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    • 41. 发明授权
    • Device for removing end packaging from web rolls
    • 用于从卷筒纸卷取出端部包装的装置
    • US06453787B2
    • 2002-09-24
    • US09325576
    • 1999-06-03
    • Satoru Yamauchi
    • Satoru Yamauchi
    • B65B6900
    • B65B69/0033Y10S83/924Y10T83/6667Y10T83/896
    • A pair of drawing members, separated by a prescribed distance, are rotated toward each other in contact with an end packaging material covering the ends of a web wrapped on a web roll. The drawing members are brought toward one another, creating an insertion section by gathering the end packaging and separating the end packaging from the web on the web roll. A cutting member is inserted into the insertion section. The web roll is then rotated, whereby the end packaging is cut and removed from an end of a web roll without damaging the web wrapped thereon. Similar drawing members and cutting members are preferably located at each end of an end packaging removal device, thereby simultaneously removing the end packaging material from both ends of the web roll. The resulting end packaging removal device saves time and labor involved in removing end packaging from a web roll.
    • 分隔开规定距离的一对拉伸构件相对于覆盖卷绕在腹板上的腹板的端部的端部包装材料相互接触地旋转。 拉伸构件彼此相向,通过收集端部包装并将端部包装与卷筒纸上的幅材分离而形成插入部分。 切割构件插入到插入部中。 然后将卷筒纸卷筒转动,由此将端部包装从卷筒卷筒纸的端部切割并移除而不会损坏卷绕在其上的纸卷。 类似的拉拔构件和切割构件优选地位于端部包装移除装置的每个端部处,从而同时从腹板卷的两端移除端部包装材料。 所得到的端部包装去除装置节省了从卷筒纸卷取出端部包装所需的时间和劳动。
    • 42. 发明授权
    • Blind automatic gain control system for receivers and modems
    • 用于接收器和调制解调器的盲自动增益控制系统
    • US6148046A
    • 2000-11-14
    • US8970
    • 1998-01-20
    • Ershad HusseinSatoru Yamauchi
    • Ershad HusseinSatoru Yamauchi
    • H04B1/16H04B1/26H04B3/06H04L27/22H04L27/38H04L27/08
    • H04L27/3809
    • The present invention is an apparatus and method for blind automatic gain control in a digital communications device. The present invention includes a maximum error detector (MED) (142) which includes a gain error evaluator (GEE) (144) and a maximum value detector (MVD) (146). Also included is a decision gain adjustor (DGA) (148) which includes a gain value controller (GVD) (150) and an initial value buffer (IVB) (152). The GEE (144) is operable to generate a gain error signal in accordance with an input baseband signal (x) and a sliced version of the input baseband signal (x'). The MVD (146) is operable to generate a renew signal in accordance with the sliced version of the input baseband signal (x') and a first predetermined reference value. The GVD (150) is operable to converge the gain error signal (.DELTA.x) in a first state using a first convergence technique and to converge the resultant signal in a second state using a second convergence technique. The IVB (152) is also used in generating the resultant output gain value signal from the converged gain error signal.
    • 本发明是一种用于数字通信设备中的盲自动增益控制的装置和方法。 本发明包括包括增益误差评估器(GEE)(144)和最大值检测器(MVD)(146))的最大误差检测器(MED)(142)。 还包括包括增益值控制器(GVD)(150)和初始值缓冲器(IVB)(152)的判定增益调节器(DGA)(148)。 GEE(144)可操作以根据输入基带信号(x)和输入基带信号(x')的分片版本产生增益误差信号。 MVD(146)可操作以根据输入基带信号(x')的分片版本和第一预定参考值产生更新信号。 GVD(150)可操作以使用第一收敛技术将增益误差信号(DELTA x)收敛于第一状态,并且使用第二收敛技术将所得到的信号收敛于第二状态。 IVB(152)也用于从会聚的增益误差信号产生合成的输出增益值信号。
    • 46. 发明授权
    • Circuit unit for timepiece and process for fabricating the same
    • 钟表电路单元及其制造方法
    • US4796239A
    • 1989-01-03
    • US37466
    • 1987-04-13
    • Tsuyoshi HayakawaSatoru YamauchiIsato WatanabeIsao Kondo
    • Tsuyoshi HayakawaSatoru YamauchiIsato WatanabeIsao Kondo
    • H01L23/50G04G17/02G04C23/02
    • G04G17/02H01L2924/0002Y10T29/49121
    • A circuit unit including a plurality of lead frames which are made of a metal sheet and one of which is used for die-bonding an integrated circuit. The die-bonding lead member is formed to have at least a generally H-shaped portion constructed of a pair of parallel side portions and a connecting portion for connecting the two side portions for die-bonding the integrated circuit thereto. The remaining lead members are separated from said die-bonding one and have individual end portions positioned in the vicinity of the integrated circuit and connected electrically therewith by means of bonding wires. The die-bonding lead member and the remaining lead members are integrated either with a potting resin for protection the integrated circuit or with the potting resin and/or an insulating plate backing the potting resin. The aforementioned two side portions are fixed on a holding member. Also disclosed is a process for fabricating the aforementioned circuit unit.
    • 一种电路单元,包括由金属片制成的多个引线框架,其中一个用于芯片接合集成电路。 芯片接合引线部件形成为至少具有由一对平行侧部构成的大致H字形部分和用于连接用于将集成电路芯片接合的两个侧部的连接部分。 剩余的引线构件与所述芯片接合元件分离,并且具有位于集成电路附近的各个端部,并且通过接合线与其电连接。 芯片接合引线部件和其余的引线部件与灌封树脂一体化,用于保护集成电路或灌封树脂和/或背衬灌封树脂的绝缘板。 上述两个侧部固定在保持构件上。 还公开了制造上述电路单元的工艺。