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    • 45. 发明授权
    • Organic light emitting device having surface-treated bottom electrode
    • 具有表面处理底部电极的有机发光器件
    • US08058796B2
    • 2011-11-15
    • US12087465
    • 2007-01-08
    • Jae Seung LeeJung Bum KimYoung Chul Lee
    • Jae Seung LeeJung Bum KimYoung Chul Lee
    • G09G3/30H01J35/24H01J1/62
    • C09K11/06H05B33/14
    • Disclosed is a method of manufacturing an organic light emitting device, which comprises the steps of successively stacking a bottom electrode, an organic layer including an emission layer, and a top electrode, the method further comprising the step of: surface-treating the bottom electrode with ion beam etching before stacking the organic layer. By effectively removing impurities such as polymer materials or oxidation films, which are formed on the bottom electrode of the organic light emitting device, not only electron injection and hole injection in the organic light emitting device progress smoothly, but also an operation voltage is lowered and performance reliability can ensured because the surface roughness of the bottom electrode is maintained at the same level before and after ion milling.
    • 公开了一种制造有机发光器件的方法,其包括以下步骤:连续堆叠底电极,包括发射层的有机层和顶电极,所述方法还包括以下步骤:对所述底电极进行表面处理 在堆叠有机层之前进行离子束蚀刻。 通过有效地除去形成在有机发光器件的底部电极上的诸如聚合物材料或氧化膜的杂质,不仅有机发光器件中的电子注入和空穴注入进行顺利,还降低了操作电压, 由于底电极的表面粗糙度在离子研磨前后维持在相同的水平,所以可确保性能的可靠性。
    • 47. 发明申请
    • INSERT MODULE FOR A TEST HANDLER
    • 插入模块用于测试操作
    • US20100155725A1
    • 2010-06-24
    • US12638292
    • 2009-12-15
    • Young-Chul LEEJeong-Tae CholDong-Gu KimWoon-Sik Kim
    • Young-Chul LEEJeong-Tae CholDong-Gu KimWoon-Sik Kim
    • H01L23/58
    • G01R1/0466
    • An insert module for a test handler includes an insert body and a support frame. The insert body has a receiving space for receiving a semiconductor device. The semiconductor device having connection pads protruding externally from a surface of the semiconductor device. The support frame is formed in an inner side portion of the insert body defining the receiving space to provide a seating surface for contacting and supporting the semiconductor device. The support frame includes a fixing frame and a guide pattern. The fixing frame is inserted into and fixed with the insert body and defines an opening that exposes the semiconductor device. The guide pattern extends from the fixing frame to the inside of the opening to contact the semiconductor device and guide the connection pads.
    • 用于测试处理器的插入模块包括插入体和支撑框架。 插入体具有用于接收半导体器件的接收空间。 具有从半导体器件的表面向外突出的连接焊盘的半导体器件。 支撑框架形成在插入体的限定接收空间的内侧部分中,以提供用于接触和支撑半导体器件的就座表面。 支撑框架包括固定框架和引导图案。 固定框架插入并固定在插入体上并限定了露出半导体器件的开口。 引导图案从固定框架延伸到开口的内部以与半导体器件接触并引导连接焊盘。