, the contact members are composed of lead frame material. Methods for creating stacked integrated circuit modules are provided that provide reasonable cost, mass production techniques to produce modules. In a preferred method, a carrier frame of lead frame material is configured to present an opening into which opening project plural lead-like contact members that correspond to the leads of an IC element. The contact members contact the leads of the lower IC element of the stack while the leads of the upper IC of the assembly contact the upper surfaces of the contact members. The stack is assembled using typical surface mount equipment and, after assembly, the carrier portion of the frame is removed to leave the plurality of contact members in place between selected leads.

44. 发明授权

US07606050B2 Compact module system and method 有权
标题翻译：紧凑型模块系统和方法
公开(公告)号：US07606050B2
公开(公告)日：2009-10-20
申请号：US11187269
申请日：2005-07-22
申请人： James W. Cady , James Douglas Wehrly, Jr. , Paul Goodwin
发明人： James W. Cady , James Douglas Wehrly, Jr. , Paul Goodwin
IPC分类号： H05K7/00
CPC分类号： H05K1/189 , H05K2201/056 , H05K2201/10159 , H05K2201/10189
摘要： A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.
摘要翻译：柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置为机械地适应应用环境。

45. 发明授权

US07542297B2 Optimized mounting area circuit module system and method 有权
标题翻译：优化安装区电路模块系统及方法
公开(公告)号：US07542297B2
公开(公告)日：2009-06-02
申请号：US11255061
申请日：2005-10-19
申请人： James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
IPC分类号： H05K1/00
CPC分类号： H05K1/189 , H01L25/0652 , H01L25/105 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572 , H01L2924/00
摘要： A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。刚性基板被配置为在其上布置有人造弹性体的一侧上提供空间，而在一些实施例中，热管理或冷却结构布置在模块的一侧以减轻模块中的热积聚。

46. 发明申请

US20090046431A1 High Capacity Thin Module System 有权
标题翻译：大容量薄模块系统
公开(公告)号：US20090046431A1
公开(公告)日：2009-02-19
申请号：US12258189
申请日：2008-10-24
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

47. 发明授权

US07468553B2 Stackable micropackages and stacked modules 有权
标题翻译：可堆叠的微型封装和堆叠模块
公开(公告)号：US07468553B2
公开(公告)日：2008-12-23
申请号：US11682643
申请日：2007-03-06
申请人： Leland Szewerenko , Paul Goodwin , James Douglas Wehrly, Jr.
发明人： Leland Szewerenko , Paul Goodwin , James Douglas Wehrly, Jr.
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/48 , H01L2224/48227 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.
摘要翻译：本发明提供了一种用于设计可堆叠组件的系统和方法，所述可堆叠组件可以被堆叠以产生堆叠电路模块。一个或多个集成电路（IC）管芯设置在再分配衬底的一个或多个侧面上，其优选地是柔性电路。在一些优选的实施方案中，将芯片和再分布衬底结合在一起并进行引线键合。两个或多个可堆叠组件通过框架构件相互连接，以产生低轮廓的高密度堆叠电路模块。

48. 发明授权

US07310458B2 Stacked module systems and methods 有权
标题翻译：堆叠模块系统和方法
公开(公告)号：US07310458B2
公开(公告)日：2007-12-18
申请号：US11258438
申请日：2005-10-25
申请人： James Douglas Wehrly, Jr.
发明人： James Douglas Wehrly, Jr.
IPC分类号： G02B6/12 , H05K1/00 , H01L23/02
CPC分类号： H01L25/50 , H01L25/105 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be employed with CSP devices of a variety of configurations either with or without form standards.
摘要翻译：本发明提供用于构建具有柔性电路的堆叠电路模块和前体组件的方法。使用本发明的方法，可以将具有铰接为一个或两个柔性电路的单组柔性电路与具有或不具有形式标准的各种配置的CSP装置一起使用。

49. 发明授权

US07259452B2 Leaded package integrated circuit stacking 有权
标题翻译：引线封装集成电路堆叠
公开(公告)号：US07259452B2
公开(公告)日：2007-08-21
申请号：US11248662
申请日：2005-10-11
申请人： James Douglas Wehrly, Jr. , David Roper
发明人： James Douglas Wehrly, Jr. , David Roper
IPC分类号： H01L23/02
CPC分类号： H05K1/147 , H01L23/49827 , H01L23/5387 , H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/141 , H05K1/189 , H05K3/3421 , H05K2201/049 , H05K2201/056 , H05K2201/09445 , H05K2201/10515 , H05K2201/10689 , H01L2924/00
摘要： A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of the ICs. Thus, the flex does not require discrete leads which must be individually aligned with the individual leads of the constituent ICs employed in the stack. The principle may be employed to aggregate two or more contact areas for respective connection to leads of constituent ICs but is most profitably employed with a continuous connective field that provides contact areas for many leads of the ICs.
摘要翻译：提供了一种用于将堆叠配置中的相邻IC封装彼此电和热耦合的系统和方法。将柔性电路部分地插入待堆叠的IC之间，并提供连接到IC的各个引线的多个接触区域的连接场。因此，flex不需要离散引线，它们必须与堆叠中采用的构成IC的单个引线单独对准。该原理可以用于聚合两个或更多个接触区域，以用于分别连接到构成IC的引线，但是对于提供IC的许多引线的接触面积的连续连接场最有利地使用。

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