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    • 41. 发明授权
    • Vehicle suspension device
    • 车辆悬挂装置
    • US08556273B2
    • 2013-10-15
    • US13698503
    • 2010-05-19
    • Atsushi Ogawa
    • Atsushi Ogawa
    • B60G17/015
    • B60G17/0157B60G13/02B60G17/06B60G2202/20F16F15/03
    • Four electromagnetic shock absorbers (30) are provided with motors (40FL, 40FR, 40RL, 40RR). First current-carrying terminals (T1) of the motors (40FL, 40FR, 40RL, 40RR) are connected to one another by a ground line (61). Further, second current-carrying terminals (T2) of the motor (40FL) and the motor (40FR) are connected to each other by a front wheel roll damping line (62F). Second current-carrying terminals (T2) of the motor (40RL) and the motor (40RR) are connected to each other by a rear wheel roll damping line (62R). Second current-carrying terminals (T2) of the motor (40FL) and the motor (40RL) are connected to each other by a left wheel pitch damping line (63L). Second current-carrying terminals (T2) of the motor (40FR) and the motor (40RR) are connected to each other by a right wheel pitch damping line (63R). In this manner, appropriate damping forces can be generated with a simple configuration not only against vehicle bouncing but also against vehicle rolling and pitching.
    • 四个电磁减震器(30)设有电动机(40FL,40FR,40RL,40RR)。 电动机(40FL,40FR,40RL,40RR)的第一通电端子(T1)通过接地线(61)彼此连接。 此外,电动机(40FL)和电动机(40FR)的第二通电端子(T2)通过前轮滚动阻尼线(62F)彼此连接。 电动机(40RL)和电动机(40RR)的第二通电端子(T2)通过后轮侧滚动阻尼线(62R)彼此连接。 电动机(40FL)和电动机(40RL)的第二通电端子(T2)通过左车轮节距阻尼线(63L)彼此连接。 电动机(40FR)和电动机(40RR)的第二通电端子(T2)通过右轮节距阻尼线(63R)彼此连接。 以这种方式,可以以简单的构造产生适当的阻尼力,不仅可以防止车辆弹跳,而且可以抵抗车辆滚动和俯仰。
    • 42. 发明授权
    • Drain plug
    • 排水塞
    • US08485593B2
    • 2013-07-16
    • US12923748
    • 2010-10-06
    • Atsushi OgawaTomoki YamaguchiHajime SaitoToshiya Ohba
    • Atsushi OgawaTomoki YamaguchiHajime SaitoToshiya Ohba
    • B65D39/04
    • B62D25/24
    • A drain plug includes a head part arranged on a peripheral edge of a drain hole from a front side, and an engaging leg engaged with the peripheral edge of the drain hole from a back side. The engaging leg includes a frame wall extending in a direction in which a space between a pair of panels forming a body panel is widened; an opening part facing the a connecting part of the pair of panels of the body panel; engaging parts formed on both side walls of the frame wall, to be engaged with the peripheral edge of the drain hole from the back side; and a guide surface formed on a front wall of the frame wall, to guide the engaging parts to pass through the drain hole.
    • 排水塞包括从前侧布置在排水孔的周缘上的头部,以及从后侧与排水孔的周边边缘接合的接合腿。 所述接合腿包括框架壁,所述框架壁沿着形成所述主体面板的一对面板之间的空间变宽的方向延伸; 面向所述主体板的所述一对面板的连接部的开口部; 形成在框架壁的两个侧壁上的接合部分将从后侧与排水孔的周边接合; 以及形成在框架壁的前壁上的引导表面,以引导接合部分通过排水孔。
    • 43. 发明申请
    • Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    • 氮化物半导体激光光源的制造方法以及氮化物半导体激光光源的制造装置
    • US20110174288A1
    • 2011-07-21
    • US13064534
    • 2011-03-30
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • F24B1/00
    • H01S5/02212H01S5/0222H01S5/32341Y10T29/5176
    • A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.
    • 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。
    • 47. 发明授权
    • Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
    • 氮化物半导体激光光源的制造方法及氮化物半导体激光光源的制造装置
    • US07833834B2
    • 2010-11-16
    • US11237946
    • 2005-09-29
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • Daisuke HanaokaMasaya IshidaAtsushi OgawaYoshihiko TaniTakuro Ishikura
    • H01L21/00
    • H01S5/02212H01S5/0222H01S5/32341Y10T29/5176
    • A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean. This method provides a long-life nitride semiconductor laser light source the light emission intensity of which is not easily reduced after a long period of use.
