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31. 发明授权

US08395056B2 Multilayer printed wiring board and mounting body using the same 失效
标题翻译：多层印刷线路板及使用其的安装体
公开(公告)号：US08395056B2
公开(公告)日：2013-03-12
申请号：US12811800
申请日：2009-01-16
申请人： Tadashi Nakamura , Fumio Echigo , Masaaki Katsumata
发明人： Tadashi Nakamura , Fumio Echigo , Masaaki Katsumata
IPC分类号： H05K9/00
CPC分类号： H05K3/4626 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K3/4069 , H05K3/462 , H05K2201/0129 , H05K2201/0133 , H05K2201/0209 , H05K2201/10121 , H05K2201/10378 , H05K2203/061 , Y10T29/49126 , H01L2924/00014 , H01L2924/00
摘要： A multilayer printed wiring board (11) is composed of a plurality of printed wiring boards (21a and 21b) each having wiring on its both sides, and a relaxing connection layer (15) for interconnecting the printed wiring boards (21a and 21b). The relaxing connection layer (15) contains an inorganic filler, a thermosetting resin, and a reliever for relieving internal stress. The multilayer printed wiring board (11) is prevented from warpage by making the relaxing connection layer (15) disposed inside it absorb internal stress caused by heating and cooling in a solder reflow process or other processes.
摘要翻译：多层印刷电路板（11）由在其两侧具有布线的多个印刷电路板（21a和21b）和用于互连印刷电路板（21a和21b）的松弛连接层（15）组成。松弛连接层（15）包含无机填料，热固性树脂和用于缓解内应力的缓冲器。通过使位于其内部的松弛连接层（15）通过在回流焊或其它工序中的加热和冷却引起的内部应力来防止多层印刷线路板（11）发生翘曲。

32. 发明授权

US08222534B2 Printed circuit board and manufacturing method thereof 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08222534B2
公开(公告)日：2012-07-17
申请号：US12076118
申请日：2008-03-13
申请人： Jun-Heyoung Park , Jee-Soo Mok , Ki-Hwan Kim , Sung-Yong Kim
发明人： Jun-Heyoung Park , Jee-Soo Mok , Ki-Hwan Kim , Sung-Yong Kim
IPC分类号： H05K1/11 , H05K3/02
CPC分类号： H05K3/4614 , H05K3/0035 , H05K3/4069 , H05K3/4602 , H05K3/462 , H05K3/4623 , H05K3/4647 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/09781 , H05K2203/0554 , H05K2203/061 , Y10T29/49156
摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.
摘要翻译：公开了印刷电路板和印刷电路板的制造方法。制造印刷电路板的方法通过在基板的表面上形成至少一个用于层间导电的凸块并在该表面上堆叠绝缘层的方法可以包括在表面上形成至少一个坝的操作围绕与凸块相对应的区域的板，通过将导电膏印刷到对应于凸块的区域上形成凸块，并将绝缘层堆叠到板的表面上。该方法可用于提高生产力并解决传播问题。

33. 发明申请

US20120160544A1 CORELESS LAYER BUILDUP STRUCTURE WITH LGA 有权
标题翻译：无缝层建筑结构与LGA
公开(公告)号：US20120160544A1
公开(公告)日：2012-06-28
申请号：US12764994
申请日：2010-04-22
申请人： Timothy Antesberger , Rabindra N. Das , Frank D. Egitto , Voya R. Markovich , William E. Wilson
发明人： Timothy Antesberger , Rabindra N. Das , Frank D. Egitto , Voya R. Markovich , William E. Wilson
IPC分类号： H05K1/00 , H05K1/09 , H05K1/03
CPC分类号： H05K3/4623 , H05K1/092 , H05K3/4053 , H05K3/4614 , H05K3/4691 , H05K2203/061
摘要： A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
摘要翻译：一种用于PCB或PWB板的衬底，其具有无芯堆积层和至少一个金属和至少一个介电层。无芯堆积电介质层可由至少部分固化的热固性树脂和热塑性树脂组成。衬底还可以包含焊盘阵列（LGA）封装。

34. 发明申请

US20120069288A1 LIQUID CRYSTAL POLYMER LAYER FOR ENCAPSULATION AND IMPROVED HERMITICITY OF CIRCUITIZED SUBSTRATES 失效
标题翻译：液晶聚合物层用于封装和改善电路基板的腐蚀性
公开(公告)号：US20120069288A1
公开(公告)日：2012-03-22
申请号：US12884392
申请日：2010-09-17
申请人： Rabindra Das , Michael Rowlands
发明人： Rabindra Das , Michael Rowlands
IPC分类号： G02F1/1333 , B32B38/10
CPC分类号： B32B37/02 , B32B2309/105 , B32B2327/18 , B32B2457/20 , H05K3/3452 , H05K3/4626 , H05K2201/0141 , H05K2203/061
摘要： A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of each PTFE layer. A layer of liquid crystal polymer (LCP) is placed on both layers of etched copper foil. An external layer of etched copper foil is placed on the external surface of the LCP layers.
摘要翻译：一种用于制造电子封装的基板及其制造方法，所述电子封装具有铜 - 铜 - 铜（CIC）的核心层，其具有置于CIC两侧的聚四氟乙烯（PTFE）层。在每个PTFE层的外表面上放置一层蚀刻铜箔。将一层液晶聚合物（LCP）放置在蚀刻铜箔的两层上。蚀刻铜箔的外层被放置在LCP层的外表面上。

