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    • 48. 发明授权
    • Fin FET structure
    • 翅片FET结构
    • US07317230B2
    • 2008-01-08
    • US11041063
    • 2005-01-21
    • Choong-Ho LeeDong-Gun ParkJae-Man YounChul Lee
    • Choong-Ho LeeDong-Gun ParkJae-Man YounChul Lee
    • H01L29/94
    • H01L29/785H01L29/4908H01L29/66795H01L29/7854
    • A fin FET structure employs a negative word line scheme. A gate electrode of a fin FET employs an electrode doped with n+ impurity, and a channel doping for a control of threshold voltage is not executed, or the channel doping is executed by a low density, thereby remarkably improving characteristics of the fin FET. A semiconductor substrate is formed in a first conductive type, and a fin active region of a first conductive type is projected from an upper surface of the semiconductor substrate and is connected to the semiconductor substrate. An insulation layer is formed on the semiconductor substrate, and a gate insulation layer is formed in upper part and sidewall of the fin active region. A gate electrode is formed on the insulation layer and the gate insulation layer. Source and drain are formed in the fin active region of both sides of the gate electrode.
    • 鳍式FET结构采用负字线方案。 翅片FET的栅极采用掺杂有n +杂质的电极,不执行用于阈值电压控制的沟道掺杂,或者通过低密度执行沟道掺杂,从而显着提高了鳍式FET的特性。 半导体衬底形成为第一导电类型,并且第一导电类型的鳍有源区域从半导体衬底的上表面突出并连接到半导体衬底。 在半导体衬底上形成绝缘层,并且在翅片有源区的上部和侧壁形成栅极绝缘层。 在绝缘层和栅极绝缘层上形成栅电极。 源极和漏极形成在栅极两侧的鳍片有源区域中。