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41. 发明申请

US20110207294A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20110207294A1
公开(公告)日：2011-08-25
申请号：US13027551
申请日：2011-02-15
申请人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/762
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译：一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。该方法包括：在第一旋转速度旋转器件基板的同时，将第一研磨带压在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板周边部分的沉积膜并暴露下面的硅; 并且在第二旋转速度旋转所述装置基板的同时将第二研磨带压靠在所述装置基板的周边部分中的暴露的硅上，从而将所述硅抛光至预定的深度。

42. 发明申请

US20110136411A1 METHOD AND APPARATUS FOR POLISHING A SUBSTRATE HAVING A GRINDED BACK SURFACE 有权
标题翻译：用于抛光具有磨光背面的衬底的方法和装置
公开(公告)号：US20110136411A1
公开(公告)日：2011-06-09
申请号：US12956381
申请日：2010-11-30
申请人： Masayuki NAKANISHI , Masunobu Onozawa , Masaya Seki
发明人： Masayuki NAKANISHI , Masunobu Onozawa , Masaya Seki
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B9/065 , B24B21/002
摘要： A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.
摘要翻译：提供了一种能够快速抛光由磨削的背面和基板的圆周表面形成的角部，而不会在薄基板上造成损坏的方法。该方法包括使基板围绕其中心旋转，并且将研磨带压靠在由基板的背面和圆周表面形成的角部上以抛光角部。

43. 发明授权

US07767472B2 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US07767472B2
公开(公告)日：2010-08-03
申请号：US11882398
申请日：2007-08-01
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

44. 发明申请

US20100136886A1 POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：抛光设备和基板加工设备
公开(公告)号：US20100136886A1
公开(公告)日：2010-06-03
申请号：US12699318
申请日：2010-02-03
申请人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
IPC分类号： B24B49/04 , B24B49/12 , B24B21/18 , B24B9/02
CPC分类号： B24B37/02 , B24B9/065 , B24B21/002
摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.
摘要翻译：本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构被设定为低于抛光室的外部压力。

45. 发明申请

US20080228608A1 Order accounting system and order accounting method 审中-公开
标题翻译：订单会计制度和订单核算方法
公开(公告)号：US20080228608A1
公开(公告)日：2008-09-18
申请号：US12074826
申请日：2008-03-06
申请人： Masayuki Kurahashi , Nobuaki Iso , Masayuki Nakanishi
发明人： Masayuki Kurahashi , Nobuaki Iso , Masayuki Nakanishi
IPC分类号： G06Q90/00
CPC分类号： G07G1/14 , G06Q40/12
摘要： To provide an order accounting system capable of swiftly performing accounting processing, and of allowing to understand an account state in real time, in the order accounting system, an order input terminal requests an ordering control device to send unsettled data which is account data for which account has not been settled and receives the unsettled data, performs accounting processing based on the unsettled data, and sends, after the accounting processing is performed, the account identification information included in the unsettled data to the ordering control device as settled account identification information. The ordering control device receives the settled account identification information to update the account data which is stored in the account data storage part and which corresponds to the settled account identification information by setting the account data to a settled state, detects, in response to a request for unsettled data from the order input terminal, the unsettled data from the account data storage part, and sends the detected unsettled data to the order input terminal.
摘要翻译：为了提供能够快速执行会计处理并允许实时了解帐户状态的订单计帐系统，在订单记帐系统中，订单输入终端请求订购控制装置发送未结算数据，该数据是账户数据，账户尚未结算并且接收未完成的数据，根据未结算的数据执行会计处理，并且在进行了计费处理之后，将包含在未结算数据中的账户识别信息作为结算账户识别信息发送给订购控制装置。订购控制装置接收结算的帐户识别信息，以通过将帐户数据设置为确定状态来更新存储在帐户数据存储部分中并对应于已结算帐户识别信息的账户数据，并根据请求进行检测对于来自订单输入端子的不稳定数据，来自帐户数据存储部分的未结算数据，并将检测到的未处理数据发送到订单输入端。

46. 发明申请

US20070228337A1 Conductive composition and conductive paste 有权
标题翻译：导电组合物和导电膏
公开(公告)号：US20070228337A1
公开(公告)日：2007-10-04
申请号：US11727350
申请日：2007-03-26
申请人： Motoki Iijima , Tatsuro Nishimura , Masayuki Nakanishi
发明人： Motoki Iijima , Tatsuro Nishimura , Masayuki Nakanishi
IPC分类号： H01B1/12
CPC分类号： H01B1/22 , H05K1/092
摘要： The present invention provides a conductive composition and a conductive paste from which a conductive film having a high conductivity and a low thermal expansion coefficient can be formed. The thermal expansion coefficient of an island fixing type conductive layer 10 is compatible with that of a substrate 12. A cracking of the island fixing type conductive layer 10 or a crack in the substrate 12 due to a difference between these thermal expansion coefficients is suitably inhibited. The thermal expansion coefficient of the island fixing type conductive layer 10 is adjusted by ZWP contained in the range from 10 to 55 (wt %) as a low-expansion filler. Thus, compared with the case where other low-expansion filler is added, the conductivity degradation is inhibited. Accordingly, the island fixing type conductive layer 10 having a high conductivity and a high bonding strength is obtained.
摘要翻译：本发明提供一种可以形成具有高导电性和低热膨胀系数的导电膜的导电组合物和导电膏。岛固定型导电层10的热膨胀系数与基板12的热膨胀系数相适应。由于这些热膨胀系数之间的差异，岛固定型导电层10的裂纹或基板12中的裂纹被适当地抑制。作为低膨胀填料，岛固定型导电层10的热膨胀系数通过ZWP调整为10〜55（wt％）的范围。因此，与其他低膨胀性填料相比，导电性劣化被抑制。因此，获得导电性高，接合强度高的岛状固定型导电层10。

47. 发明申请

US20060019417A1 Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20060019417A1
公开(公告)日：2006-01-26
申请号：US11187024
申请日：2005-07-22
申请人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
发明人： Atsushi Shigeta , Gen Toyota , Hiroyuki Yano , Kunio Oishi , Kenya Ito , Masayuki Nakanishi , Kenji Yamaguchi
IPC分类号： H01L21/66 , H01L21/302
CPC分类号： B24B37/013 , B24B9/065
摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.
摘要翻译：基板处理方法用于抛光基板。基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间第一表面，并抛光第二表面以确定抛光时间。

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