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    • 49. 发明授权
    • Electronic apparatus
    • 电子仪器
    • US07733648B2
    • 2010-06-08
    • US12073930
    • 2008-03-12
    • Hiromitsu FujiyaHideki KimuraEiji Makabe
    • Hiromitsu FujiyaHideki KimuraEiji Makabe
    • H05K7/20
    • H05K7/20736
    • A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.
    • 第一印刷布线板在垂直方向上延伸的第一导管内沿垂直方向延伸。 第一轴流风扇产生吸收第一印刷线路板的热量的气流。 第二和第三导管与第一导管平行延伸。 第四管道在第二和第三管道之间延伸。 第二印刷线路板在第四导管内沿水平方向延伸。 第二轴流风扇连接到第三管道。 第二轴流风扇产生吸收第二印刷线路板的热量的气流。 电子设备的尺寸可以减小。
    • 50. 发明授权
    • Electronic component unit and electronic apparatus
    • 电子元件单元和电子设备
    • US07623346B2
    • 2009-11-24
    • US12153583
    • 2008-05-21
    • Hiromitsu FujiyaHideki Kimura
    • Hiromitsu FujiyaHideki Kimura
    • H05K7/20H01L23/36
    • H05K7/20727H01L2924/0002H01L2924/00
    • Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.
    • 气流通过电子部件单元中的空气入口引入外壳。 空气流向第一电子部件。 气流吸收来自第一电子部件的热量。 因此,第一电子部件被充分冷却。 第二电子部件安装在印刷电路板上,位于远离第一电子部件的位置的空气入口的位置。 在外壳中形成进气口。 进气口限定在至少在第一和第二电子部件之间的与印刷线路板相对的外壳的一部分处。 通过进气口向第二电子部件引入气流。 因此,第二电子开口被充分冷却。 以这种方式,第一和第二电子部件被最大限度地冷却。