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    • 43. 发明申请
    • Non-volatile semiconductor memory device and manufacturing method thereof
    • 非易失性半导体存储器件及其制造方法
    • US20050056895A1
    • 2005-03-17
    • US10956109
    • 2004-10-04
    • Kazuhiro ShimizuYuji Takeuchi
    • Kazuhiro ShimizuYuji Takeuchi
    • H01L21/8247H01L27/115H01L29/788
    • H01L27/11521H01L27/115
    • A non-volatile semiconductor memory device with a small variation in capacitance-coupling to the stacked gate for memory miniaturization. The device has a memory cell array in which memory cells are arranged in array. Each cell has a first gate and a second gate on a semiconductor substrate. The first gate is formed, via a first gate insulating film, on each of device forming regions isolated by device-isolating insulating films. The second gate is formed on the first gate via a second gate insulating film. The first gate is patterned so that its portion is overlapped on the isolation insulating film from the device forming region. A protective insulating film is provided on the isolation film between the device forming regions and in the vicinity of the first gate. A charge-storage layer of each memory cell has at least two stacked conductive layers with a small isolation width at a low aspect ratio for burying isolation insulating films for high density, to easily fabricate in low cost. The side face of the lowest conductive layer meets the side portion of the isolation region. The highest conductive layer has the same width as or is wider than the lowest conductive layer. The first conductive layer is thin for decrease in aspect ratio for burying the insulating film. The second conductive layer has a specific thickness for attaining a desired capacitance between it and the control gate. The highest layer may be formed in self-alignment with the isolation region and stretched out by isotropic-etching.
    • 一种与用于存储器小型化的堆叠栅极的电容耦合变化小的非易失性半导体存储器件。 该器件具有存储单元阵列,其中存储单元被排列成阵列。 每个单元在半导体衬底上具有第一栅极和第二栅极。 第一栅极通过第一栅极绝缘膜在通过器件隔离绝缘膜隔离的器件形成区域中形成。 第二栅极通过第二栅极绝缘膜形成在第一栅极上。 第一栅极被图案化,使得其部分与器件形成区域重叠在隔离绝缘膜上。 保护绝缘膜设置在器件形成区域之间和第一栅极附近的隔离膜上。 每个存储单元的电荷存储层具有至少两个堆叠的导电层,在低纵横比下具有小的隔离宽度,用于埋入用于高密度的隔离绝缘膜,以便以低成本容易地制造。 最低导电层的侧面与隔离区域的侧面相交。 最高的导电层具有与最低导电层相同的宽度或比其更宽的导电层。 第一导电层对于掩埋绝缘膜的纵横比降低是薄的。 第二导电层具有用于在其与控制栅之间获得所需电容的特定厚度。 最高层可以与隔离区自对准形成并通过各向同性蚀刻拉伸。