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41. 发明授权

US4252917A Hydrophilic polymer and process for producing the same 失效
标题翻译：亲水聚合物及其制备方法
公开(公告)号：US4252917A
公开(公告)日：1981-02-24
申请号：US937824
申请日：1978-08-29
申请人： Minoru Takizawa , Shojiro Horiguchi , Michiei Nakamura , Hitoshi Takeuchi
发明人： Minoru Takizawa , Shojiro Horiguchi , Michiei Nakamura , Hitoshi Takeuchi
IPC分类号： C08F8/00 , C08F8/34 , C08F8/44 , C08G18/00 , C08G18/83 , C08G63/00 , C08G63/68 , C09K3/10 , E21D11/38 , C08L53/02
CPC分类号： C08F8/34 , C08F279/02 , C08F2800/20
摘要： A hydrophilic polymer comprises a main component of a block copolymer and/or a graft copolymer which has at least one hydrophobic hard segment-hydrophilic segment-hydrophobic hard segment unit wherein said hydrophobic hard segment is a binding phase segment having an average molecular weight of more than 1,000 and said hydrophilic segment is a segment having a hydrophilic group connected to thioether bond on a side chain and having an average molecular weight of more than 1,000.
摘要翻译：亲水性聚合物包含嵌段共聚物的主要组分和/或具有至少一个疏水性硬链段 - 亲水链段 - 疏水性硬链段单元的接枝共聚物，其中所述疏水性硬链段是平均分子量更大的结合相片段所述亲水性片段是具有与侧链上的硫醚键连接且平均分子量大于1000的亲水基团的链段。

42. 发明授权

US08612969B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US08612969B2
公开(公告)日：2013-12-17
申请号：US13307583
申请日：2011-11-30
申请人： Shuichi Nakano , Minoru Takizawa
发明人： Shuichi Nakano , Minoru Takizawa
IPC分类号： G06F9/44
CPC分类号： G03G15/5075 , G06F3/1203 , G06F3/1209 , G06F3/123 , G06F3/1236 , G06F3/1288 , G06F8/61
摘要： An electronic apparatus is provided that can include a first downloader downloading a replacement control program from an external host computer by way of a first communicator under the control of a first communication program, in a case where a first inspector judges a control program is not normal and a second inspector judges the first communication program is normal. The apparatus can also include a second downloader downloading a replacement first communication program from an external maintenance computer by way of a second communicator under the control of a second communication program, in a case where a second inspector judges the first communication program is not normal, so that a first communication program stored in a rewritable flash ROM is rewritten with the replacement first communication program downloaded by the second downloader.
摘要翻译：提供一种电子设备，在第一检查员判断控制程序不正常的情况下，可以包括第一下载器，其通过第一通信器在第一通信程序的控制下从外部主机计算机下载替换控制程序第二检查员判断第一个通讯程序是否正常。在第二检查员判断第一通信程序不正常的情况下，该装置还可以包括第二下载器，其通过第二通信器在第二通信程序的控制下从外部维护计算机下载替换第一通信程序，使得存储在可重写闪速ROM中的第一通信程序被由第二下载器下载的替换第一通信程序重写。

43. 发明申请

US20120089975A1 Electronic Device 有权
标题翻译：电子设备
公开(公告)号：US20120089975A1
公开(公告)日：2012-04-12
申请号：US13307583
申请日：2011-11-30
申请人： Shuichi Nakano , Minoru Takizawa
发明人： Shuichi Nakano , Minoru Takizawa
IPC分类号： G06F9/445
CPC分类号： G03G15/5075 , G06F3/1203 , G06F3/1209 , G06F3/123 , G06F3/1236 , G06F3/1288 , G06F8/61
摘要： An electronic apparatus is provided that can include a first downloader downloading a replacement control program from an external host computer by way of a first communicator under the control of a first communication program, in a case where a first inspector judges a control program is not normal and a second inspector judges the first communication program is normal. The apparatus can also include a second downloader downloading a replacement first communication program from an external maintenance computer by way of a second communicator under the control of a second communication program, in a case where a second inspector judges the first communication program is not normal, so that a first communication program stored in a rewritable flash ROM is rewritten with the replacement first communication program downloaded by the second downloader.
摘要翻译：提供一种电子设备，在第一检查员判断控制程序不正常的情况下，可以包括第一下载器，其通过第一通信器在第一通信程序的控制下从外部主机计算机下载替换控制程序第二检查员判断第一个通讯程序是否正常。在第二检查员判断第一通信程序不正常的情况下，该装置还可以包括第二下载器，其通过第二通信器在第二通信程序的控制下从外部维护计算机下载替换第一通信程序，使得存储在可重写闪速ROM中的第一通信程序被由第二下载器下载的替换第一通信程序重写。

