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    • 42. 发明授权
    • NH3 plasma descumming and resist stripping in semiconductor applications
    • NH3等离子体除氧和半导体应用中的抗剥离
    • US06455431B1
    • 2002-09-24
    • US09629329
    • 2000-08-01
    • Chang Lin HsiehHui ChenJie YuanYan Ye
    • Chang Lin HsiehHui ChenJie YuanYan Ye
    • H01L21302
    • H01L21/31138G03F7/427
    • In general, the present disclosure pertains to a method for removing photoresist from locations on a semiconductor structure where its presence is undesired. In one embodiment, a method is disclosed for descumming residual photoresist material from areas where it is not desired after patterning of the photoresist. In another embodiment, a misaligned patterned photoresist is stripped from a semiconductor substrate surface. In particular, the method comprises exposing the semiconductor structure to a plasma generated from a source gas comprising NH3. A substrate bias voltage is utilized in both methods in order to produce anisotropic etching. In the descumming embodiment, the critical dimensions of the patterned photoresist are maintained. In the photoresist stripping embodiment, a patterned photoresist is removed without adversely affecting a partially exposed underlying layer of an organic dielectric.
    • 通常,本公开涉及用于从半导体结构上的位置去除光致抗蚀剂的方法,其中其存在是不期望的。 在一个实施例中,公开了一种从光刻胶图形化之后不希望的区域去除残余光致抗蚀剂材料的方法。 在另一个实施例中,从半导体衬底表面剥离未对准的图案化光致抗蚀剂。 特别地,该方法包括将半导体结构暴露于由包含NH 3的源气体产生的等离子体。 为了产生各向异性蚀刻,在两种方法中均采用衬底偏置电压。 在除尘实施例中,维持图案化光致抗蚀剂的临界尺寸。 在光致抗蚀剂剥离实施例中,去除图案化的光致抗蚀剂,而不会有害地影响有机电介质的部分暴露的下层。