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31. 发明公开

US20230157173A1 THERMOELECTRIC MODULE PROTECTION CIRCUIT AND THERMOELECTRIC DEVICE COMPRISING SAME 审中-公开
公开(公告)号：US20230157173A1
公开(公告)日：2023-05-18
申请号：US17917914
申请日：2021-01-21
申请人： TEGWAY CO.,LTD
发明人： Ockkyun OH
IPC分类号： H10N10/17 , H10N19/00 , G01R31/26
CPC分类号： H10N10/17 , H10N19/00 , G01R31/2637
摘要： The present specification relates to a thermoelectric module protection circuit and a thermoelectric device including the same, and According to one aspect of the present specification, there is provided a thermoelectric device including: a thermoelectric module having a first surface providing a thermal stimulus to a user and a second surface opposite to the first surface, and including an N-type semiconductor and a P-type semiconductor disposed between the first surface and the second surface and an electrode configured to electrically connect the N-type semiconductor and the P-type semiconductor, a power supply unit configured to output a predetermined current applied to the thermoelectric module to cause the thermoelectric module to perform a thermoelectric operation including an endothermic operation and an exothermic operation so that the thermal stimulus is provided through the first surface, a voltage monitoring unit configured to monitor an output voltage of the thermoelectric module, wherein the output voltage reflects a temperature difference between the first surface and the second surface, a voltage comparison unit configured to compare the output voltage and a reference voltage, and output an application control signal which instructs whether to apply power to the thermoelectric module to stop supplying the power to the thermoelectric module when the temperature difference is greater than or equal to a threshold value, and a power controller configured to adjust whether to apply the power to the thermoelectric module based on the application control signal.

32. 发明授权

US12108675B1 Seebeck effect renewable energy arrangement 有权
公开(公告)号：US12108675B1
公开(公告)日：2024-10-01
申请号：US18440596
申请日：2024-02-13
申请人： Bernard Pappert
发明人： Bernard Pappert
IPC分类号： H10N10/17 , H10N19/00
CPC分类号： H10N10/17 , H10N19/00
摘要： A Seebeck effect renewable energy arrangement can be used to generate electricity due to temperature differences. The Seebeck effect renewable energy arrangement includes an environmental arrangement, a ground arrangement, and a power output arrangement. The environmental arrangement is connected to the ground arrangement to create an electrical circuit such that the temperature difference between the environmental temperature and the ground temperature generates electricity due to the Seebeck effect. The power output arrangement is operatively connected to the circuit to conduct electricity generated thereby to storage or use to power electrical devices.

33. 发明授权

US12078519B2 Thermopile-based flow sensing device 有权
公开(公告)号：US12078519B2
公开(公告)日：2024-09-03
申请号：US18352767
申请日：2023-07-14
申请人： Honeywell International Inc.
发明人： Robert Higashi , Scott Edward Beck , Yong-Fa Wang , Ian Bentley , Bill Hoover
IPC分类号： G01F1/688 , G01F1/684 , H10N10/851 , H10N19/00
CPC分类号： G01F1/6888 , G01F1/6847 , H10N10/851 , H10N19/00
摘要： Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.

34. 发明公开

US20240284800A1 THERMOELECTRIC DEVICE 审中-公开
公开(公告)号：US20240284800A1
公开(公告)日：2024-08-22
申请号：US18572365
申请日：2022-06-22
申请人： LG INNOTEK CO., LTD
发明人： Un Hak LEE
IPC分类号： H10N19/00 , H10N10/13 , H10N10/17
CPC分类号： H10N19/101 , H10N10/13 , H10N10/17
摘要： A thermoelectric device according to an embodiment of the present invention comprises: a fluid flow part including one surface and the other surface spaced apart from the one surface in a first direction; a first thermoelectric element arranged on one surface of the fluid flow part; and a second thermoelectric element arranged on the other surface of the fluid flow part, wherein a first through-hole penetrating from the one surface to the other surface thereof is arranged in the fluid flow part, and a wire electrically connected to the first thermoelectric element is electrically connected to the second thermoelectric element through the first through-hole.

35. 发明公开

US20240284799A1 DISPLAY MODULE AND DISPLAY APPARATUS 审中-公开
公开(公告)号：US20240284799A1
公开(公告)日：2024-08-22
申请号：US18041747
申请日：2022-02-24
申请人： CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
发明人： Guoqiang TANG , Liang XIA , Kuo SUN
IPC分类号： H10N19/00 , G09G3/3225 , H04M1/72454 , H10K59/80 , H10K59/95 , H10K77/10 , H10N15/10
CPC分类号： H10N19/00 , H04M1/72454 , H10K59/95 , H10K77/10 , H10N15/10 , G09G3/3225 , G09G2330/026 , G09G2330/027 , G09G2354/00 , H10K59/8794
摘要： A display module includes a display panel, a support layer and a pyroelectric induction device layer. The support layer is disposed on a non-display side of the display panel. The pyroelectric induction device layer includes a first electrode layer, a pyroelectric induction layer and a second electrode layer that are sequentially disposed in a thickness direction of the support layer, and at least a portion of the pyroelectric induction device layer is embedded in the support layer.