44. 发明授权

US08120157B2 Printed wiring board structure, electronic component mounting method and electronic apparatus 有权
标题翻译：印刷电路板结构，电子元件安装方法和电子设备
公开(公告)号：US08120157B2
公开(公告)日：2012-02-21
申请号：US12163877
申请日：2008-06-27
申请人： Minoru Takizawa
发明人： Minoru Takizawa
IPC分类号： H01L23/02
CPC分类号： H05K1/181 , H01L2224/73204 , H05K1/0271 , H05K3/305 , H05K2201/10545 , H05K2201/10734 , Y02P70/611
摘要： According to one embodiment, a printed wiring board structure comprises a printed wiring board having first and second component mounting surfaces at front and back sides thereof, respectively, each for mounting a semiconductor package loading a semiconductor chip loaded on a substrate as a mounting component, a first semiconductor package mounted on the first component mounting surface, and a second semiconductor package mounted on the second component mounting surface, wherein the first and second semiconductor packages have a positional relationship such that the substrates are partially overlapped via the printed wiring board, and the semiconductor chips are not overlapped.
摘要翻译：根据一个实施例，印刷电路板结构包括印刷电路板，其分别在其前侧和后侧具有第一和第二部件安装表面，每个用于安装加载在基板上的半导体芯片作为安装部件的半导体封装，安装在第一部件安装表面上的第一半导体封装件和安装在第二部件安装表面上的第二半导体封装，其中第一和第二半导体封装件具有这样的位置关系，使得基板经由印刷电路板部分重叠，半导体芯片不重叠。

45. 发明授权

US08035212B2 Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device 有权
标题翻译：半导体芯片安装体，半导体芯片安装体和电子器件的制造方法
公开(公告)号：US08035212B2
公开(公告)日：2011-10-11
申请号：US12621387
申请日：2009-11-18
申请人： Akira Tanaka , Minoru Takizawa , Mitsuyoshi Tanimoto , Akihiko Happoya
发明人： Akira Tanaka , Minoru Takizawa , Mitsuyoshi Tanimoto , Akihiko Happoya
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/295 , H01L23/3121 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.
摘要翻译：根据一个实施例，提供一种半导体芯片安装体，其在与半导体芯片的角部对应的接合部件的部分处具有增强的抗冲击性。半导体芯片安装体包括电路板，其电路图案形成在其安装表面上，安装在电路板的电路图案上的半导体芯片和至少布置在电路板和半导体芯片之间的接合部件，以及在半导体芯片的侧面上将半导体芯片固定在电路板上。接合部件包含分散在热固性树脂中的热固性树脂和磁性粉末。磁性粉末局部地设置在位于半导体芯片的角部的接合部件的部分中。

46. 发明授权

US07675172B2 Printed circuit board, mounting method of electronic component, and electronic apparatus 有权
标题翻译：印刷电路板，电子部件的安装方法和电子设备
公开(公告)号：US07675172B2
公开(公告)日：2010-03-09
申请号：US12146329
申请日：2008-06-25
申请人： Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
发明人： Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
IPC分类号： H01L23/48
CPC分类号： H05K3/305 , H05K3/3436 , H05K2201/10734 , H05K2203/0545 , Y02P70/613
摘要： According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.
摘要翻译：根据一个实施例，提供了一种印刷电路板，其包括具有部件安装表面的印刷线路板，通过使用焊球焊接而安装在印刷线路板的部件安装表面上的半导体封装，以及加强部在印刷电路板的部件安装表面上的多个位置处局部加强半导体封装的焊接部分，加强部分由具有进入焊料接合部分的焊球的部分的树脂材料形成。

47. 发明申请

US20070074901A1 Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus 有权
标题翻译：多层印刷线路板，多层印刷电路板和电子设备的制造方法
公开(公告)号：US20070074901A1
公开(公告)日：2007-04-05
申请号：US11524688
申请日：2006-09-21
申请人： Minoru Takizawa
发明人： Minoru Takizawa
IPC分类号： H05K1/11
CPC分类号： H05K3/4614 , H05K1/186 , H05K3/4046 , H05K3/4623 , H05K3/4652 , H05K2201/09536 , H05K2201/10416 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , Y02P70/611
摘要： According to one embodiment of, a multilayer printed wiring board comprises an electronic part, a mount layer where the electronic part is mounted, a mount layer conductor pattern formed in the mount layer, an opposite layer containing the electronic part between itself and the mount layer, an opposite layer conductor pattern formed on the opposite layer and an electrically conductive connector contained between the mount layer and the opposite layer and electrically connecting the mount layer conductor pattern and the opposite layer conductor pattern to each other.
摘要翻译：根据一个实施例，多层印刷线路板包括电子部件，安装电子部件的安装层，形成在安装层中的安装层导体图案，在其与安装层之间包含电子部件的相对层，形成在相对层上的相对层导体图案和包含在安装层和相对层之间的导电连接器，并将安装层导体图案和相对层导体图案彼此电连接。

