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    • 43. 发明申请
    • Surface-decorated polymeric amphiphile porogens for the templation of nanoporous materials
    • 用于纳米多孔材料模板的表面改性聚合物两亲性致孔剂
    • US20060247383A1
    • 2006-11-02
    • US11119306
    • 2005-04-28
    • James HedrickVictor LeeTeddie MagbitangRobert Miller
    • James HedrickVictor LeeTeddie MagbitangRobert Miller
    • C08F297/02
    • C08G83/003
    • A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ε-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size ≦10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout. Greater porosity reduces the dielectric constant k of the resulting dielectrics. The porous dielectrics are incorporated into integrated circuits as lower k alternatives to silicon dioxide.
    • 制备了一种纳米颗粒,其包括附着在芯上的多核芯和表面装饰。 通过多种可能途径中的任一种提供多核心核心,示例性的优选途径是由反应性官能化阴离子引发剂引发的活性阴离子聚合和双-MPA树枝状聚合物的ε-己内酯聚合。 多臂核心优选在一些或所有臂上功能化。 然后使用偶联反应将表面装饰粘合到多臂芯的一个或多个臂上。 表面装饰是聚合度小于50的小分子或低聚物,优选的装饰是聚合度为2至24的PEG低聚物。纳米颗粒(粒径<= 10nm)用作牺牲模板致孔剂 以形成多孔电介质。 将致孔剂与基质前体(例如甲基倍半硅氧烷树脂)混合,基体玻璃化,并通过烧尽除去致孔剂。 更大的孔隙度降低了所得电介质的介电常数k。 将多孔电介质作为二氧化硅的较低k替代物并入集成电路中。
    • 44. 发明申请
    • Deferred tuple space programming of expansion modules
    • 扩展模块的延迟元组空间编程
    • US20060242355A1
    • 2006-10-26
    • US11320527
    • 2005-12-28
    • Thomas NewmanLeonard OttRobert MillerBobby GiffordLarry Lovercheck
    • Thomas NewmanLeonard OttRobert MillerBobby GiffordLarry Lovercheck
    • G06F12/06G06F12/00
    • G06F13/385G06F13/387
    • The present invention permits deferring the final provisioning of the Card Information Structure (CIS) in the attribute memory space of expansion cards (or modules) for portable hosts. This enables expansion cards to be distributed, sold, and installed by their end-users prior to the final provisioning, which is performed during their initial use. A temporary default CIS image is provided that permits baseline functionality of the expansion card with a host device. Providing the default CIS data enables provisional installation and operation of the card in the host, including accessing the card by way of default card services and socket software layers, as provided in the standard software environment of the host. The provisional operation enables higher level software to program the final CIS values in the peripheral controller internal CIS data-structure, EEPROM on the card, or any combination of the two.
    • 本发明允许在用于便携式主机的扩展卡(或模块)的属性存储器空间中延迟卡信息结构(CIS)的最终提供。 这使得扩展卡在最终配置之前由最终用户进行分发,销售和安装,这在最初的使用期间执行。 提供了允许扩展卡与主机设备的基线功能的临时默认CIS映像。 提供默认的CIS数据可以在主机中临时安装和操作卡,包括通过主机的标准软件环境中提供的默认卡服务和套接字软件层访问卡。 临时操作使更高级别的软件可以对外围控制器内部CIS数据结构,卡上的EEPROM或两者的任意组合对最终的CIS值进行编程。