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41. 发明申请

US20080026628A1 Pin Grid Array Zero Insertion Force Connectors Configurable for Supporting Large Pin Counts 有权
标题翻译：针脚阵列零插入力连接器可配置为支持大引脚数
公开(公告)号：US20080026628A1
公开(公告)日：2008-01-31
申请号：US11763499
申请日：2007-06-15
申请人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
发明人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
IPC分类号： H01R13/625
CPC分类号： H01R13/193 , H05K7/1007
摘要： A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.
摘要翻译：包括多个子插座部件的PGA插座，当组合使用时形成较大的有效插座，包括配置成接收IC的相应引脚的多个孔。 PGA插座还包括多个接触构件，每个接触构件对应于相应的一个孔。接触构件被构造成在孔的相应移动时可移动地接合IC的相应销，以便提供与其的电和机械接触。每个子插座部件被构造成机械地接合其他子插座部件中的至少一个，使得每个子插座部件中的接触部件能够基本上同时电连接到IC的相应引脚。

42. 发明授权

US07293994B2 Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member 有权
标题翻译：使用通过保持构件捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置
公开(公告)号：US07293994B2
公开(公告)日：2007-11-13
申请号：US11297307
申请日：2005-12-08
申请人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
发明人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H01R12/52 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208
摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
摘要翻译：一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。弹性线束设置在每个孔中。非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

43. 发明授权

US07284992B2 Electronic package structures using land grid array interposers for module-to-board interconnection 有权
标题翻译：电子封装结构使用地面栅格阵列插入器进行模块到板的互连
公开(公告)号：US07284992B2
公开(公告)日：2007-10-23
申请号：US11386343
申请日：2006-03-22
申请人： Wiren Dale Becker , William Louis Brodsky , Evan George Colgan , Michael Ford McAllister , Edward Seminaro , John Torok
发明人： Wiren Dale Becker , William Louis Brodsky , Evan George Colgan , Michael Ford McAllister , Edward Seminaro , John Torok
IPC分类号： H01R12/00
CPC分类号： H01L23/49838 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/4985 , H01L2224/16225 , H01L2224/73253 , H01L2924/09701 , H05K1/141 , H05K3/325 , H05K3/368
摘要： Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.
摘要翻译：提供的装置和方法用于构建使用LGA（地面栅格阵列）模块到板连接器的电子封装结构，其被设计为通过扩展LGA面积来提供更高计数的I / O互连，但不必增加芯片模块占用面积或减少 LGA插入器或电路板的面积阵列I / O触点的间距超出实际限制。

44. 发明授权

US07083477B1 Providing mechanical support for modular interconnect systems 失效
标题翻译：为模块化互连系统提供机械支持
公开(公告)号：US07083477B1
公开(公告)日：2006-08-01
申请号：US11193822
申请日：2005-07-29
申请人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
发明人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
IPC分类号： H01R9/22
CPC分类号： H01R12/52 , H01R12/727
摘要： A connector system includes a first connector assembly that is electrically connected to wiring on a first printed wiring board and a second connector assembly that is electrically connected to wiring on a second printed wiring board. Each connector assembly includes a number of connector modules that are joined together in a predetermined array such as a row. In one of the connector assemblies, the row also includes one or more actuation modules. The actuation module or modules are engaged by an actuator mechanism to force the connector assemblies into mating engagement or to draw them apart.
摘要翻译：连接器系统包括电连接到第一印刷线路板上的布线的第一连接器组件和与第二印刷线路板上的布线电连接的第二连接器组件。每个连接器组件包括多个连接器模块，其以诸如行的预定阵列连接在一起。在一个连接器组件中，该行还包括一个或多个致动模块。致动模块或模块通过致动器机构接合以迫使连接器组件配合接合或将它们分开。