48. 发明授权

US07138211B2 Solidifying material for cell electrolyte solution, and cell comprising the solidifying material 有权
标题翻译：用于电池电解液的固化材料和包含固化材料的电池
公开(公告)号：US07138211B2
公开(公告)日：2006-11-21
申请号：US10829171
申请日：2004-04-22
申请人： Minoru Takizawa , Yoshifumi Sugito , Naomi Oguma , Seiji Doi , Sachio Yoshikawa , Michiei Nakamura
发明人： Minoru Takizawa , Yoshifumi Sugito , Naomi Oguma , Seiji Doi , Sachio Yoshikawa , Michiei Nakamura
IPC分类号： H01M10/40
CPC分类号： H01M10/0565 , C08F8/00 , H01M2/1653 , H01M2/1666 , H01M6/22 , H01M10/052 , H01M2300/0014 , H01M2300/0025 , H01M2300/0082 , H01M2300/0085 , Y10T442/2139 , Y10T442/2861 , Y10T442/2918 , C08F297/00
摘要： A solidifying material for a cell electrolyte solution is a block copolymer, which comprises, as segments A, a polymer non-compatible with the cell electrolyte solution and, as segments B, a polymer compatible with the cell electrolyte solution. The solidifying material absorbs and solidifies the cell electrolyte solution. A smallest unit of the block copolymer is A-B-A. To each of the segments B, at least one group selected from the group consisting of a carboxyl group, an ester group, a hydroxyl group, a sulfonic group, an amino group, a cyclic carbonate group and a polyoxyalkylene group is bonded via a —S— bond or a —C— bond.
摘要翻译：用于电池电解质溶液的固化材料是嵌段共聚物，其包含作为区段A的与电池电解质溶液不相容的聚合物，并且作为区段B包含与电池电解质溶液相容的聚合物。凝固材料吸收并固化细胞电解质溶液。嵌段共聚物的最小单元是A-B-A。对于各段B，通过α-烯烃键合至少一个选自羧基，酯基，羟基，磺酸基，氨基，环状碳酸酯基和聚氧化烯基的基团， S-键或-C-键。

49. 发明授权

US06336060B1 Arithmetic processing method and system in a wide velocity range flight velocity vector measurement system using a square truncated pyramid-shape five-hole pitot probe 有权
标题翻译：算术处理方法和系统在宽速度范围内飞行速度矢量测量系统采用方形截头棱锥形五孔皮托探测器
公开(公告)号：US06336060B1
公开(公告)日：2002-01-01
申请号：US09661411
申请日：2000-09-13
申请人： Masashi Shigemi , Teruomi Nakaya , Shigemi Shindo , Minoru Takizawa , Takeshi Ohnuki
发明人： Masashi Shigemi , Teruomi Nakaya , Shigemi Shindo , Minoru Takizawa , Takeshi Ohnuki
IPC分类号： G01C2110
CPC分类号： G01P13/025 , G01P5/165
摘要： An arithmetic processing method and system in a wide velocity range flight velocity vector measurement system using a square truncated pyramid-shape five-hole Pitot probe. Approximation equations that determine attack angle &agr; and sideslip angle &bgr; in the form of third-order equations concerning attack angle pressure coefficient C&agr; and sideslip angle pressure coefficient C&bgr;, which are known numbers, are expressed in the form of a polynomial equation concerning Mach number M, where the coefficients are obtained from a lookup table. Coefficient calculations in the polynomial equation, and attack angle a and sideslip angle &bgr;, calculations may be performed as simple calculations by specifying and applying known numbers into the approximation equation without solving third-order equations, with calibration coefficients that form the basis of coefficient calculation with the polynomial equation first being stored in memory in advance as a table for each wide velocity range on the basis of wind tunnel testing. A Mach number may be calculated instantly from a lookup table by specifying Mach pressure coefficient CM and angle to airflow pressure coefficient C&ggr;. Wide velocity range flight velocity vector measurement with a high update rate which is capable of real time response in flight control as demanded by aircraft is obtained.
摘要翻译：一种使用方形截头棱锥形五孔皮托探测器的宽速度范围飞行速度矢量测量系统中的算术处理方法和系统。确定攻角α和侧滑角β的近似方程式以关于马赫数M的多项式方程式的形式表示为关于攻角角压力系数Calpha和侧滑角压力系数Cbeta的三阶方程形式，其中系数是从查找表获得的。多项式方程中的系数计算和攻角α和侧滑角β可以通过在不求解三阶方程的情况下通过将已知数字指定和应用已知的数字作为简单的计算来执行计算，其中校准系数构成系数计算的基础其中多项式方程首先作为基于风洞测试的每个宽速度范围的表预先存储在存储器中。可以通过指定马赫压力系数CM和与气流压力系数Cgam的角度从查找表立即计算马赫数。获得具有高飞行速度矢量测量的高速更新速率，能够根据飞机所要求的飞行控制中的实时响应。

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