35. 发明授权

US08134082B2 Solid printed circuit board and method of manufacturing the same 失效
标题翻译：实心印刷电路板及其制造方法
公开(公告)号：US08134082B2
公开(公告)日：2012-03-13
申请号：US12377134
申请日：2008-05-28
申请人： Tadashi Nakamura , Fumio Echigo , Takayuki Kita , Kota Fukasawa , Shogo Hirai
发明人： Tadashi Nakamura , Fumio Echigo , Takayuki Kita , Kota Fukasawa , Shogo Hirai
IPC分类号： H05K3/02 , H05K3/10 , H05K1/03 , H05K1/09
CPC分类号： H05K3/4697 , H05K1/183 , H05K1/189 , H05K3/28 , H05K3/3452 , H05K3/4069 , H05K3/4614 , H05K3/4691 , H05K3/4694 , H05K2201/09145 , H05K2201/09845 , H05K2201/09909 , H05K2201/09972 , H05K2201/10378 , H05K2201/10674 , H05K2201/2018 , H05K2203/061 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.
摘要翻译：通过粘接具有不同形状的上下印刷电路板并且在其表面上形成布线来制造实心印刷电路板。接合层由含有分散在其中的热固性树脂和无机填料的绝缘材料制成，并且具有填充在接合层的预定位置穿孔的通孔的由导电膏制成的通孔导体。该电路板提供了实现小尺寸和厚度的三维安装，适用于高性能和多引脚结构半导体的封装结构。

36. 发明申请

US20110302775A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US20110302775A1
公开(公告)日：2011-12-15
申请号：US13116001
申请日：2011-05-26
申请人： XUE-JUN CAI , ZHI-YONG LI , CHAO LIU
发明人： XUE-JUN CAI , ZHI-YONG LI , CHAO LIU
IPC分类号： H05K3/00
CPC分类号： H05K3/4697 , H05K3/462 , H05K3/4647 , H05K2203/061 , H05K2203/0733 , Y10T29/49124 , Y10T29/49128 , Y10T29/49155
摘要： A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity.
摘要翻译：制造具有空腔的印刷电路板的方法包括以下步骤。首先，提供第一基板。第一衬底包括限定暴露部分的第一导电层和层压部分。其次，设置第二基板。第二基板包括对应于暴露部分的不期望部分和保留部分。第三，形成围绕暴露部分的第一环形凸块。第四，形成围绕不想要的部分的第二环形凸起。第五，提供限定开口的第一粘合剂层。第六，将第一和第二基板层叠到第一粘合剂层上，将暴露部分和不想要的部分暴露在开口中，并且第二环形凸块与第一环形凸起接触。第七，去除不想要的部分并且限定空腔，暴露部分暴露在空腔中。

37. 发明申请

US20110247207A1 METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD 有权
标题翻译：制造多层柔性印刷电路板的方法
公开(公告)号：US20110247207A1
公开(公告)日：2011-10-13
申请号：US13164776
申请日：2011-06-21
申请人： JUN-QING ZHANG , CHIH-YI TU , SZU-MIN HUANG
发明人： JUN-QING ZHANG , CHIH-YI TU , SZU-MIN HUANG
IPC分类号： H05K3/46 , H05K3/40 , H05K3/36
CPC分类号： H05K3/4697 , H05K1/0393 , H05K3/4611 , H05K3/4635 , H05K2201/0394 , H05K2201/0909 , H05K2201/09127 , H05K2203/061 , H05K2203/063 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.
摘要翻译：一种制造多层FPCB的方法，包括提供第一基板，第二基板和粘合剂层; 在粘合剂层上限定开口; 限定所述第一基板的介电层中的第一狭缝; 层压第一基板，粘合剂层和第二基板; 在所述第一基板的所述导电层中形成第二狭缝，所述第二狭缝被形成为与所述第一狭缝对准，切割所述第一基板，所述粘合剂层和所述第二基板，从而形成具有不同数量的多层柔性印刷电路板的层次在不同的地区。

