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    • 43. 发明授权
    • Field effect transistor and method of manufacturing the same
    • 场效应晶体管及其制造方法
    • US08569797B2
    • 2013-10-29
    • US13185818
    • 2011-07-19
    • Hidekazu UmedaMasahiro HikitaTetsuzo Ueda
    • Hidekazu UmedaMasahiro HikitaTetsuzo Ueda
    • H01L29/80
    • H01L29/7783H01L29/1066H01L29/2003H01L29/66462H01L29/7787
    • A field-effect transistor includes a first semiconductor layer formed on a substrate, and a second semiconductor layer. The first semiconductor layer has a containing region provided as an isolation region which contains non-conductive impurities, and a non-containing region which contains no non-conductive impurities. A first region is defined by a vicinity of a portion of the interface between the containing region and the non-containing region, the portion of the interface being below a gate electrode, the vicinity including the portion of the interface and being included in the containing region. The second semiconductor layer includes a second region which is located directly above the first region. The concentration of the non-conductive impurities of the second region is lower than that of the first region.
    • 场效应晶体管包括形成在衬底上的第一半导体层和第二半导体层。 第一半导体层具有设置为包含非导电杂质的隔离区域的含有区域和不含非导电杂质的非含有区域。 第一区域由容纳区域和非含有区域之间的界面的一部分的附近限定,界面的部分在栅电极下方,包括界面部分的附近包含在包含 地区。 第二半导体层包括位于第一区域正上方的第二区域。 第二区域的非导电性杂质的浓度低于第一区域的浓度。
    • 47. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08598628B2
    • 2013-12-03
    • US13231514
    • 2011-09-13
    • Masahiro HikitaManabu Yanagihara
    • Masahiro HikitaManabu Yanagihara
    • H01L29/72
    • H01L29/42316H01L29/1066H01L29/2003H01L29/518H01L29/7786
    • A normally off semiconductor device with a reduced off-state leakage current, which is applicable to a power switching element, includes: a substrate; an undoped GaN layer formed above the substrate; an undoped AlGaN layer formed on the undoped GaN layer; a source electrode and a drain electrode, formed on the undoped GaN layer or the undoped AlGaN layer; a P-type GaN layer formed on the undoped AlGaN layer and disposed between the source electrode and the drain electrode; and a gate electrode formed on the P-type GaN layer, wherein the undoped GaN layer includes an active region including a channel and an inactive region not including the channel, and the P-type GaN layer is disposed to surround the source electrode.
    • 具有减小的截止状态漏电流的常闭半导体器件,其适用于功率开关元件,包括:衬底; 在衬底上形成未掺杂的GaN层; 在未掺杂的GaN层上形成未掺杂的AlGaN层; 源电极和漏电极,形成在未掺杂的GaN层或未掺杂的AlGaN层上; 形成在未掺杂的AlGaN层上并设置在源电极和漏电极之间的P型GaN层; 以及形成在所述P型GaN层上的栅电极,其中所述未掺杂的GaN层包括包括沟道的有源区和不包括所述沟道的非活性区,并且所述P型GaN层设置为围绕所述源电极。