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    • 41. 发明授权
    • Elastomeric bearing
    • 弹性轴承
    • US5386973A
    • 1995-02-07
    • US62284
    • 1993-05-17
    • Heinrich BrennerHeinrich Meyer
    • Heinrich BrennerHeinrich Meyer
    • B29D99/00B29K21/00F16F13/10F16F9/10
    • F16F13/108
    • An elastomeric bearing, such as a hydraulically damping bearing for motor vehicles can have at least two fastening parts which are connected to one another by means of an elastomer spring. Such a bearing can also have a vertically acting hydraulic damping apparatus and at least one hydraulic damping apparatus acting in the horizontal direction, which damping apparatus essentially are chambers filled with damping fluid and connected to one another by damping passages. The chambers of the horizontally acting damping apparatus can be molded into the elastomer spring and disposed opposite to one another in the direction of damping, with at least one passage connecting the chambers. The chambers of the horizontally acting damping apparatus can be bordered by a separating part, and underneath the separating part there can be a second damping apparatus oriented in the direction of the Cz vertical coordinate axis. The chambers of the second damping apparatus can be located one above the other in the direction of the Cz coordinate axis and can be connected to one another by an additional connecting passage.
    • 诸如用于机动车辆的液压阻尼轴承的弹性体轴承可以具有至少两个通过弹性体弹簧彼此连接的紧固部件。 这种轴承还可以具有垂直作用的液压阻尼装置和至少一个沿水平方向作用的液压阻尼装置,该阻尼装置基本上是填充有阻尼流体的腔室,并且通过阻尼通道相互连接。 水平作用的阻尼装置的腔室可以模制成弹性体弹簧并且在阻尼方向上彼此相对布置,并且至少一个连接腔室的通道。 水平作用的阻尼装置的室可以由分离部分界定,并且在分离部分的下方可以有一个沿着Cz垂直坐标轴的方向定向的第二阻尼装置。 第二阻尼装置的室可以沿着Cz坐标轴的方向一个地位于另一个上,并且可以通过附加的连接通道彼此连接。
    • 42. 发明授权
    • Process for metallization of a nonconductor surface, especially on a
circuit board having preexisting copper surfaces
    • 非导体表面的金属化工艺,特别是在具有预先存在的铜表面的电路板上
    • US5183552A
    • 1993-02-02
    • US655789
    • 1991-02-14
    • Burkhard BresselHeinrich MeyerWalter MeyerKlaus Gedrat
    • Burkhard BresselHeinrich MeyerWalter MeyerKlaus Gedrat
    • C08G61/12C25D5/56H05K3/18
    • H05K3/188C08G61/123C25D5/56H05K2201/0329H05K2203/0796Y10S205/92
    • The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid having an acid dissociation constant, for loss of a proton in aqueous solution, between 0.1 and 0.01, and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.
    • 用于直接金属化具有非导体表面的电路板的方法包括使非导体表面与碱性高锰酸盐溶液反应以形成化学吸附在非导体表面上的二氧化锰; 形成具有酸解离常数的弱酸的水溶液,水溶液中的质子损失为0.1〜0.01,以及吡咯或吡咯衍生物及其可溶性低聚物; 使含有吡咯单体及其低聚物的水溶液与其上具有化学吸附的二氧化锰的非导体表面接触,以在非导体表面上沉积粘附的导电不溶性聚合物产物; 并在其上形成有不溶性粘附聚合物产物的非导体表面上直接电沉积金属。 低聚物有利地在室温至溶液凝固点之间的温度下形成含有0.1至200g / l吡咯单体的水溶液。