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41. 发明授权

US08368508B2 Method of keying an identification code into a controlling member and into a function controller 失效
标题翻译：将识别代码键入控制构件和功能控制器的方法
公开(公告)号：US08368508B2
公开(公告)日：2013-02-05
申请号：US11493116
申请日：2006-07-26
申请人： Jack Chen
发明人： Jack Chen
IPC分类号： G05B19/02
CPC分类号： G08C19/00 , G05B19/0421 , G05B2219/2208 , G05B2219/25106 , G05B2219/25205 , G05B2219/2637
摘要： To key an identification code of a controlling member to a code reader of a function controller for controlling a function, each controlling member is fitted with a card reader and is configured to adopt the code on the card as the identification code to be attached as the identification portion of any message imparted into a signal line. In similar fashion, each of the function controllers includes a card reader for reading a card bearing a code and the function controller is configured to adopt the code read from the card as being the identification code sought by the function controller as identifying a message as originating from its associated controlling member.
摘要翻译：为了将控制构件的识别码键入用于控制功能的功能控制器的代码阅读器，每个控制构件都装有读卡器，并且被配置为采用卡上的代码作为要附加的识别码作为给信号线中的任何信息的识别部分。以类似的方式，每个功能控制器包括用于读取承载代码的卡的读卡器，并且功能控制器被配置为采用从卡读取的代码作为功能控制器寻求的识别代码来识别作为始发的消息从其相关的控制构件。

42. 发明授权

US08131875B1 Device profile assignment based on device capabilities 有权
标题翻译：基于设备功能的设备配置文件分配
公开(公告)号：US08131875B1
公开(公告)日：2012-03-06
申请号：US11945233
申请日：2007-11-26
申请人： Jack Chen , Rupen Chanda
发明人： Jack Chen , Rupen Chanda
IPC分类号： G06F15/16 , G06F3/00
CPC分类号： H04M1/72522 , H04L67/303 , H04M1/72525 , H04N21/25825 , H04N21/41407 , H04W4/18 , H04W8/24 , H04W28/06 , H04W28/18
摘要： Systems and methods, including computer software implementations, involve identifying a first set of device capabilities associated with an electronic device. The first set of device capabilities include one or more device capabilities. A description of the first set of device capabilities is provided to a remote source, and a first device profile identifier is received from the remote source. The first device profile identifier is associated with the first set of device capabilities. The first device profile identifier is stored on the electronic device, and the received first device profile identifier is included in a communication to the remote source.
摘要翻译：包括计算机软件实现的系统和方法涉及识别与电子设备相关联的第一组设备能力。第一套设备功能包括一个或多个设备功能。将第一组设备能力的描述提供给远程源，并且从远程源接收第一设备配置文件标识符。第一设备配置文件标识符与第一组设备能力相关联。第一设备配置文件标识符存储在电子设备上，并且所接收的第一设备配置文件标识符被包括在与远程源的通信中。

43. 发明申请

US20110287323A1 Electrode and Insulator Structure for Battery and Method of Manufacture 审中-公开
标题翻译：电池电极和绝缘体结构及制造方法
公开(公告)号：US20110287323A1
公开(公告)日：2011-11-24
申请号：US12783738
申请日：2010-05-20
申请人： Jack Chen
发明人： Jack Chen
IPC分类号： H01M2/18
CPC分类号： H01M10/0413 , H01M2/18 , H01M4/70 , H01M10/0431 , H01M10/045 , H01M10/0459 , H01M2004/025
摘要： A battery core is made from a strip of insulating material folded longitudinally to form parallel panels. In one embodiment there are four panels and in another five panels. A positive electrode strip has an exposed foil center strip and positive electrode material along both edges. The positive electrode is folded around one fold of the insulator with the strip of foil exposed at the fold. A negative electrode strip has an exposed center strip and negative electrode material along both edges. The negative electrode is folded around a different fold of the insulator with the strip of foil exposed.
摘要翻译：电池芯由纵向折叠的绝缘材料条制成以形成平行面板。在一个实施例中，有四个面板和另外五个面板。正极条具有沿着两个边缘的暴露的箔中心条和正电极材料。正电极折叠在绝缘体的一倍之上，箔条暴露在折叠处。负极带沿着两个边缘具有暴露的中心带和负极材料。负极围绕绝缘体的不同折叠折叠，箔条暴露。