45. 发明授权

US07987584B2 Article extraction / insertion tool and assembly 失效
标题翻译：文章提取/插入工具和装配
公开(公告)号：US07987584B2
公开(公告)日：2011-08-02
申请号：US12025099
申请日：2008-02-04
申请人： Kyle Steven Barna , William Louis Brodsky , John G. Torok
发明人： Kyle Steven Barna , William Louis Brodsky , John G. Torok
IPC分类号： B23P19/04 , B23P19/00 , H01R13/62
CPC分类号： H05K7/1415 , Y10T29/49822 , Y10T29/53257 , Y10T29/53261 , Y10T29/53283 , Y10T29/53861
摘要： A tool assembly for removing an article from, or inserting an article onto, a printed circuit board which includes a tool housing having a handle portion and an article receiving portion, a plate slidable within the housing, the plate having a handle portion at a first end adjacent to the handle portion of the housing and two receiving portions at a second end, and two lever arms within the housing, each lever arm having a first end pinned to the housing and a second end of each lever arm inserted into the receiving portion of the plate such that each of the lever arms pivots about the pinned first end upon movement of the plate. The tool further comprises a pair of flexible rods located in respective recessed channels on either side of the article receiving portion, with one end of the flexible rods affixed to a first end of each of the lever arms, each of the flexible rods having a free end for interacting with an article retention device. The tool assembly may also include a tool guide for aligning the tool with a desired portion of a printed circuit board.
摘要翻译：一种用于将物品从物品移出或将物品插入到印刷电路板上的工具组件，印刷电路板包括具有手柄部分和物品接收部分的工具壳体，可在壳体内滑动的板，该板在第一位置处具有手柄部分在壳体的手柄部分附近的端部和在第二端处的两个接收部分，以及壳体内的两个杠杆臂，每个杠杆臂具有钉住壳体的第一端和插入接收部分的每个杠杆臂的第二端使得每个杠杆臂在板的移动时围绕固定的第一端枢转。该工具还包括一对柔性杆，位于物品接收部分两侧的相应的凹槽中，柔性杆的一端固定在每个杠杆臂的第一端，每个柔性杆具有自由结束与物品保持装置的交互。工具组件还可以包括用于将工具与印刷电路板的期望部分对准的工具引导件。

46. 发明申请

US20080282539A1 Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member 失效
标题翻译：使用由保持构件在插入件的孔径中捕获的弹性线束电连接两个基板
公开(公告)号：US20080282539A1
公开(公告)日：2008-11-20
申请号：US12183288
申请日：2008-07-31
申请人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
发明人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
IPC分类号： H01R43/00
CPC分类号： H01R13/2407 , H01R12/52 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208
摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
摘要翻译：一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。弹性线束设置在每个孔中。非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

47. 发明授权

US07322844B1 Pin grid array zero insertion force connectors configurable for supporting large pin counts 有权
标题翻译：针脚阵列零插入力连接器可配置为支持大引脚数
公开(公告)号：US07322844B1
公开(公告)日：2008-01-29
申请号：US11496153
申请日：2006-07-31
申请人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
发明人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
IPC分类号： H01R4/50
CPC分类号： H01R13/193 , H05K7/1007
摘要： A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.
摘要翻译：包括多个子插座部件的PGA插座，当组合使用时形成较大的有效插座，包括配置成接收IC的相应引脚的多个孔。 PGA插座还包括多个接触构件，每个接触构件对应于相应的一个孔。接触构件被构造成在孔的相应移动时可移动地接合IC的相应销，以便提供与其的电和机械接触。每个子插座部件被构造成机械地接合其他子插座部件中的至少一个，使得每个子插座部件中的接触部件能够基本上同时电连接到IC的相应引脚。

48. 发明授权

US07168958B1 Wadded-wire LGA contact with parallel solid conductor 失效
标题翻译：焊丝LGA与平行固体导体接触
公开(公告)号：US07168958B1
公开(公告)日：2007-01-30
申请号：US11212007
申请日：2005-08-25
申请人： William Louis Brodsky , John G. Torok
发明人： William Louis Brodsky , John G. Torok
IPC分类号： H01R12/00
CPC分类号： H05K7/1061 , H01R12/714
摘要： A connector, for example an LGA connector to be used in coupling a circuit board to a chip or a multi-chip module, includes an insulating carrier with a through-holes corresponding to the connections to be made above and below the carrier, and contacts in the through-holes. The contacts include wadded-wire wads that protrude above and below the carrier to make contact with the chip or circuit board, but each also includes a solid conductive member that extends over a major portion of the length of the through-hole and is in electro-mechanical connection with the wadded-wire wad or wads in the hole at numerous points along the length of the through-hole. The solid conductive member includes barbs or projections that penetrate the wadded wire. The solid conductive members thus provide a low-resistance parallel path and can also hold the wadded-wire wad or wads in place. A method of making and system are also disclosed.
摘要翻译：连接器，例如用于将电路板耦合到芯片或多芯片模块的LGA连接器包括绝缘载体，其具有与要在载体上方和下方形成的连接相对应的通孔，以及触点在通孔中。触点包括突出在载体上方和下方的焊丝焊丝，以与芯片或电路板接触，但是每个还包括在通孔的长度的大部分上延伸并且处于电 - 在通孔的长度上的许多点处，与焊丝网或焊盘在孔中的机械连接。固体导电构件包括穿过填充线的倒钩或突起。因此，固体导电构件提供低电阻平行路径，并且也可以将填充线束或焊垫保持在适当位置。还公开了制造方法和系统。

