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    • 41. 发明授权
    • Structure for SIM card assembly and disassembly
    • SIM卡组装和拆卸结构
    • US07097511B1
    • 2006-08-29
    • US11186544
    • 2005-07-21
    • Chao ChenTimothy H. Kyowski
    • Chao ChenTimothy H. Kyowski
    • H01R24/00
    • H01R12/7011H01R12/714
    • A smart card holder frame for an electronic device which comprises a card holder, a member, and an alignment structure. The card holder has a base, a first wall, a second wall, a connector clip, and an open region structured to receive a smart card therein, the open region being disposed between the base, the first wall, the second wall, and the connector clip. The member has a first sloped surface and a second sloped surface structured to be engaged with a smart card and to align the smart card with the open region. The alignment structure comprises a deflectable finger that is structured to bias the smart card into engagement with at least one of the first sloped and the second sloped surface, wherein the alignment structure is adjacent the card holder and wherein the member is adjacent the card holder and the alignment structure.
    • 一种用于电子设备的智能卡保持架,包括卡夹,构件和对准结构。 卡座具有基座,第一壁,第二壁,连接器夹和构造成在其中容纳智能卡的开放区域,开放区域设置在基座,第一壁,第二壁和 连接器夹。 该构件具有第一倾斜表面和第二倾斜表面,该第二倾斜表面被构造成与智能卡接合并使智能卡与开放区域对准。 对准结构包括可偏转手指,其被构造成将智能卡偏置成与第一倾斜表面和第二倾斜表面中的至少一个接合,其中对准结构邻近卡夹持器,并且其中该构件与卡夹持器相邻, 对准结构。
    • 43. 发明申请
    • Surface mountable clip suitable for use in a mobile communication device
    • US20050263323A1
    • 2005-12-01
    • US11195234
    • 2005-08-02
    • Chao Chen
    • Chao Chen
    • H01Q1/12H01Q1/24H05K7/06
    • H01Q1/1207H01Q1/243
    • A mobile communication device includes a printed circuit board (PCB); a radio frequency (RF) transceiver carried on the PCB; and an antenna coupled to the RF transceiver. A surface mountable antenna clip is mounted on the PCB for retaining the antenna. The clip is a metal structure having a plurality of planar sides generally formed into a U-shape. An opening formed by the structure is sized to receive and retain the antenna. One of the planar sides is used to support the structure and is mounted over a solder pad of the PCB. A hole formed through this planar side is configured to break a surface tension of molten solder over a solder pad of the PCB during a reflow soldering process, so that the clip is more stable and tends not to rotate out-of-position during the process. Legs extending from edges of this planar side also help to stabilize the clip during the process, and provide an increased surface area for the connection. In fact, if the initial Surface-Mount Technology (SMT) placement position of the clip is slightly skewed or shifted, surface tension forces will help the clip to move or rotate into the correct position. The legs also provide sufficient features to a vision system to correctly orient the clip on the PCB.
    • 44. 发明授权
    • Electrical connector assembly
    • 电连接器总成
    • US06969263B2
    • 2005-11-29
    • US10411442
    • 2003-04-10
    • Chao ChenJohn A. Holmes
    • Chao ChenJohn A. Holmes
    • H01R12/71H01R12/00
    • H01R13/2435H01R12/7076H01R12/714H01R43/16
    • An electrical connector assembly is provided for connecting at least one electrical contact pad on a first structure with at least one electrical contact pad on an opposing second structure. The connector assembly has a body and electrical connectors extending from the body, and is mountable relative to the first and second structures such that the electrical connectors engage electrical contact pads on the first and second structures. The electrical connectors are of a springy metal and are configured to be suitably biased against the contact pads when the connector assembly is assembled with the first and second structures, so as to provide a contact biasing force preferably in the range of 0.7N±0.2N.
