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41. 发明申请

US20050020701A1 Method of treating waste product containing flexible polyurethane resin 失效
标题翻译：处理含有柔性聚氨酯树脂废物的方法
公开(公告)号：US20050020701A1
公开(公告)日：2005-01-27
申请号：US10873237
申请日：2004-06-23
申请人： Shioko Saya , Taro Fukaya , Cao Thai , Shinetsu Fujieda
发明人： Shioko Saya , Taro Fukaya , Cao Thai , Shinetsu Fujieda
IPC分类号： C08J11/18 , C08J11/22 , C08J11/26 , C08G18/00
CPC分类号： C08G18/83 , C08J11/22 , C08J2375/04 , Y02W30/706
摘要： A method of treating waste product containing flexible polyurethane resin includes adding a decomposing agent to the waste product to start a decomposition reaction; and terminating the decomposition reaction at a stage in which a diamine concentration derived from an isocyanate raw material of the flexible polyurethane resin is 2 wt % or lower to obtain a pasty intermediate product.
摘要翻译：一种处理含有柔性聚氨酯树脂的废产物的方法，包括向废物中加入分解剂开始分解反应; 并在来自软质聚氨酯树脂的异氰酸酯原料的二胺浓度为2重量％以下的阶段终止分解反应，得到糊状中间体。

42. 发明授权

US5272377A Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition 失效
标题翻译：使用该组合物制造的马来酰亚胺树脂组合物和树脂封装的半导体器件
公开(公告)号：US5272377A
公开(公告)日：1993-12-21
申请号：US785812
申请日：1991-10-31
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Michiya Higashi , Akira Yoshizumi
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Michiya Higashi , Akira Yoshizumi
IPC分类号： C08L61/06 , C08K5/14 , C08K5/5313 , C08L35/00 , C08L61/04 , C08L79/08 , H01B3/30 , H01L23/29 , H01L23/31 , H01L23/28
CPC分类号： H01L23/293 , C08K5/14 , C08K5/5313 , C08L79/085 , H01B3/306 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1433
摘要： The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.
摘要翻译：该装置的特征在于含有0.2重量％以下的有机酸，酚醛树脂，碱性催化剂和过氧化物的组合的马来酰亚胺树脂作为固化催化剂。此外，含有作为脱模剂的添加剂如聚乙烯蜡和无机填料。马来酰亚胺树脂组合物的制备方法是将一部分酚醛树脂与其它组分预先与固化催化剂预混合，同时将剩余的酚醛树脂加入到马来酰亚胺树脂中进行预聚合，然后将预混物并将预分散器与其它组分混合。马来酰亚胺树脂组合物通过组合使用碱性催化剂和作为固化剂的过氧化物来改善固化特性，具有优异的成型性。此外，通过用树脂组合物封装半导体元件制造的树脂封装的半导体器件具有优异的耐热性和耐湿可靠性。

43. 发明授权

US5252639A Molding resin composition and molded electronic component 失效
标题翻译：成型树脂组合物和模制电子部件
公开(公告)号：US5252639A
公开(公告)日：1993-10-12
申请号：US796896
申请日：1991-11-25
申请人： Shinetsu Fujieda , Akira Yoshizumi , Kazutaka Matsumoto , Hisayuki Hirai
发明人： Shinetsu Fujieda , Akira Yoshizumi , Kazutaka Matsumoto , Hisayuki Hirai
IPC分类号： C08K5/00 , H01L23/29 , C08K5/09
CPC分类号： H01L23/293 , C08K5/00 , C08K5/0091 , H01L2924/0002
摘要： The molding resin composition of this invention comprises a resin contained a releasing a agents formulated with a release agent and a metal chelate compound.This resin composition is improved an good adhesivity, high moisture resistivity and a good moldability.
摘要翻译：本发明的成型树脂组合物包含含有脱模剂和金属螯合物配制的试剂的树脂。该树脂组合物具有良好的粘合性，高的耐湿性和良好的成型性。