49. 发明授权

US07076333B2 Releasable, repeatable electrical connection employing compression 失效
公开(公告)号：US07076333B2
公开(公告)日：2006-07-11
申请号：US10947795
申请日：2004-09-24
申请人： William Louis Brodsky , Dennis Hurley Byrne , Alex Chliwnyj , David Michael Davis , James Mitchell Karp , George G. Zamora
发明人： William Louis Brodsky , Dennis Hurley Byrne , Alex Chliwnyj , David Michael Davis , James Mitchell Karp , George G. Zamora
IPC分类号： G06F19/00
CPC分类号： H05K7/1454 , G06F1/183 , G06F1/184 , G06F1/187 , G11B17/225 , G11B23/049 , G11B33/126 , G11B33/128 , H01R13/2414 , H01R2201/06
摘要： An electrical connection of a transfer station releasably, repeatably electrically couples with respect to a matching connection of a portable cartridge. A substrate in the portable cartridge has electrical contacts on a facing surface. In the transfer station, a matching circuitized flexible substrate has electrical contacts on a facing surface thereof, which are arranged to match the portable cartridge electrical contacts when in a face-to-face relationship. An elastomeric compression element, at the rear of the matching substrate, has individual protruding compression members contacting the rear surface and registered with corresponding individual electrical contacts. Elongated electrical contacts are registered with two adjacent individual compression members. A loader engages the portable cartridge, registering the cartridge substrate contacts in face-to-face relation with the matching flexible substrate electrical contacts, and exerting a normal force to the cartridge to compress the compression element and create non-wiping contact between the facing electrical contacts.

50. 发明授权

US06854982B2 Releasable, repeatable electrical connection employing compression 失效
标题翻译：使用压缩的可释放的，可重复的电气连接
公开(公告)号：US06854982B2
公开(公告)日：2005-02-15
申请号：US10326307
申请日：2002-12-23
申请人： William Louis Brodsky , Dennis Hurley Byrne , Alex Chliwnyj , David Michael Davis , James Mitchell Karp , George G. Zamora
发明人： William Louis Brodsky , Dennis Hurley Byrne , Alex Chliwnyj , David Michael Davis , James Mitchell Karp , George G. Zamora
IPC分类号： G06F1/18 , G11B17/22 , G11B23/04 , G11B25/04 , G11B33/12 , H01R12/04 , H01R13/24 , H05K7/14 , H01R12/00
CPC分类号： H05K7/1454 , G06F1/183 , G06F1/184 , G06F1/187 , G11B17/225 , G11B23/049 , G11B33/126 , G11B33/128 , H01R13/2414 , H01R2201/06
摘要： An electrical connection releasably, repeatably electrically couples with respect to a matching connection of a portable cartridge. A substrate in the portable cartridge has electrical contacts on a facing surface of a flex cable termination mounted on a backing plate. A matching circuitized flexible substrate has electrical contacts on a facing surface thereof, which are arranged to match the portable cartridge electrical contacts when in a face-to-face relationship, and is mounted on a compression element with protruding compression members. Elongated electrical contacts are registered with two adjacent individual compression members. A loader exerts a normal force to the cartridge to compress the compression element and create non-wiping contact between the facing electrical contacts.
摘要翻译：可释放地电连接，可重复地电连接便携式盒的匹配连接。便携式墨盒中的基底在安装在背板上的柔性电缆终端的相对表面上具有电触点。匹配的电路化柔性基板在其相对表面上具有电触点，它们在面对面关系时被配置成与便携式墨盒电触头匹配，并且安装在具有突出的压缩构件的压缩元件上。细长的电触点与两个相邻的单个压缩构件对齐。装载机向筒施加法向力以压缩压缩元件并在面对的电触点之间产生非擦拭接触。

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