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41. 发明申请

US20070146486A1 Testing system for digital camera modules 失效
标题翻译：数码相机模块测试系统
公开(公告)号：US20070146486A1
公开(公告)日：2007-06-28
申请号：US11592768
申请日：2006-11-03
申请人： Steven Webster , Ying-Cheng Wu , Yuan-Po Wang
发明人： Steven Webster , Ying-Cheng Wu , Yuan-Po Wang
IPC分类号： H04N17/00
CPC分类号： H04N17/002
摘要： A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.
摘要翻译：一种用于数字照相机模块（100）的测试系统（200）包括第一测试模块（50），组装机构（60），聚焦模块（62），第二测试模块（70），以及主处理器（90）。携带机构在第一测试模块，组装机构，聚焦模块和第二测试模块之间支撑和传送数字照相机模块和数字照相机模块的子组件。第一测试模块，组装机构，聚焦模块，承载机构和第二测试模块都与主处理器电连接。

42. 发明申请

US20070126081A1 Digital Camera Module 失效
标题翻译：数码相机模块
公开(公告)号：US20070126081A1
公开(公告)日：2007-06-07
申请号：US11525447
申请日：2006-09-22
申请人： Steven Webster , Ying-Cheng Wu
发明人： Steven Webster , Ying-Cheng Wu
IPC分类号： H01L27/082
CPC分类号： H01L27/14618 , H01L24/73 , H01L27/14625 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/15311 , H04N5/2257 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.
摘要翻译：数字照相机模块（200）包括载体（20），图像传感器芯片（30），多个电线（50），保持器（60）和透镜模块（70）。载体包括嵌入基座中的基座（21）和引线框架（23）。基座包括板（211），侧壁（213）和空腔（24）。引线框架包括彼此间隔开的多个导电引线（233）。每个引线具有连接第一和第二端子部分的第一端子部分（235），第二端子部分（236）和互连部分（237）。芯片安装在载体上，并具有有效区域（301）。导线将芯片和引线框架电连接。保持器安装到载体以封闭空腔。透镜模块被容纳在保持器中并将光引导到芯片的有效区域。

43. 发明申请

US20060097405A1 IC chip package and method for packaging same 有权
标题翻译： IC芯片封装及其封装方法
公开(公告)号：US20060097405A1
公开(公告)日：2006-05-11
申请号：US11262907
申请日：2005-10-31
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
IPC分类号： H01L23/48 , H01L23/52 , H01L23/12
CPC分类号： H01L23/055 , H01L23/10 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2224/85399 , H01L2224/05599
摘要： An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.
摘要翻译： IC（集成电路）芯片封装包括基板（2），芯片（3），多个接合线（32）和盖（5）。衬底具有顶表面，底表面，限定在其中的接收室（23），围绕顶表面和底表面布置的多个焊盘（24），以及多个通孔（25），其具有导电材料将顶部焊盘与其中限定的底部焊盘连接。芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘。接合线分别将衬底的顶部焊盘与芯片焊盘电连接。盖被固定到基板的顶表面以覆盖开口，并且具有比基板更小的轮廓，从而不覆盖顶表面的周边区域。

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