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31. 发明申请

US20150183456A1 ELECTRONIC CONTROL UNIT AND ELECTRIC POWER STEERING APPARATUS HAVING THE SAME 有权
标题翻译：电子控制单元和具有该电子控制单元的电动转向装置
公开(公告)号：US20150183456A1
公开(公告)日：2015-07-02
申请号：US14582465
申请日：2014-12-24
申请人： DENSO CORPORATION
发明人： Toshiro NISHIMURA
IPC分类号： B62D5/04 , H05K1/02
CPC分类号： H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0231 , H05K1/0234 , H05K7/1432
摘要： An electronic control unit includes a board, an electronic device, a heatsink, and a fastener. The board includes a protection layer and a ground pattern covered with the protection layer. The ground pattern has an exposed portion exposed outside the protection layer. The electronic device is mounted on the board and has an anode terminal and a cathode terminal connected to the ground pattern. The heatsink supports the board. The fastener is inserted though an insertion hole of the exposed portion. The fastener electrically connects the ground pattern to the heatsink and fixes the board to the heatsink. The exposed portion is located on the cathode terminal side of the electronic device.
摘要翻译：电子控制单元包括板，电子设备，散热器和紧固件。该板包括保护层和覆盖有保护层的接地图案。接地图案具有暴露在保护层外部的暴露部分。电子装置安装在板上，并具有连接到接地图案的阳极端子和阴极端子。散热器支持电路板。紧固件通过暴露部分的插入孔插入。紧固件将接地图形电连接到散热器，并将板固定到散热器。暴露部分位于电子设备的阴极端子侧。

32. 发明申请

US20150179334A1 TRANSFORMER AND ADAPTER 审中-公开
标题翻译：变压器和适配器
公开(公告)号：US20150179334A1
公开(公告)日：2015-06-25
申请号：US14288877
申请日：2014-05-28
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Nak Jun JEONG , Jong Woo Kim , Sung Yun Han , Heung Gyoon Choi , Seung Hwan Lee , Young Seung Noh , Geun Young Park
IPC分类号： H01F27/36 , H05K1/18 , H01F27/28
CPC分类号： H01F27/2885 , H01F27/28 , H01F27/2804 , H01F27/2823 , H01F27/362 , H01F2027/2809 , H05K1/0224 , H05K1/165 , H05K1/181 , H05K2201/086 , H05K2201/09672 , H05K2201/10015 , H05K2201/1003 , H05K2201/1006 , H05K2201/10522 , H05K2203/1476
摘要： A transformer may include: a primary coil part including a plurality of substrates on which coil patterns are formed; a secondary coil part including an insulated coil; and a shielding part formed on the primary coil part and including one or more substrates on which a shielding pattern is formed.
摘要翻译：变压器可以包括：初级线圈部分，其包括形成有线圈图案的多个基板; 包括绝缘线圈的次级线圈部分; 以及形成在初级线圈部上并且包括一个或多个衬底的屏蔽部件，在其上形成有屏蔽图案。

33. 发明授权

US09035190B2 Flexible circuit board and display device 有权
标题翻译：柔性电路板和显示装置
公开(公告)号：US09035190B2
公开(公告)日：2015-05-19
申请号：US13501828
申请日：2010-09-01
申请人： Masahiro Imai
发明人： Masahiro Imai
IPC分类号： H05K1/03 , H05K1/02 , H05K1/14
CPC分类号： H05K1/0224 , H05K1/038 , H05K1/0393 , H05K1/147 , H05K2201/09681 , H05K2201/0969 , H05K2201/10136
摘要： The present invention has an object of obtaining excellent anti-noise performance and a high level of flexibility in a flexible circuit board. A flexible circuit board 13 according to the present invention has a flexible insulating base material 21, a plurality of wiring patterns 22 formed at prescribed intervals on one surface 21a of the insulating base material 21, and a conductive layer 23 formed on the other surface 21b of the insulating base material 21. The conductive layer 23 is disposed so as to overlap first wiring patterns 22A, which is a select set among the plurality of wiring patterns 22, and does not overlap all of the wiring patterns 22.
摘要翻译：本发明的目的是在柔性电路板中获得优异的抗噪声性能和高灵活性。根据本发明的柔性电路板13具有柔性绝缘基材21，在绝缘基材21的一个表面21a上以规定间隔形成的多个布线图案22和形成在另一个表面21b上的导电层23 绝缘基材21.导电层23配置成与多个布线图案22之中的选择组的第一布线图案22A重叠，并且不与所有布线图案22重叠。