    • 提供一种生产氮化物半导体激光光源的方法。 氮化物半导体激光光源具有氮化物半导体激光器芯片,用于在其上安装激光器芯片的杆和用于覆盖激光器芯片的盖。 激光芯片被封装在由杆和盖组成的密封容器中。 用于制造该氮化物半导体激光光源的方法具有清洁激光芯片,杆或盖的表面的清洁步骤。 在清洁步骤中,激光芯片,阀杆或盖子暴露于臭氧或激发氧原子,或通过加热进行烘烤。 该方法在清洁步骤之后还具有将激光芯片封装在由杆和盖组成的密封容器中的封盖步骤。 在封盖步骤中,激光芯片,阀杆或盖子的清洁表面保持清洁。 该方法提供了长期使用后其发光强度不容易降低的长寿命氮化物半导体激光光源。
    • 49. 发明申请
    • Medical Wire
    • 医用线
    • US20090227899A1
    • 2009-09-10
    • US11577086
    • 2005-10-27
    • Jiro IshidaHironori TakataAtsushi Ogawa
    • Jiro IshidaHironori TakataAtsushi Ogawa
    • A61M25/09A61B17/00
    • A61B17/12022A61B17/12145A61B2017/00292A61B2017/00477A61B2017/12068A61M25/0017A61M25/0045A61M2025/0042
    • Disclosed herein is a medical wire with an intracorporeally indwelling member connected to the leading end part of a conductive wire body through a thermally-fusible connecting member, wherein expected heat generation can be achieved even when a conductive member that causes leak comes into contact with the leading end part of the conductive wire body, and thus the intracorporeally indwelling member can be surely released.This medical wire comprises a conductive wire body and an intracorporeally indwelling member connected to the leading end part of the conductive wire body through a thermally-fusible connecting member, in which the connecting member is heated and fused by supplying an electric current for fusion through the conductive wire body, thereby releasing the intracorporeally indwelling member, wherein a non-conductive coating film is formed on an external peripheral surface of an electrode-forming portion in the leading end part of the wire body, and a part of the surface of the wire body is exposed through the coating film, thereby forming a heating electrode portion.
    • 这里公开了一种具有体内留置构件的医用线,其通过热熔连接构件连接到导线本体的前端部,其中即使当导致泄漏的导电构件与 导电线体的前端部,能够确实地释放体内留置部件。 该医用线包括导体线体和体内留置部件,其通过热熔连接部件与导线本体的前端部连接,在该部件中,连接部件通过供给融合用电流而被加热熔化 导电线体,从而释放体内留置部件,其中在导线主体的前端部分的电极形成部分的外周面上形成非导电涂膜,并且线的表面的一部分 主体通过涂膜曝光,从而形成加热电极部分。
    • 50. 发明申请
    • Method of manufacturing nitride semiconductor light-emitting element and nitride semiconductor light-emitting element
    • 制造氮化物半导体发光元件和氮化物半导体发光元件的方法
    • US20070290224A1
    • 2007-12-20
    • US11808220
    • 2007-06-07
    • Atsushi Ogawa
    • Atsushi Ogawa
    • H01L33/00
    • H01L33/0079H01L33/22H01L33/32H01L2224/48091H01L2224/48247H01L2924/00014
    • There are provided a method of manufacturing a nitride semiconductor light-emitting element in which a nitride semiconductor layer of a first conductivity type, an active layer, and a nitride semiconductor layer of a second conductivity type are stacked in this order, including the steps of forming unevenness at a surface of the nitride semiconductor layer of the first conductivity type, forming unevenness at a surface of the nitride semiconductor layer of the second conductivity type, and forming a first electrode on a side of the nitride semiconductor layer of the first conductivity type and a second electrode on a side of the nitride semiconductor layer of the second conductivity type such that the first and second electrodes are positioned to face each other with the active layer interposed therebetween, and the nitride semiconductor light-emitting element.
    • 提供了一种制造氮化物半导体发光元件的方法,其中依次堆叠第一导电类型,有源层和第二导电类型的氮化物半导体层的氮化物半导体层,其包括以下步骤: 在第一导电类型的氮化物半导体层的表面形成凹凸,在第二导电类型的氮化物半导体层的表面形成凹凸,以及在第一导电类型的氮化物半导体层的一侧上形成第一电极 以及在所述第二导电类型的所述氮化物半导体层的一侧上的第二电极,使得所述第一电极和所述第二电极相对于所述有源层彼此面对,并且所述氮化物半导体发光元件。