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41. 发明申请

US20110061898A1 REDUCING CROSS-TALK IN HIGH SPEED CERAMIC PACKAGES USING SELECTIVELY-WIDENED MESH 审中-公开
标题翻译：使用选择性更宽的MESH降低高速陶瓷包装中的交叉点
公开(公告)号：US20110061898A1
公开(公告)日：2011-03-17
申请号：US12560133
申请日：2009-09-15
申请人： Bhyrav Mutnury , Jinwoo Choi , Moises Cases , Nanju Na
发明人： Bhyrav Mutnury , Jinwoo Choi , Moises Cases , Nanju Na
IPC分类号： H05K1/00 , G06F17/50 , H05K3/00
CPC分类号： H05K1/0224 , G06F17/5036 , G06F17/5081 , G06F2217/82 , H05K3/4629 , H05K2201/09681 , H05K2201/09727 , H05K2201/09972 , Y10T29/49155
摘要： One embodiment of the invention provides a multi-layered ceramic package. The ceramic package includes a signal layer having a plurality of signal lines and a mesh reference layer parallel to the signal layer. The mesh reference layer includes a plurality of intersecting reference lines of varying reference-line width in the plane of the mesh layer. The mesh reference lines may be widened in locations of probable signal cross-talk. Other embodiments of the invention include software for optimizing a ceramic package design by selectively widening mesh lines in regions of probable cross-talk, and systems for designing and manufacturing such a ceramic package.
摘要翻译：本发明的一个实施例提供一种多层陶瓷封装。陶瓷封装包括具有多个信号线的信号层和与信号层平行的网格参考层。网格参考层包括在网格层的平面中改变参考线宽度的多个相交参考线。网格参考线可能在可能的信号串扰的位置加宽。本发明的其它实施例包括通过在可能的串扰区域中选择性地加宽网格线来优化陶瓷封装设计的软件，以及用于设计和制造这种陶瓷封装的系统。

42. 发明申请

US20100229131A1 SWARM INTELLIGENCE FOR ELECTRICAL DESIGN SPACE MODELING AND OPTIMIZATION 有权
标题翻译：电气设计空间建模与优化的SWARM智能
公开(公告)号：US20100229131A1
公开(公告)日：2010-09-09
申请号：US12398535
申请日：2009-03-05
申请人： Moises Cases , Jinwoo Choi , Bhyrav Mutnury , Navraj Singh , Caleb J. Wesley
发明人： Moises Cases , Jinwoo Choi , Bhyrav Mutnury , Navraj Singh , Caleb J. Wesley
IPC分类号： G06F17/50
CPC分类号： G06F17/5045 , G06F2217/08
摘要： A method, system, and computer program product for exploring and optimizing an electrical design space. A computer receiving a design space assigns a plurality of initial values (random or predetermined) for optimizing the design space. A particle swarm containing a plurality of particles is created and an optimization of the design space is then performed using the assigned initial values. Following completion of optimization, the global best and personal best for each particle are updated. Velocity vectors and position vectors of the design space are then updated before the computer performs the optimization process again. The process loops, continually updating global and personal bests and velocity and position vectors until a termination criteria is reached. Upon reaching the termination criteria, the best fitness of each particle of the swarm is assigned as an optimized design space. In an alternate embodiment, the particle with the worst target fitness may be assigned.
摘要翻译：一种用于探索和优化电气设计空间的方法，系统和计算机程序产品。接收设计空间的计算机分配用于优化设计空间的多个初始值（随机或预定）。产生包含多个粒子的粒子群，然后使用分配的初始值来执行设计空间的优化。在优化完成后，更新每个粒子的全球最佳和个人最好的。然后在计算机再次执行优化处理之前更新设计空间的速度向量和位置向量。过程循环，持续更新全局和个人最佳状态以及速度和位置向量，直到达到终止标准。达到终止标准后，群体的每个粒子的最佳适应度被指定为优化的设计空间。在替代实施例中，可以分配具有最差目标适应度的粒子。

