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41. 发明授权

US09572244B1 Latch device for heat dissipation component 有权
标题翻译：用于散热部件的锁定装置
公开(公告)号：US09572244B1
公开(公告)日：2017-02-14
申请号：US14882390
申请日：2015-10-13
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin
IPC分类号： H05K1/02
CPC分类号： H05K1/0203 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H05K1/0209 , H05K2201/066 , H05K2201/10393 , H05K2201/10598
摘要： A latch device for heat dissipation component includes a main body, a first and a second elastic member, a first and a second rotary unit. Two sides of the main body are respectively formed with a first and a second perforation. The first and second elastic members are fixedly disposed on one face of a motherboard. A first and a second hook/latch section respectively protrude from the first and the second elastic members corresponding to the first and second perforations. By means of a first and a second hook/latch member, the first and second rotary units are correspondingly hooked/latch with the first and second hook/latch sections. Then, the first and second rotary units are rotated to pull upward the first and second hook/latch members; further the first and second hook/latch sections can fix the main body. Hence, a user can assemble/detach the main body without using any hand tool.
摘要翻译：用于散热部件的闩锁装置包括主体，第一和第二弹性部件，第一和第二旋转单元。主体的两侧分别形成有第一和第二穿孔。第一和第二弹性构件固定地设置在主板的一个面上。第一和第二钩/闩锁部分分别从对应于第一和第二穿孔的第一和第二弹性部件伸出。通过第一和第二钩/闩构件，第一和第二旋转单元相应地与第一和第二钩/闩锁部分钩挂/锁定。然后，第一和第二旋转单元被旋转以向上拉第一和第二钩/闩构件; 此外，第一和第二钩/闩锁部分可以固定主体。因此，用户可以在不使用任何手动工具的情况下组装/拆卸主体。

42. 发明申请

US20150233646A1 THERMAL MODULE ASSEMBLING STRUCTURE 审中-公开
标题翻译：热模块组装结构
公开(公告)号：US20150233646A1
公开(公告)日：2015-08-20
申请号：US14184433
申请日：2014-02-19
申请人： Asia Vital Components Co., Ltd.
发明人： Sheng-Huang Lin , Kuo-Sheng Lin
IPC分类号： F28D15/02 , F28D15/04
CPC分类号： F28D15/0275 , F28D15/0233
摘要： A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.
摘要翻译：热模块组装结构包括散热板和至少一个热管。散热板具有用于将热管装配到其中的接收通道。接收通道的上侧的两侧分别形成有两个肋。肋骨水平地突出并且朝向容纳通道的中部延伸，以面对装配在接收通道中的热管。至少一个变形的凹部形成在每个肋的上表面上，由此肋的下表面和热管的表面变形以在肋的下表面之间形成至少一个变形的连接部分，热管表面。通过变形连接部的限制，防止热管从接收通道中抽出。

43. 发明申请

US20140248078A1 FASTENING STRUCTURE FOR THERMAL MODULE 有权
公开(公告)号：US20140248078A1
公开(公告)日：2014-09-04
申请号：US14278107
申请日：2014-05-15
申请人： Asia Vital Components Co., Ltd.
发明人： Sheng-Huang Lin
IPC分类号： F16B2/06
CPC分类号： F16B2/065 , F16B5/0241 , F16B21/078 , F16B21/088 , F16B43/025 , F28D15/0275 , F28F2275/20 , H01L23/427 , H01L2023/4087 , H01L2924/0002 , Y10T403/54 , Y10T403/7033 , H01L2924/00
摘要： A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary.

44. 发明申请

US20140090795A1 LED HEAT SINK AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译： LED散热及其制造方法
公开(公告)号：US20140090795A1
公开(公告)日：2014-04-03
申请号：US14090710
申请日：2013-11-26
申请人： Asia Vital Components Co., Ltd.
发明人： Sheng-Huang Lin , Kuo-Sheng Lin
IPC分类号： F21V29/00
CPC分类号： F21V29/77 , F21K9/00 , F21V29/76 , F21V29/773 , F21V29/89 , F21Y2115/10 , Y10T29/49393
摘要： An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink.
摘要翻译：公开了一种LED散热器及其制造方法。 LED散热器包括具有热接收部分和延伸传热部分的主体。传热部分外部设置有多个接收槽，用于与多个散热片相对应地连接。 LED散热器制造方法包括使用半熔融金属材料成型主体并冷却主体的步骤，使得冷却的主体与多个散热片连接以形成一体的单元。利用LED散热器制造方法，可以制造具有相对复杂的散热片结构或由两种或更多种材料形成的LED散热器，并且大大减少LED热时间，人力和材料成本水槽。

45. 发明公开

US20230243596A1 HEAT DISSIPATION DEVICE 审中-公开
公开(公告)号：US20230243596A1
公开(公告)日：2023-08-03
申请号：US18064289
申请日：2022-12-12
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin , Yuan-Yi Lin
IPC分类号： F28D15/02 , H05K7/20 , F28F3/04
CPC分类号： F28D15/0275 , H05K7/20336 , F28F3/048
摘要： A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.

46. 发明公开

US20230243595A1 THERMAL MODULE ASSEMBLING STRUCTURE 审中-公开
公开(公告)号：US20230243595A1
公开(公告)日：2023-08-03
申请号：US18064287
申请日：2022-12-12
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin , Yuan-Yi Lin
IPC分类号： F28D15/02 , F28F9/26 , F28F21/08
CPC分类号： F28D15/0275 , F28F9/268 , F28F21/085
摘要： A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.

47. 发明公开

US20230241728A1 MANUFACTURING METHOD OF THERMAL MODULE 审中-公开
公开(公告)号：US20230241728A1
公开(公告)日：2023-08-03
申请号：US18064288
申请日：2022-12-12
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin , Yuan-Yi Lin
IPC分类号： B23P15/26
CPC分类号： B23P15/26
摘要： A manufacturing method of thermal module includes steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component. By means of the copper embedding layer, the aluminum heat conduction component can be welded and connected with other heat conduction components made of heterogeneous materials and the same material.

48. 发明申请

US20220141994A1 HEAT DISSIPATION DEVICE WITH MULTIPLE HEAT DISSIPATION ZONES 有权
公开(公告)号：US20220141994A1
公开(公告)日：2022-05-05
申请号：US17087627
申请日：2020-11-03
申请人： ASIA VITAL COMPONENTS CO., LTD
发明人： Sheng-Huang Lin , Yen-Lin Chu
IPC分类号： H05K7/20
摘要： A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.

49. 发明授权

US11143460B2 Vapor chamber structure 有权
公开(公告)号：US11143460B2
公开(公告)日：2021-10-12
申请号：US16033180
申请日：2018-07-11
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin
IPC分类号： F28D15/02 , F28D15/04
摘要： A vapor chamber structure includes a main body. The main body has a first section, a second section, a capillary structure and a working fluid. The first section has a first chamber. The second section has a second chamber. The second section extends from one end of the first section in a direction away from the first section. The capillary structure is disposed on inner surfaces of the first and second chambers. The working fluid is filled in the first and second chambers. The vapor chamber structure has both heat spreading effect and remote end heat dissipation effect.

50. 发明申请

US20210123686A1 HEAT TRANSFER MEMBER REINFORCEMENT STRUCTURE 有权
公开(公告)号：US20210123686A1
公开(公告)日：2021-04-29
申请号：US16666422
申请日：2019-10-29
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin , Yuan-Yi Lin
IPC分类号： F28D15/04
摘要： A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

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