36. 发明公开

US20240219239A1 VERTICALLY INTEGRATED MICRO-BOLOMETER AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20240219239A1
公开(公告)日：2024-07-04
申请号：US18201996
申请日：2023-05-25
申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
发明人： Yu-Wen HSU , Lu-Pu LIAO , Chao-Ta HUANG , Bo-Kai CHAO
IPC分类号： G01J5/20 , H10N19/00
CPC分类号： G01J5/20 , H10N19/00
摘要： A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots. The surrounding sensing film surrounds the central sensing film. Each of the connecting portions connects the surrounding sensing film and the central sensing film. A central distance from the bottom absorbing layer of the central sensing film to the silicon substrate is substantially equal to a surrounding distance from the bottom absorbing layer of the surrounding sensing film to the silicon substrate.

37. 发明授权

US12010916B2 Compliant three-dimensional thermoelectrics 有权
公开(公告)号：US12010916B2
公开(公告)日：2024-06-11
申请号：US17112586
申请日：2020-12-04
申请人： The Board of Regents of the Nevada System of Higher Education on Behalf of the University of Nevada
发明人： Jaeyun Moon , Matthew Pusko , Kaleab Ayalew , Suraj Venkat Pochampally , Hoyoung Ahn
IPC分类号： H10N10/01 , H10N10/17 , H10N19/00
CPC分类号： H10N10/01 , H10N10/17 , H10N19/101
摘要： The energy conversion performance, mechanical robustness, and cost associated with fabrication of a thermoelectric device may be improved by three-dimensional flexible thermoelectrics.

38. 发明公开

US20240090332A1 THERMOELECTRIC CONVERSION ELEMENT, THERMOELECTRIC CONVERSION MODULE, AND THERMOELECTRIC CONVERSION ELEMENT PRODUCING METHOD 审中-公开
公开(公告)号：US20240090332A1
公开(公告)日：2024-03-14
申请号：US18515335
申请日：2023-11-21
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： TAKESHI KAWABE , YURIKO KANEKO , TSUTOMU KANNO , HIROMASA TAMAKI
IPC分类号： H10N10/853 , H10N10/01 , H10N10/82 , H10N10/855 , H10N19/00
CPC分类号： H10N10/853 , H10N10/01 , H10N10/82 , H10N10/855 , H10N19/00
摘要： A thermoelectric conversion element includes a p-type thermoelectric conversion layer, a first metal layer, a second metal layer, a first bonding layer, and a second bonding layer. The thermoelectric conversion layer is composed of a p-type thermoelectric conversion material containing a Mg3(Sb,Bi)2-based alloy as a main phase and containing carbon. At least one of the first bonding layer or the second bonding layer contains Al and Si.

39. 发明授权

US11908844B2 Multilayer power, converter with devices having reduced lateral current 有权
公开(公告)号：US11908844B2
公开(公告)日：2024-02-20
申请号：US17452275
申请日：2021-10-26
申请人： pSemi Corporation
发明人： David Giuliano
IPC分类号： H01L25/16 , H01L23/64 , H02M3/07 , H01L27/01 , H01L27/06 , H01L23/48 , H01L23/522 , H10N19/00 , H05K1/02 , H05K1/11 , H01L49/02
CPC分类号： H01L25/16 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/64 , H01L23/642 , H01L27/016 , H01L27/0688 , H01L28/40 , H01L28/90 , H02M3/07 , H05K1/0298 , H05K1/115 , H10N19/00 , H01L2224/0401 , H01L2224/0554 , H01L2224/0557 , H01L2224/05572 , H01L2224/16225 , H01L2224/16265 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H02M3/077
摘要： This disclosure relates to embodiments that include an apparatus that may comprise a first layer including a first plurality of active devices, a second layer including a second plurality of active devices, and/or a third layer including a plurality of passive devices and disposed between the first and the second layers. An active device of the first plurality of active devices and an active device of the second plurality of active devices may influence a state of charge of a passive device of the plurality of passive devices.

40. 发明授权

US11902697B2 Uncooled thermal imager 有权
公开(公告)号：US11902697B2
公开(公告)日：2024-02-13
申请号：US17420513
申请日：2019-12-20
申请人： OroraTech GmbH
发明人： Thomas Grübler
IPC分类号： H04N5/33 , B64G1/10 , B64G1/66 , H10N19/00 , H04N13/243
CPC分类号： H04N5/33 , B64G1/10 , B64G1/66 , H10N19/00 , H04N13/243
摘要： A multispectral or thermal imager comprising a lens assembly, an array of IC chips that is arranged in a field of view of the lens assembly, each IC chip comprising an array of thermopile devices, and a filter assembly comprising one or more wavelength filters. The filter assembly comprises a respective wavelength filter for at least one of the three or more rows of IC chips. At least one wavelength filter is transparent in a portion of a wavelength range that passes through the lens assembly. The filter assembly is configured such that radiation of the same wavelength range passes to the rows of IC chips in the pair of non-adjacent rows, and such that the wavelength range that passes to the rows in the pair of non-adjacent rows is different from a wavelength range that passes to the one or more rows other than the pair of non-adjacent rows.

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