38. 发明授权

US08031474B2 Printed circuit board assembly and method of manufacturing the same 有权
标题翻译：印刷电路板组装及其制造方法
公开(公告)号：US08031474B2
公开(公告)日：2011-10-04
申请号：US11627844
申请日：2007-01-26
申请人： Minoru Ogawa , Kazuto Nishimoto
发明人： Minoru Ogawa , Kazuto Nishimoto
IPC分类号： H05K1/18
CPC分类号： G02B6/138 , G02B6/43 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1533 , H05K1/0272 , H05K1/0274 , H05K1/183 , H05K1/186 , H05K3/365 , H05K3/386 , H05K3/4015 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4626 , H05K3/4697 , H05K2201/0129 , H05K2201/0195 , H05K2201/0272 , H05K2201/0311 , H05K2201/048 , H05K2201/064 , H05K2201/09163 , H05K2201/09536 , H05K2201/096 , H05K2201/1031 , H05K2201/10378 , H05K2203/061 , Y02P70/611 , H01L2924/00
摘要： A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.
摘要翻译：印刷电路板组件具有多个印刷电路板，它们被堆叠而彼此机械地和电连接，并且提供了将相邻的两个印刷电路板彼此连接的连接层。连接层包括绝缘部分和导电部分。绝缘部分包含绝缘部件并且粘附到相邻的两个印刷电路板中的每一个。导电部分穿过绝缘部分并连接相邻的两个印刷电路板的电极端子。

39. 发明授权

US07989944B2 Method for embedding a component in a base 有权
标题翻译：在基础中嵌入组件的方法
公开(公告)号：US07989944B2
公开(公告)日：2011-08-02
申请号：US11878557
申请日：2007-07-25
申请人： Risto Tuominen
发明人： Risto Tuominen
IPC分类号： H01L21/52 , H01L21/60
CPC分类号： H05K1/0218 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24137 , H01L2224/24227 , H01L2224/82039 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/3025 , H05K1/185 , H05K1/188 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4652 , H05K2201/09981 , H05K2201/10674 , H05K2203/061 , H05K2203/063 , H05K2203/1469 , H01L2924/00
摘要： A method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around the semiconductor components. Through-holes for the semiconductor components are made in the base, in such a way that the holes extend between the first and second surface of the base. After the making of the holes, a polymer film is spread over the second surface of the base structure, in such a way that the polymer film also covers the through-holes made for the semiconductor components from the side of the second surface of the base structure. Before the hardening, or after the partial hardening of the polymer film, the semiconductor components are placed in the holes made in the base, from the direction of the first surface of the base. The semiconductor components are pressed against the polymer film in such a way that they adhere to the polymer film.
摘要翻译：一种方法，其中形成电子电路的一部分的半导体部件或其至少一部分的半导体部件在基体的制造期间嵌入基板（例如电路板）中，当基部结构的一部分为它是在半导体元件周围制造的。用于半导体部件的通孔在基座中以这样的方式制成，使得孔在基部的第一和第二表面之间延伸。在制作孔之后，将聚合物膜分散在基底结构的第二表面上，使得聚合物膜也从基底的第二表面的一侧覆盖由半导体部件制成的通孔结构体。在硬化之前或在聚合物膜部分硬化之后，将半导体部件从基底的第一表面的方向放置在基底中制成的孔中。将半导体部件压在聚合物膜上，使得它们粘附到聚合物膜上。

40. 发明申请

US20110180930A1 WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：接线板，接线板的制造方法和半导体封装
公开(公告)号：US20110180930A1
公开(公告)日：2011-07-28
申请号：US12954953
申请日：2010-11-29
申请人： Tadashi ARAI
发明人： Tadashi ARAI
IPC分类号： H01L23/52 , H05K1/11 , H05K3/10
CPC分类号： H01L23/49822 , H01L23/147 , H01L23/15 , H01L23/49816 , H01L23/49833 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01322 , H01L2924/09701 , H01L2924/1461 , H01L2924/15174 , H01L2924/15311 , H05K3/4629 , H05K3/4688 , H05K2203/061 , Y10T29/49155 , H01L2924/00
摘要： A wiring board includes a ceramic substrate including a plurality of stacked ceramic layers, an internal wiring, and an electrode electrically connected to the internal wiring, the electrode being exposed from a first surface of the ceramic substrate; and a silicon substrate including a wiring layer, the wiring layer including a wiring pattern and a via-fill, the wiring pattern being formed on a main surface of the silicon substrate, an end of the via-fill being electrically connected to the wiring pattern, another end of the via-fill being exposed from a rear surface of the silicon substrate positioned opposite to the main surface, wherein the another end of the via-fill is bonded to the electrode of the ceramic substrate via a metal layer.
摘要翻译：布线基板包括陶瓷基板，该陶瓷基板包括多个堆叠的陶瓷层，内部布线和电连接到内部布线的电极，该电极从陶瓷基板的第一表面露出; 以及包括配线层的硅衬底，所述布线层包括布线图案和通路填充物，所述布线图案形成在所述硅衬底的主表面上，所述通孔填充物的端部电连接到所述布线图案通孔填充物的另一端从与主表面相对的硅衬底的后表面露出，其中通孔填充物的另一端通过金属层结合到陶瓷衬底的电极。

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