44. 发明授权

US08053885B2 Wafer level vertical diode package structure and method for making the same 有权
标题翻译：晶圆级垂直二极管封装结构及制作方法
公开(公告)号：US08053885B2
公开(公告)日：2011-11-08
申请号：US12318876
申请日：2009-01-12
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L23/485
CPC分类号： H01L29/0657 , H01L21/6836 , H01L23/31 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/96 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05 , H01L2224/12105 , H01L2224/13099 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01046 , H01L2924/0107 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00015 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.
摘要翻译：晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。第二半导体层与第一半导体层的一个表面连接。绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

45. 发明授权

US07768376B2 Conformal mesh for thermal imaging 有权
标题翻译：用于热成像的保形网
公开(公告)号：US07768376B2
公开(公告)日：2010-08-03
申请号：US11924016
申请日：2007-10-25
申请人： Chang Liu , Nannan Chen , Jonathan Engel , Jack Chen , Zhifang Fan
发明人： Chang Liu , Nannan Chen , Jonathan Engel , Jack Chen , Zhifang Fan
IPC分类号： H01C7/10
CPC分类号： G01K7/22 , G01K7/226 , G01K2213/00
摘要： This invention provides thermal sensors and imagers that are flexible and capable of conforming to curved surfaces and corresponding methods of making and methods of thermal sensing. The thermal sensors contain an array of thermal resistors patterned in a row and column configuration, with each thermal resistor electrically isolated from other thermal resistors within the sensor. Thermal information is obtained from a region by measuring the resistance of each thermal resistor and calculating a thermal resistance for each entry of the array.
摘要翻译：本发明提供了柔性且能够符合弯曲表面的热传感器和成像器，以及相应的制造方法和热感测方法。热传感器包含以行和列配置图案化的热电阻阵列，每个热敏电阻器与传感器内的其他热电阻器电隔离。通过测量每个热敏电阻的电阻并计算阵列的每个入口的热阻，从区域获得热信息。

46. 发明申请

US20100176502A1 Wafer level vertical diode package structure and method for making the same 有权
标题翻译：晶圆级垂直二极管封装结构及制作方法
公开(公告)号：US20100176502A1
公开(公告)日：2010-07-15
申请号：US12318876
申请日：2009-01-12
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L23/498 , H01L21/82
CPC分类号： H01L29/0657 , H01L21/6836 , H01L23/31 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/96 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05 , H01L2224/12105 , H01L2224/13099 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01046 , H01L2924/0107 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00015 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.
摘要翻译：晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。第二半导体层与第一半导体层的一个表面连接。绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

47. 发明申请

US20100010754A1 Artificial Lateral Line 有权
标题翻译：人造横向线
公开(公告)号：US20100010754A1
公开(公告)日：2010-01-14
申请号：US12508229
申请日：2009-07-23
申请人： Chang Liu , Jonathan Engel , Jack Chen
发明人： Chang Liu , Jonathan Engel , Jack Chen
IPC分类号： G01F1/68 , G06F19/00
CPC分类号： G01F1/28 , G01F1/6845 , G01K7/015 , G01K7/186 , G01L5/228 , G01N13/00 , G01N2203/0676 , G01P5/02 , G01P5/12
摘要： An artificial sensor comprises at least one substrate, and a plurality of flow sensors disposed on the at least one substrate for providing a plurality of spatial-temporally varying signals representing a hydrodynamic stimulus. The plurality of flow sensors are spatially distributed on the at least one substrate. A processor is coupled to the plurality of flow sensors for receiving the signals and determining spatial-temporal information from the received signals.
摘要翻译：人造传感器包括至少一个衬底和设置在所述至少一个衬底上的多个流量传感器，用于提供表示流体动力学刺激的多个空间 - 时间变化的信号。多个流量传感器在空间上分布在至少一个基板上。处理器耦合到多个流量传感器，用于接收信号并根据接收的信号确定空间 - 时间信息。

