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    • 43. 发明申请
    • External volume insensitive flow verification
    • 外部体积不灵敏流量验证
    • US20060217903A1
    • 2006-09-28
    • US11090120
    • 2005-03-25
    • Ali ShajiiDaniel Smith
    • Ali ShajiiDaniel Smith
    • G01F1/00
    • G01F25/0038G01F25/0053
    • A flow verifier for in-situ verification of a device under test (DUT), including an inlet connectable to a DUT, an outlet connectable to a vacuum pump for drawing gas through the DUT and the flow verifier, a vessel having a predetermined volume, diffusive media connecting the inlet to the vessel, an outlet valve connecting the vessel to the outlet for controlling flow from the vessel to the outlet, at least one temperature sensor operatively connected to the vessel for providing temperature measurements from within the vessel, and a pressure transducer operatively connected to the vessel for providing pressure measurements from within the vessel.
    • 一种用于原位验证被测设备(DUT)的流量验证器,包括可连接到DUT的入口,可连接到用于通过DUT抽吸气体的真空泵的出口和流量验证器,具有预定体积的容器, 将入口连接到容器的扩散介质,将容器连接到出口用于控制从容器到出口的流动的出口阀,至少一个可操作地连接到容器的温度传感器,用于从容器内提供温度测量值,以及压力 传感器可操作地连接到容器,用于从容器内提供压力测量值。
    • 46. 发明申请
    • Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling
    • 用于快速热处理(RTP)的分段冷板用于传导冷却
    • US20050026447A1
    • 2005-02-03
    • US10879463
    • 2004-06-29
    • Ali ShajiiDavid TaoMathias KochDouglas BrownHossein Zarrin
    • Ali ShajiiDavid TaoMathias KochDouglas BrownHossein Zarrin
    • C23C16/52H01L21/00H01L21/302H01L21/461
    • C23C16/463C23C16/52H01L21/67109
    • The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate. According to another aspect, the cold plate comprises a plurality of holes through which one or more gases may flow, wherein an amount or mixture of the one or more gases is controllable via a controller, and wherein one or more temperature sensors are operable to provide temperature feedback at the substrate. According to another aspect the substrate resides within close proximity to the cold plate, wherein when gas is flowed through the holes, the substrate is cooled in the viscous regime, and the amount and/or mixture of gases flowed through the holes is controlled, based, at least in part, on the one or more measured temperatures.
    • 本发明涉及半导体热处理系统和用于热冷却半导体衬底的装置。 根据本发明的一个方面,公开了一种半导体热处理系统及相关设备和方法,其提供位于处理室内的分段冷板,其中冷板的多个段可操作以在啮合 位置和脱离位置,其中当所述段处于分离位置时,衬底保持器可以在所述多个段之间通过。 根据另一方面,电梯可操作以将位于基板保持器上的基板线性平移在靠近加热器组件的加热位置和靠近分段冷板的冷却位置之间。 根据另一方面,冷板包括一个或多个气体可流过的多个孔,其中一个或多个气体的量或混合物可经由控制器控制,并且其中一个或多个温度传感器可操作以提供 衬底温度反馈。 根据另一方面,衬底位于紧邻冷板的位置,其中当气体流过孔时,衬底在粘性状态下被冷却,并且基于孔流动的气体的量和/或混合物被基于 ,至少部分地基于一个或多个测量的温度。