44. 发明申请

US20080302970A1 RADIATION RAY DETECTOR 审中-公开
标题翻译：辐射检测器
公开(公告)号：US20080302970A1
公开(公告)日：2008-12-11
申请号：US12038596
申请日：2008-02-27
申请人： Shinetsu Fujieda , Hiroko Watando , Akinori Honguu
发明人： Shinetsu Fujieda , Hiroko Watando , Akinori Honguu
IPC分类号： G01T1/20
CPC分类号： G01T1/2018 , H01L27/14663
摘要： A radiation ray detector includes an electrode substrate includes a transparent substrate, a plurality of thin film transistors and a plurality of collecting capacitors formed on the transparent substrate, respectively, an insulation layer formed on the transparent substrate including these thin film transistors and collecting capacitors, and a plurality of photoelectric conversion elements connected to respective thin film transistors and converting visible light into an electrical signal. A scintillator layer is formed on the electrode substrate. A protective layer comprises a reflective layer formed on the scintillator layer and containing a thermoplastic polymer compound and a titanium oxide powder contained therein in an amount of 70 wt % or more, an adhesive layer formed on the surface of the electrode substrate including the reflective layer, and a moisture-proof layer adhered to the adhesive layer and having a moisture transmittance of 0.5 g/m2/day or less at 40° C. and 90% RH.
摘要翻译：辐射线检测器包括：电极基板，分别包括透明基板，多个薄膜晶体管和多个集电电容器，分别形成在透明基板上;绝缘层，形成在包括这些薄膜晶体管和收集电容器的透明基板上; 以及连接到各个薄膜晶体管并将可见光转换成电信号的多个光电转换元件。在电极基板上形成闪烁体层。保护层包括在闪烁体层上形成的反射层，其含有70重量％以上的含有热塑性聚合物化合物和氧化钛粉末，形成在包含反射层的电极基板的表面上的粘接层，并且在40℃和90％RH下粘合到粘合剂层上并具有0.5g / m 2 /天或更少的透湿度的防潮层。

45. 发明授权

US07026379B2 Copolymer resin composition and production process thereof 失效
公开(公告)号：US07026379B2
公开(公告)日：2006-04-11
申请号：US10233521
申请日：2002-09-04
申请人： Yumiko Oyasato , Shinetsu Fujieda , Kazutaka Matsumoto
发明人： Yumiko Oyasato , Shinetsu Fujieda , Kazutaka Matsumoto
IPC分类号： C08L5/04 , C08L5/06
CPC分类号： C08G63/664 , C08G63/668 , C08G81/00 , Y10S428/91 , Y10S428/922 , Y10T428/259 , Y10T428/265 , Y10T428/31786
摘要： A copolymer resin composition provided by the process of the present invention is of considerable strength and moldability and is produced by polymerization of a monosaccharide or a polysaccharide that is derived from natural objects and has a hydroxyl group, and a carboxyl group or a salt thereof with a compound having a hydroxyl group and a carboxyl group. The monosaccharide or the polysaccharide serves as a polyfunctional central compound. The copolymer resin composition is obtained through dehydration-polycondensation of (A) at least one selected from the group consisting of a monosaccharide and a polysaccharide having a hydroxyl group, and a carboxyl group or an ion-exchanged carboxyl group; and (B) at least one selected from the group consisting of (b1) hydroxycarboxylic acid, (b2) polyhydroxycarboxylic acid, (b3) a mixture of an aliphatic polyol and an aliphatic polybasic acid, and (b4) an aliphatic polyester obtained by the reaction of an aliphatic polyol with an aliphatic polybasic acid. Preferably, alginic acid is used to serve as the monosaccharide or the polysaccharide having a hydroxyl group and a carboxyl group.

46. 发明授权

US5641997A Plastic-encapsulated semiconductor device 失效
标题翻译：塑料封装的半导体器件
公开(公告)号：US5641997A
公开(公告)日：1997-06-24
申请号：US305478
申请日：1994-09-13
申请人： Hideo Ohta , Tetsuo Okuyama , Shinetsu Fujieda , Sadao Kajiura , Akira Yoshizumi
发明人： Hideo Ohta , Tetsuo Okuyama , Shinetsu Fujieda , Sadao Kajiura , Akira Yoshizumi
IPC分类号： C08L63/00 , H01L21/56 , H01L23/29 , H01L23/433
CPC分类号： C08L63/00 , H01L21/56 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01077 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/1815
摘要： A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.
摘要翻译：半导体芯片位于封装片之间。封装片各自具有高粘合性的表面和较少粘合剂的表面。高度粘合的封装片的表面接触芯片。粘合剂较少的表面与模具接触。随后，通过模塑进行包封。可以在不降低脱模性的情况下改善耐焊接性。

