会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明授权
    • Stacked inductive device assemblies and methods
    • 堆叠感应器件组件和方法
    • US08310331B2
    • 2012-11-13
    • US13205367
    • 2011-08-08
    • Timothy Craig Wedley
    • Timothy Craig Wedley
    • H01F27/24H01F27/30H01F17/04
    • H01F27/2828H01F3/12H01F17/043H01F27/26H01F27/30H01F27/323
    • Improved inductive electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises an inductive device module comprising N inductors and N+1 core elements. The core elements comprise ferrite core pieces that are optionally identical to one another. These core elements are stacked (e.g., in a longitudinal coaxial arrangement) such that the back of one core element associated with a first inductor provides a magnetic flux path for a second inductor. Form-less (bonded) windings are also optionally used to simplify the manufacture of the device, reduce its cost, and allow it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB.
    • 改进的感应电子设备及其制造方法。 在一个示例性实施例中,该装置包括包括N个电感器和N + 1个核心元件的电感器件模块。 核心元件包括可选地彼此相同的铁氧体磁芯片。 这些芯元件堆叠(例如,以纵向同轴布置),使得与第一电感器相关联的一个芯元件的背面为第二电感器提供磁通路径。 还可以选择使用无形(接合)绕组来简化器件的制造,降低其成本,并且允许其变得更紧凑(或者替代地,其中设置的附加功能)。 一种变型使用端接头来与PCB或其他组件配合,而另一种则完全避免了通过直接与PCB配合来使用插头。