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    • 41. 发明授权
    • Test pattern of semiconductor device and test method using the same
    • 半导体器件的测试图案及使用其的测试方法
    • US07436198B2
    • 2008-10-14
    • US11542589
    • 2006-10-03
    • Jong-Hyun Lee
    • Jong-Hyun Lee
    • G01R31/26
    • G01R31/2884
    • There are provided a test pattern of a semiconductor device and a test method using the same. The test pattern of the semiconductor device includes a conductive pattern disposed on a semiconductor substrate, and the conductive pattern includes a plurality of line regions, which are aligned in parallel, and spaced at a uniform interval, and a plurality of connecting regions for connecting the plurality of line regions in a zigzag shape. The test pattern includes a plurality of transistors electrically switching first ends of the adjacent line regions corresponding to the connecting region, and each transistor includes a source region, which is electrically connected to one end of one of the adjacent line regions, and a drain region, which is electrically connected to one end of the other one of the adjacent line regions. Further, a transistor selecting part is electrically connected to gates of the plurality of transistors, for selecting one of the plurality of transistors or a combination thereof.
    • 提供半导体器件的测试图案和使用其的测试方法。 半导体器件的测试图案包括布置在半导体衬底上的导电图案,并且导电图案包括平行排列并且间隔均匀的多个线区域,以及多个连接区域 多个线形区域以Z字形形状。 测试图案包括多个晶体管,其电连接与连接区域相对应的相邻线区域的第一端,并且每个晶体管包括电连接到一个相邻线区域的一端的源极区域和漏极区域 ,其电连接到另一个相邻线区域的一端。 此外,晶体管选择部分电连接到多个晶体管的栅极,用于选择多个晶体管中的一个或其组合。
    • 42. 发明授权
    • Test pattern of semiconductor device and test method using the same
    • 半导体器件的测试图案及使用其的测试方法
    • US07161374B2
    • 2007-01-09
    • US11028784
    • 2005-01-04
    • Jong-Hyun Lee
    • Jong-Hyun Lee
    • G01R31/26
    • G01R31/2884
    • There are provided a test pattern of a semiconductor device and a test method using the same. The test pattern of the semiconductor device includes a conductive pattern disposed on a semiconductor substrate, and the conductive pattern includes a plurality of line regions, which are aligned in parallel, and spaced at a uniform interval, and a plurality of connecting regions for connecting the plurality of line regions in a zigzag shape. The test pattern includes a plurality of transistors electrically switching first ends of the adjacent line regions corresponding to the connecting region, and each transistor includes a source region, which is electrically connected to one end of one of the adjacent line regions, and a drain region, which is electrically connected to one end of the other one of the adjacent line regions. Further, a transistor selecting part is electrically connected to gates of the plurality of transistors, for selecting one of the plurality of transistors or a combination thereof.
    • 提供半导体器件的测试图案和使用其的测试方法。 半导体器件的测试图案包括布置在半导体衬底上的导电图案,并且导电图案包括平行排列并且间隔均匀的多个线区域,以及多个连接区域 多个线形区域以Z字形形状。 测试图案包括多个晶体管,其电连接与连接区域相对应的相邻线区域的第一端,并且每个晶体管包括电连接到一个相邻线区域的一端的源极区域和漏极区域 ,其电连接到另一个相邻线区域的一端。 此外,晶体管选择部分电连接到多个晶体管的栅极,用于选择多个晶体管中的一个或其组合。
    • 43. 发明申请
    • Analytic structure for failure analysis of semiconductor device
    • 半导体器件故障分析分析结构
    • US20060175668A1
    • 2006-08-10
    • US11346678
    • 2006-02-03
    • Ki-Am LeeJong-Hyun Lee
    • Ki-Am LeeJong-Hyun Lee
    • H01L29/76
    • H01L27/1104H01L27/11
    • In an analytic structure for failure analysis of a semiconductor device, a plurality of analytic regions are arranged in regions of a semiconductor substrate. A plurality of semiconductor transistors having an array structure are arranged in each of the analytic regions. A plurality of interconnection structures connect the semiconductor transistors, each comprising multiple layered metal patterns and multiple layered plugs interposed between the multiple layered metal patterns. A first number of layers of the multiple layered metal patterns and multiple layered plugs is different in one of the analytic regions than a second number of layers of the multiple layered metal patterns and multiple layered plugs in another one of the analytic regions.