34. 发明授权

US08963018B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US08963018B2
公开(公告)日：2015-02-24
申请号：US13501954
申请日：2010-01-28
申请人： Conny Olsen
发明人： Conny Olsen
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H05K1/112 , H05K1/0224 , H05K1/025 , H05K2201/09236 , H05K2201/09381
摘要： The present invention concerns a printed circuit board, PCB. The PCB comprises a number of signal layers comprising routing channels and at least one ground layer being adjacent to at least one signal layer. A number of via holes connects different signal layers of the PCB. In the signal layers the via holes are connected to pads and in the ground layers they are be surrounded by anti-pads. The pads are shaped such that at least a part of a via hole connected to the pad is on the outside of, or in close proximity to, the edge of the pad, irrespective of where on the pad the centre of the via hole is positioned.
摘要翻译：本发明涉及印刷电路板，PCB。 PCB包括多个包括路由信道的信号层和与至少一个信号层相邻的至少一个接地层。多个通孔连接PCB的不同信号层。在信号层中，通孔连接到焊盘，并且在接地层中，它们被防焊盘包围。焊盘成形为使得连接到焊盘的通孔的至少一部分位于焊盘的边缘的外侧或紧邻焊盘的边缘，而不管焊盘上的通孔的中心位于何处。

35. 发明授权

US08952265B2 Electromagnetic interference noise reduction package board 有权
标题翻译：电磁干扰降噪封装板
公开(公告)号：US08952265B2
公开(公告)日：2015-02-10
申请号：US13590760
申请日：2012-08-21
申请人： Han Kim , Dae-Hyun Park , Young-Min Ban
发明人： Han Kim , Dae-Hyun Park , Young-Min Ban
IPC分类号： H05K1/11 , H01L23/64 , H01L23/552 , H05K1/02 , H01L23/66
CPC分类号： H01L23/64 , H01L23/552 , H01L23/66 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0224 , H05K1/0236 , H01L2924/00014
摘要： An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on one surface thereof; and a second area placed on a lateral side of the first area and having unit structures arranged repeatedly therein, the unit structures configured for inhibiting EMI noise from being radiated to an outside through the lateral side of the first area. The unit structure can include: a top conductive plate and a bottom conductive plate, formed, respectively, on the top layer and the bottom layer of the second area to face each other in a pair; and a via, connecting the top conductive plate with the bottom conductive plate.
摘要翻译：具有顶层和底层的EMI噪声降低封装板，其中一个具有安装在其上的半导体器件，其可以包括：具有布置在其一个表面上的信号层的第一区域; 以及放置在所述第一区域的横向侧上并具有重复排列的单元结构的第二区域，所述单元结构被配置为用于抑制EMI噪声通过第一区域的侧面辐射到外部。该单元结构可以包括：顶部导电板和底部导电板，分别形成在第一区域的顶层和底层上，以便成对地彼此面对; 以及将顶部导电板与底部导电板连接的通孔。

36. 发明授权

US08952264B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US08952264B2
公开(公告)日：2015-02-10
申请号：US13500472
申请日：2009-12-21
申请人： Conny Olsen
发明人： Conny Olsen
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H05K1/112 , H05K1/0224 , H05K1/025 , H05K2201/09236 , H05K2201/09381
摘要： Embodiments of the present invention provide a multi layered printed circuit board, PCB, with via holes connecting different signal layers of the PCB. The via holes are connected to pads in the signal layers and are surrounded by anti-pads in the ground layers. In accordance with further embodiments of the invention the pads have a shape wherein a first path, stretching from the center of the pad and substantially in a direction in which adjacent routing channels extend, to a first point located on the edge of the pad, is longer than a second path, stretching from the center of the pad and substantially in a direction towards the adjacent routing channels to a second point located on the edge of the pad.
摘要翻译：本发明的实施例提供一种多层印刷电路板，PCB具有连接PCB的不同信号层的通孔。通孔连接到信号层中的焊盘，并被接地层中的焊盘包围。根据本发明的另外的实施例，垫具有这样的形状，其中从衬垫的中心并且基本上沿着相邻的路线通道延伸的方向延伸到位于垫的边缘上的第一点的第一路径是长于第二路径，从衬垫的中心延伸并且基本上沿着朝向相邻路线通道的方向延伸到位于垫的边缘上的第二点。

37. 发明申请

US20150016078A1 Partitioned Hybrid Substrate for Radio Frequency Applications 有权
标题翻译：用于射频应用的分区混合基板
公开(公告)号：US20150016078A1
公开(公告)日：2015-01-15
申请号：US13941554
申请日：2013-07-15
申请人： Hong Kong Applied Science and Technology Research Institute Company Limited
发明人： Dan YANG , Song HE , Yuxing REN , Xunqing SHI
IPC分类号： H05K1/02 , C23F1/04 , C23C28/00 , H05K3/00
CPC分类号： H05K1/024 , C23C28/40 , H01L21/568 , H01L24/19 , H01L24/97 , H01L2223/6677 , H01L2224/04105 , H01L2224/73267 , H01L2924/15311 , H01L2924/3025 , H05K1/0224 , H05K1/0231 , H05K1/165 , H05K1/185 , H05K3/0058 , H05K3/007 , H05K3/0097 , H05K3/429 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/068 , H05K2201/0723 , H05K2201/09136 , H05K2201/09536 , H05K2201/09981 , H05K2201/10015 , H05K2201/1003 , H05K2201/1006 , H05K2201/10098 , Y10T156/1057
摘要： The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.
摘要翻译：目前要求保护的发明是提供一种用于紧凑型RF信号系统的封装，以及形成其封装的方法，以便使封装尺寸小型化，提高信号完整性并降低制造成本。该封装包括具有夹层结构的混合基板，其中混合基板包括上层，并且具有不同介电特性的下层由用于改善电隔离和机械刚度的插入件分离。金属层形成在开口的侧壁上以包围有源部件，使得金属侧壁与上层和下层中的两个接地板一起构成封装内的自屏蔽外壳，以保护有源部件。