43. 发明申请

US20080204127A1 Method for Ultimate Noise Isolation in High-Speed Digital Systems on Packages and Printed Circuit Boards (PCBS) 失效
标题翻译：封装和印刷电路板（PCBS）高速数字系统中极限噪声隔离方法
公开(公告)号：US20080204127A1
公开(公告)日：2008-08-28
申请号：US11679951
申请日：2007-02-28
申请人： Jinwoo Choi
发明人： Jinwoo Choi
IPC分类号： H03B1/04
CPC分类号： H05K1/0236 , H01Q15/006 , H05K1/167 , H05K3/4641 , H05K2201/09309 , H05K2201/09681
摘要： Improved noise isolation for high-speed digital systems on packages and printed circuit boards is provided by the use of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures and a power island configured to provide ultimate noise isolation. A power island is surrounded by a plurality of mixed AI-EBG structures to provide a power distribution network. In this structure, the gap around the power island provides excellent isolation from DC to the first cavity resonant frequency which is determined by the size of the structure and dielectric material. One AI-EBG structure provides excellent isolation from the first cavity resonant frequency of around 1.5 GHz to 5 GHz. The other AI-EBG structure provides excellent noise isolation from 5 GHz to 10 GHz. Through use of this novel configuration of AI-EBG structures, a combination effect of the hybrid AI-EBG structure provides excellent isolation far in excess of 10 GHz. The AI-EBG structure is a metallic-dielectric EBG structure that comprises two metal layers separated by a thin dielectric material (similar to power/ground planes in packages and PCBs). However, in the AI-EBG structure, only one of the metal layers has a periodic pattern which is preferably a two-dimensional rectangular lattice with each element consisting of a metal patch with four connecting metal branches.
摘要翻译：通过使用混合交替阻抗电磁带隙（AI-EBG）结构和配置为提供最佳噪声隔离的功率岛，提供了封装和印刷电路板上高速数字系统的改进的噪声隔离。功率岛由多个混合的AI-EBG结构包围以提供配电网络。在这种结构中，功率岛周围的间隙提供了从DC到第一腔谐振频率的良好隔离，该谐振频率由结构和介电材料的尺寸决定。一个AI-EBG结构提供了与大约1.5GHz至5GHz的第一腔共振频率的良好隔离。其他AI-EBG结构提供了从5 GHz到10 GHz的出色的噪声隔离。通过使用这种新颖的AI-EBG结构，混合AI-EBG结构的组合效果提供了超过10GHz的极好隔离。 AI-EBG结构是金属电介质EBG结构，其包括由薄的介电材料隔开的两个金属层（类似于封装和PCB中的电源/接地层）。然而，在AI-EBG结构中，只有一个金属层具有周期性图案，其优选地是二维矩形格子，每个元件由具有四个连接金属分支的金属贴片组成。

44. 发明申请

US20080068818A1 METHOD AND APPARATUS FOR PROVIDING ULTRA-WIDE BAND NOISE ISOLATION IN PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：用于在印刷电路板中提供超宽带噪声隔离的方法和装置
公开(公告)号：US20080068818A1
公开(公告)日：2008-03-20
申请号：US11533043
申请日：2006-09-19
申请人： Jinwoo Choi
发明人： Jinwoo Choi
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09681
摘要： A printed circuit board having ultra-wide band noise isolation is disclosed. The printed circuit board includes a first metal plane, a second metal plane, and a dielectric layer formed between the first and second metal planes. Two groups of noise isolation structures are formed within one of the metal planes, and the noise isolation structures in each group have a different size than those of the other group.
摘要翻译：公开了一种具有超宽带噪声隔离的印刷电路板。印刷电路板包括形成在第一和第二金属平面之间的第一金属平面，第二金属平面和介电层。在一个金属平面内形成两组噪声隔离结构，每组噪声隔离结构的尺寸与其他组的尺寸不同。

45. 发明申请

US20060050010A1 Electromagnetic bandgap structure for isolation in mixed-signal systems 失效
标题翻译：电磁带隙结构用于混合信号系统中的隔离
公开(公告)号：US20060050010A1
公开(公告)日：2006-03-09
申请号：US10936774
申请日：2004-09-08
申请人： Jinwoo Choi , Madhavan Swaminathan , Vinu Govind
发明人： Jinwoo Choi , Madhavan Swaminathan , Vinu Govind
IPC分类号： H01Q15/02
CPC分类号： H01Q15/006
摘要： Electromagnetic bandgap (EBG) structures, systems incorporating EBG structures, and methods of making EBG structures, are disclosed. An embodiment of the structure, among others, includes a plurality of first elements disposed on a first plane of a device; and a second element connecting each first element to an adjacent first element, the second element being disposed on the first plane of the device. The structure is configured to substantially filter electromagnetic waves to a stopband floor of about −40 dB to about −120 dB in a bandgap of about 100 MHz to about 50 GHz having a width selected from about 1 GHz, 2 GHz, 3 GHz, 5 GHz, 10 GHz, 20 GHz, and 30 GHz. In addition, the structure has a center frequency positioned at a frequency from about 1 GHz to 37 GHz.
摘要翻译：公开了电磁带隙（EBG）结构，并入EBG结构的系统，以及制造EBG结构的方法。该结构的实施例尤其包括设置在装置的第一平面上的多个第一元件; 以及将每个第一元件连接到相邻的第一元件的第二元件，所述第二元件设置在所述器件的第一平面上。该结构被配置为在约100MHz至约50GHz的带隙中基本上将电磁波滤波到约-40dB至约-120dB的阻带层，其宽度选自约1GHz，2GHz，3GHz，5 GHz，10 GHz，20 GHz和30 GHz。此外，该结构具有位于从约1GHz至37GHz的频率的中心频率。

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