47. 发明授权

US5346743A Resin encapsulation type semiconductor device 失效
标题翻译：树脂封装型半导体器件
公开(公告)号：US5346743A
公开(公告)日：1994-09-13
申请号：US28696
申请日：1993-03-08
申请人： Ken Uchida , Michiya Higashi , Shinetsu Fujieda
发明人： Ken Uchida , Michiya Higashi , Shinetsu Fujieda
IPC分类号： C08G59/32 , C08G59/68 , C08L63/00 , H01B3/40 , H01L23/29
CPC分类号： H01L23/293 , C08G59/3218 , C08G59/686 , C08L63/00 , H01B3/40 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1433 , H01L2924/181 , Y10T428/239
摘要： According to a first embodiment of the present invention, there is provided a resin encapsulation type semiconductor device, comprising a semiconductor element and an epoxy resin composition used as an encapsulating resin, the composition containing as essential components:(a) an epoxy resin represented by formula (I) given below: ##STR1## where R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are hydrogen or an alkyl group respectively, and n.gtoreq.0,(b) a phenolic resin curing agent,(c) an imidazole compound, and(d) triphenyl phosphate.In the first embodiment of the present invention, a heat resistance skeletal structure is formed by the epoxy resin (a) and the phenolic resin curing agent (b) in the epoxy resin composition after cured, leading to an improved resistance to heat and to an improved package crack resistance. Further, the combination of the imidazole compound (c) used as a curing catalyst and triphenyl phosphate (d) permits ensuring a high reliability in terms of the humidity resistance and also permits improving the resistance to the external contamination.
摘要翻译：根据本发明的第一实施例，提供一种树脂封装型半导体器件，其包含半导体元件和用作封装树脂的环氧树脂组合物，该组合物含有作为必要成分的组合物：（a）由式（I）：其中R1，R2，R3和R4分别是氢或烷基，n≥0，（b）酚醛树脂固化剂，（c）咪唑化合物和（d）磷酸三苯酯。在本发明的第一实施方案中，环氧树脂组合物中的环氧树脂（a）和酚醛树脂固化剂（b）在固化后形成耐热骨架结构，导致耐热性提高提高包装抗裂性。此外，用作固化催化剂的咪唑化合物（c）和磷酸三苯酯（d）的组合可以确保在耐湿性方面的高可靠性，并且还可以改善对外部污染的抵抗力。

48. 发明授权

US5216077A Rubber-modified phenolic resin composition and method of manufacturing the same 失效
标题翻译：橡胶改性酚醛树脂组合物及其制造方法
公开(公告)号：US5216077A
公开(公告)日：1993-06-01
申请号：US874226
申请日：1992-04-27
申请人： Akira Yoshizumi , Shinetsu Fujieda , Ken Uchida , Naoko Kihara , Kazuhiro Sawai , Tsutomu Nagata , Shinji Murakami , Shigeyuki Kouchiyama
发明人： Akira Yoshizumi , Shinetsu Fujieda , Ken Uchida , Naoko Kihara , Kazuhiro Sawai , Tsutomu Nagata , Shinji Murakami , Shigeyuki Kouchiyama
IPC分类号： C08L61/06 , C08L63/00 , H01B3/40
CPC分类号： H01B3/40 , C08L61/06 , C08L63/00
摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
摘要翻译：橡胶改性酚醛树脂组合物含有酚醛清漆型酚醛树脂，其中至少一种选自ABS树脂和MBS树脂的改性剂均匀分散。该组合物具有良好的抗冲击性和耐热冲击性。通过将上述至少一种改性剂加入到其软化点或更高温度下被加热和熔化的酚醛清漆型酚醛树脂来制备组合物，使得改性剂均匀分散在树脂中。树脂组合物适合用作环氧树脂密封剂用于密封电子器件的固化剂。

49. 发明授权

US5043211A Epoxy resin composition and a resin-sealed semiconductor device 失效
标题翻译：环氧树脂组合物和树脂密封半导体器件
公开(公告)号：US5043211A
公开(公告)日：1991-08-27
申请号：US175225
申请日：1988-03-30
申请人： Akira Yoshizumi , Kazutaka Matsumoto , Shinetsu Fujieda , Ken Uchida
发明人： Akira Yoshizumi , Kazutaka Matsumoto , Shinetsu Fujieda , Ken Uchida
IPC分类号： C08G59/00 , C08G59/18 , C08G59/40 , C08G59/62 , C08K9/06 , C08K9/08 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/296 , C08K9/08 , C08L63/00 , H01L23/295 , H01L2924/0002 , Y10T428/239 , Y10T428/259 , Y10T428/31511
摘要： An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.

50. 发明申请

US20100116997A1 RADIATION DETECTOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：辐射探测器及其制造方法
公开(公告)号：US20100116997A1
公开(公告)日：2010-05-13
申请号：US12692902
申请日：2010-01-25
申请人： Katsuhisa Homma , Shinetsu Fujieda
发明人： Katsuhisa Homma , Shinetsu Fujieda
IPC分类号： G01T1/20 , H01L31/0232
CPC分类号： H01L27/1446 , G01T1/2002 , H01L27/14625 , H01L27/14663
摘要： A radiation detector characterized by includes a photoelectric conversion element, a scintillation layer which converts radioactive rays to fluorescence, the scintillation layer being formed on the photoelectric conversion element, and a reflective film formed on the scintillation layer, the reflective film containing light-scattering particles for reflecting the fluorescence from the scintillation layer and a binder material binding the light-scattering particles, and having depletion portions without being filled with the binder material, the depletion portions being formed in a periphery of the light-scattering particles.
摘要翻译：一种辐射探测器，其特征在于包括光电转换元件，将放射线转换为荧光的闪烁层，形成在光电转换元件上的闪烁层和形成在闪烁层上的反射膜，反射膜含有光散射粒子用于反射来自闪烁层的荧光和粘合光散射颗粒的粘合剂材料，并且在不填充粘合剂材料的情况下具有耗尽部分，所述耗尽部分形成在光散射颗粒的周围。

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