38. 发明申请

US20140176840A1 ELECTRONIC EQUIPMENT AND FLEXIBLE PRINTED CIRCUIT 有权
标题翻译：电子设备和柔性印刷电路
公开(公告)号：US20140176840A1
公开(公告)日：2014-06-26
申请号：US14102228
申请日：2013-12-10
申请人： MITSUBISHI ELECTRIC CORPORATION
发明人： Ryuichi HASHIDO
IPC分类号： H05K9/00 , G02F1/133 , H05K1/02
CPC分类号： H05K9/0054 , G02F1/13306 , G02F1/13452 , G02F2001/133334 , H05K1/0224 , H05K1/0259 , H05K1/028 , H05K3/361 , H05K2201/0715 , H05K2201/09681
摘要： A shield layer is selectively formed on a front surface of a base film having an insulating property to form a wiring layer on a rear surface of the base film, and a connector connection terminal and a mounting terminal are selectively provided on the wiring layer. A liquid crystal display device is configured so as to be housed in a set housing, in a state that a TFT array substrate and a control board are connected to each other via an FPC having the structure as described above. In this case, the shield layer is provided in such a manner of opposing to an inner surface of the housing, the shield layer maintains an insulating relationship with the drive circuit, and is electrically connected to a portion of the housing via the first ground wiring portion.
摘要翻译：在具有绝缘性的基膜的前表面上选择性地形成屏蔽层，以在基膜的后表面上形成布线层，并且在布线层上选择性地设置连接器连接端子和安装端子。在TFT阵列基板和控制基板经由具有上述结构的FPC彼此连接的状态下，液晶显示装置被配置为容纳在设置的壳体中。在这种情况下，屏蔽层以与壳体的内表面相对的方式设置，屏蔽层与驱动电路保持绝缘关系，并通过第一接地线与外壳的一部分电连接一部分。

39. 发明申请

US20140175680A1 ELECTRICAL CHARACTERISTICS OF PACKAGE SUBSTRATES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME 有权
标题翻译：封装衬底和包括其中的半导体封装的电气特性
公开(公告)号：US20140175680A1
公开(公告)日：2014-06-26
申请号：US14014652
申请日：2013-08-30
申请人： SK hynix Inc.
发明人： Eul Chul JANG , Qwan Ho CHUNG , Sang Joon LIM , Sung Woo HAN
IPC分类号： H05K1/02 , H01L23/528
CPC分类号： H05K1/0224 , H01L23/49838 , H01L23/552 , H01L2924/0002 , H05K1/0219 , H05K1/0253 , H05K2201/09236 , H05K2201/093 , H05K2201/09345 , H05K2201/09681 , H05K2201/097 , H05K2201/09727 , H01L2924/00
摘要： Package substrates are provided. The package substrate may include a power line and a ground line on a first surface of a substrate body; a plurality of signal lines on the first surface between the power line and the ground line; and a lower ground pattern and a lower power pattern positioned on a second surface of the substrate body opposite to the first surface. The lower ground pattern may be disposed to be opposite to the power line and the lower power pattern may be disposed to be opposite to the ground line. Related semiconductor packages are also provided.
摘要翻译：提供封装衬底。封装基板可以包括在基板主体的第一表面上的电源线和接地线; 电源线和接地线之间的第一表面上的多条信号线; 以及位于基板主体的与第一表面相对的第二表面上的较低接地图案和较低功率图案。下接地图案可以被布置成与电力线相对，并且下功率图案可以被设置为与接地线相对。还提供了相关的半导体封装。

40. 发明申请

US20130285218A1 INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF 有权
公开(公告)号：US20130285218A1
公开(公告)日：2013-10-31
申请号：US13733565
申请日：2013-01-03
申请人： Nuvotronics, LLC
发明人： Jean-Marc Rollin , David W. Sherrer
IPC分类号： H01L23/58
CPC分类号： H01L23/373 , H01L23/5286 , H01L23/552 , H01L23/562 , H01L23/58 , H01L23/66 , H01L2223/6627 , H01L2224/48091 , H01L2224/85444 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/1423 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H01P3/06 , H01P11/005 , H05K1/0221 , H05K1/0224 , H05K1/0272 , H05K3/4092 , H05K3/4661 , H05K2201/09809 , H05K2201/10636 , H05K2201/10674 , H05K2203/0733 , H05K2203/308 , Y02P70/611 , Y10T29/49002 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
摘要： Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

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