48. 发明授权

US07644624B2 Artificial lateral line 有权
标题翻译：人造侧线
公开(公告)号：US07644624B2
公开(公告)日：2010-01-12
申请号：US11824042
申请日：2007-06-29
申请人： Chang Liu , Jonathan Engel , Jack Chen
发明人： Chang Liu , Jonathan Engel , Jack Chen
IPC分类号： G01L7/00
CPC分类号： G01F1/28 , G01F1/6845 , G01K7/015 , G01K7/186 , G01L5/228 , G01N13/00 , G01N2203/0676 , G01P5/02 , G01P5/12
摘要： An artificial sensor comprises at least one substrate, and a plurality of flow sensors disposed on the at least one substrate for providing a plurality of spatial-temporally varying signals representing a hydrodynamic stimulus. The plurality of flow sensors are spatially distributed on the at least one substrate. A processor is coupled to the plurality of flow sensors for receiving the signals and determining spatial-temporal information from the received signals.
摘要翻译：人造传感器包括至少一个衬底和设置在所述至少一个衬底上的多个流量传感器，用于提供表示流体动力学刺激的多个空间 - 时间变化的信号。多个流量传感器在空间上分布在至少一个基板上。处理器耦合到多个流量传感器，用于接收信号并根据接收的信号确定空间 - 时间信息。

49. 发明授权

US07621182B2 Sealed fuel level detector 失效
标题翻译：密封燃油液位探测器
公开(公告)号：US07621182B2
公开(公告)日：2009-11-24
申请号：US11784678
申请日：2007-04-09
申请人： Jack Chen
发明人： Jack Chen
IPC分类号： G01F23/32
CPC分类号： G01F23/363
摘要： A fuel level detector has a float connected to an arm that rotates a pivot pin. The pivot pin rotates in a hole in the wall of the detector, and the hole is sealed by a sleeve. One end of the sleeve is sealed to the housing of the detector surrounding the hole, and the opposite end of the sleeve is sealed around the outer surface of the pin.
摘要翻译：燃料液位检测器具有连接到旋转枢轴销的臂的浮子。枢轴销在检测器的壁上的孔中旋转，孔被套筒密封。套筒的一端被密封到围绕孔的检测器的壳体，并且套筒的相对端围绕销的外表面密封。

50. 发明授权

US07575638B2 Apparatus for defining regions of process exclusion and process performance in a process chamber 有权
标题翻译：用于限定处理室中的工艺排除区域和工艺性能的装置
公开(公告)号：US07575638B2
公开(公告)日：2009-08-18
申请号：US11701854
申请日：2007-02-02
申请人： Andrew D. Bailey, III , Jack Chen , Yunsang Kim , Gregory S. Sexton
发明人： Andrew D. Bailey, III , Jack Chen , Yunsang Kim , Gregory S. Sexton
IPC分类号： B05B5/025 , C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01L21/67069 , H01J37/32568 , H01L21/68721
摘要： Positional relationships are established in a process chamber. An upper electrode is configured with a first surface to support a wafer, and an electrode has a second surface. A linear drive is mounted on the base and a linkage connected between the drive and the upper electrode. Linkage adjustment defines a desired orientation between the surfaces. The linear drive and linkage maintain the desired orientation while the assembly moves the upper electrode with the surfaces moving relative to each other. An annular etching region defined between the electrodes enables etching of a wafer edge exclusion region extending along a top and bottom of the wafer. Removable etch defining rings are configured to define unique lengths along each of the top and bottom of the wafer to be etched. Positional relationships of the surfaces enable limiting the etching to those unique lengths of the exclusion region.
摘要翻译：位置关系建立在一个过程室中。上电极配置有第一表面以支撑晶片，并且电极具有第二表面。线性驱动器安装在基座上，连接在驱动器和上电极之间。连接调整定义了表面之间的期望取向。线性驱动器和连接件保持所需的取向，同时组件移动上电极，表面相对于彼此移动。限定在电极之间的环形蚀刻区域能够蚀刻沿着晶片的顶部和底部延伸的晶片边缘排除区域。可移除蚀刻限定环被配置为沿待蚀刻的晶片的顶部和底部的每一个限定独特的长度。表面的位置关系使得能够将蚀刻限制到排除区域的那些独特长度。

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