    • 提供一种电连接器组件,用于将第一结构上的至少一个电接触焊盘与相对的第二结构上的至少一个电接触焊盘相连接。 连接器组件具有从主体延伸的主体和电连接器,并且可相对于第一和第二结构安装,使得电连接器接合第一和第二结构上的电接触焊盘。 电连接器是弹性金属,并且被构造成当连接器组件与第一和第二结构组装时适当地偏置抵靠接触垫,以便提供优选在0.7N±0.2N范围内的接触偏压力 。
    • 45. 发明申请
    • Coated aneurysmal repair device
    • 涂层动脉瘤修复装置
    • US20050249776A1
    • 2005-11-10
    • US11149466
    • 2005-06-09
    • Chao ChenRobert Falotico
    • Chao ChenRobert Falotico
    • A61F2/06A61F2/84A61L31/10A61L31/16A61K31/4745
    • A61L31/10A61L31/16A61L2300/41A61L2300/416A61L2300/434C08L27/16C08L27/20
    • Medical devices, and in particular implantable medical devices, may be coated to minimize or substantially eliminate a biological organism's reaction to the introduction of the medical device to the organism. The medical devices may be coated with any number of biocompatible materials. Therapeutic drugs, agents or compounds may be mixed with the biocompatible materials and affixed to at least a portion of the medical device. These therapeutic drugs, agents or compounds may also further reduce a biological organism's reaction to the introduction of the medical device to the organism. In addition, these therapeutic drugs, agents and/or compounds may be utilized to promote healing, including the formation of blood clots. The drugs, agents, and/or compounds may also be utilized to treat specific diseases, including vulnerable plaque. Therapeutic agents may also be delivered to the region of a disease site. In regional delivery, liquid formulations may be desirable to increase the efficacy and deliverability of the particular drug. Also, the devices may be modified to promote endothelialization. Various materials and coating methodologies may be utilized to maintain the drugs, agents or compounds on the medical device until delivered and positioned. In addition, the devices utilized to deliver the implantable medical devices may be modified to reduce the potential for damaging the implantable medical device during deployment. Medical devices include stents, grafts, anastomotic devices, perivascular wraps, sutures and staples. In addition, various polymer combinations may be utilized to control the elution rates of the therapeutic drugs, agents and/or compounds from the implantable medical devices.
    • 可以涂覆医疗装置,特别是可植入医疗装置,以最小化或基本上消除生物体对将生物体引入医疗装置的反应。 医疗装置可以涂覆任何数量的生物相容性材料。 治疗药物,药剂或化合物可以与生物相容性材料混合并固定在医疗装置的至少一部分上。 这些治疗药物,药剂或化合物还可以进一步减少生物体对将生物体引入医疗装置的反应。 此外,这些治疗药物,药剂和/或化合物可用于促进愈合,包括血块的形成。 药物,药剂和/或化合物也可用于治疗特定疾病,包括易损斑块。 治疗剂也可以递送到疾病部位的区域。 在区域递送中,液体制剂可能是期望的,以增加特定药物的功效和递送能力。 此外,可以修改装置以促进内皮化。 可以使用各种材料和涂覆方法来将药物,试剂或化合物维持在医疗装置上,直到输送和定位。 此外,可以修改用于递送可植入医疗装置的装置,以减少在展开期间损害可植入医疗装置的可能性。 医疗器械包括支架,移植物,吻合装置,血管周围包裹物,缝线和钉。 此外,可以使用各种聚合物组合来控制来自可植入医疗装置的治疗药物,药剂和/或化合物的洗脱速率。
    • 46. 发明申请
    • CPP head with parasitic shunting reduction
    • CPP头与寄生分流减少
    • US20050130070A1
    • 2005-06-16
    • US10734422
    • 2003-12-12
    • Jeiwei ChangStuart KaoChao ChenChunping LuoKochan JuMin Li
    • Jeiwei ChangStuart KaoChao ChenChunping LuoKochan JuMin Li
    • G03F7/00G11B5/31G11B5/39
    • G11B5/3163G11B5/398Y10T428/1171
    • The series resistance of a CPP GMR stack can be reduced by shaping it into a small upper, on a somewhat larger, lower part. Because of the sub-micron dimensions involved, good alignment between these is normally difficult to achieve. The present invention discloses a self-alignment process based on first laying down a mask that will determine the shape of the top part. Ion beam etching is then initiated, the ion beam being initially applied from one side only at an angle to the surface normal. During etching, all material on the near side of the mask gets etched but, on the far side, only material that is outside the mask's shadow gets removed so, depending on the beam's angle, the size of the lower part is controlled and the upper part is precisely centrally aligned above it.
    • CPP GMR堆叠的串联电阻可以通过将其成形为较小的上部,在较小的较低部分上来减小。 由于涉及亚微米尺寸,这些之间的良好对准通常难以实现。 本发明公开了一种基于第一次铺设掩模的自对准过程,该掩模将确定顶部的形状。 然后开始离子束蚀刻,离子束最初仅从一侧以与表面法线成一定角度施加。 在蚀刻期间,掩模近侧的所有材料都被蚀刻,但在远侧,只有在掩模阴影之外的材料被去除,因此根据光束的角度,下部的尺寸被控制,并且上部 部分精确地集中在其上。