    • 在用于半导体器件的故障分析的分析结构中,多个分析区域布置在半导体衬底的区域中。 在每个分析区域中布置有具有阵列结构的多个半导体晶体管。 多个互连结构连接半导体晶体管,每个半导体晶体管包括多层金属图案和插入在多层金属图案之间的多个分层插塞。 在多个分层金属图案和多个分层塞子的第一层中,一个分析区域中的多层金属图案的第二数量层和另一个分析区域中的多个分层塞子是不同的。
    • 45. 发明申请
    • Test pattern of semiconductor device and test method using the same
    • 半导体器件的测试图案及使用其的测试方法
    • US20050156617A1
    • 2005-07-21
    • US11028784
    • 2005-01-04
    • Jong-Hyun Lee
    • Jong-Hyun Lee
    • G01R31/02G01R31/28H01L21/66H01L21/822H01L27/04G01R31/26
    • G01R31/2884
    • There are provided a test pattern of a semiconductor device and a test method using the same. The test pattern of the semiconductor device includes a conductive pattern disposed on a semiconductor substrate, and the conductive pattern includes a plurality of line regions, which are aligned in parallel, and spaced at a uniform interval, and a plurality of connecting regions for connecting the plurality of line regions in a zigzag shape. The test pattern includes a plurality of transistors electrically switching first ends of the adjacent line regions corresponding to the connecting region, and each transistor includes a source region, which is electrically connected to one end of one of the adjacent line regions, and a drain region, which is electrically connected to one end of the other one of the adjacent line regions. Further, a transistor selecting part is electrically connected to gates of the plurality of transistors, for selecting one of the plurality of transistors or a combination thereof.
    • 提供半导体器件的测试图案和使用其的测试方法。 半导体器件的测试图案包括布置在半导体衬底上的导电图案,并且导电图案包括平行排列并且间隔均匀的多个线区域,以及多个连接区域 多个线形区域以Z字形形状。 测试图案包括多个晶体管,其电连接与连接区域相对应的相邻线区域的第一端,并且每个晶体管包括电连接到一个相邻线区域的一端的源极区域和漏极区域 ,其电连接到另一个相邻线区域的一端。 此外,晶体管选择部分电连接到多个晶体管的栅极,用于选择多个晶体管中的一个或其组合。
    • 46. 发明授权
    • Method of fabricating semiconductor device including forming contact hole with anisotropic and isotropic etching and forming discontinuous barrier layer
    • 制造半导体器件的方法包括:形成具有各向异性和各向同性蚀刻的接触孔并形成不连续的阻挡层
    • US06800549B2
    • 2004-10-05
    • US10705480
    • 2003-11-10
    • Jong-Hyun Lee
    • Jong-Hyun Lee
    • H01L214763
    • H01L21/76844H01L21/76805H01L21/76807H01L21/76832H01L21/76834H01L21/76868H01L21/76877H01L23/5226H01L23/53238H01L2924/0002H01L2924/00
    • In a semiconductor device with a via contact including a barrier metal layer and a method for fabricating the same, a lower metal interconnection is formed over a substrate. An ILD is formed on the lower metal interconnection and has a lower barrier layer and an upper barrier layer that have an etch selectivity with respect to each other. An upper metal interconnection is formed over the ILD and is separated from the lower metal interconnection by the ILD. A via contact plug penetrates the ILD to connect the lower and upper metal interconnections. The via contact plug is formed such that a portion crossing the lower barrier layer is formed to have a greater width as compared to a portion crossing the upper barrier layer. The barrier metal layer, which is formed to encompass sidewalls and a bottom of an inner metal layer of the via contact plug, forms a discontinuous part which does not exist at the portion crossing the lower barrier layer. Thus, the inner metal layer of the contact plug is in direct contact with the lower metal interconnection. The upper and lower barrier layers are layers that serve as a barrier to copper, such as a silicon nitride layer or silicon carbide layer. However, the upper and lower barrier layers are composed of different material layers so as to have etch selectivity with respect to each other.
    • 在具有包括阻挡金属层的通孔接触的半导体器件及其制造方法中,在衬底上形成下部金属互连。 在下金属互连上形成有ILD,并且具有相对于彼此具有蚀刻选择性的下阻挡层和上阻挡层。 在ILD上形成上金属互连,并且通过ILD与下金属互连分离。 通孔接触插头穿透ILD以连接下部和上部金属互连。 通孔接触插塞形成为与穿过上阻挡层的部分相比,与下阻挡层交叉的部分形成为具有更大的宽度。 形成为包围通孔接触塞的内金属层的侧壁和底部的阻挡金属层在与下阻挡层交叉的部分形成不存在的不连续部分。 因此,接触插塞的内金属层与下金属互连直接接触。 上阻挡层和下阻挡层是用作铜的屏障的层,例如氮化硅层或碳化硅层。 然而,上阻挡层和下阻挡层由不同的材料层组成,以便相对于彼此具有蚀刻选择性。