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    • 32. 发明授权
    • Microscope and inspection apparatus
    • 显微镜和检查仪器
    • US09013787B2
    • 2015-04-21
    • US13744890
    • 2013-01-18
    • Lasertec Corporation
    • Haruhiko KusunoseTakamasa Tsubouchi
    • G02B21/06G02B21/00G02B21/10F21V8/00G01N21/95
    • G02B21/06G01N21/9501G01N21/9505G02B6/0008G02B21/0092G02B21/10
    • A system including a microscope and an inspection apparatus in which an objective lens having a large numerical aperture is used for detecting a defect existing inside a sample. A light source apparatus produces linearly polarized light. The polarization maintaining fibers optically coupled to the light source apparatus project the linearly polarized light onto the sample surface as an illumination beam of P-polarized light at an incidence angle substantially equal to the Brewster's angle of the sample. The scattered light generated by the defect existing in the sample is emitted from the sample and is collected by the objective lens whose optical axis is perpendicular to the sample surface. Since the illumination beam of P-polarized light is projected at the incidence angle equal to the Brewster's angle of the sample, no surface reflection occurs and it is possible to use the objective lens having a large numerical aperture.
    • 一种包括显微镜和检查装置的系统,其中使用具有大数值孔径的物镜来检测样品内存在的缺陷。 光源装置产生线偏振光。 与光源装置光学耦合的偏振保持光纤将线偏振光投射到样品表面上,作为基本上等于样品的布鲁斯特角的入射角的P偏振光的照明光束。 由样品中存在的缺陷产生的散射光从样品发射,并由其光轴垂直于样品表面的物镜收集。 由于P偏振光的照明光束以等于样品的布鲁斯特角的入射角投影,所以不会发生表面反射,并且可以使用具有大数值孔径的物镜。
    • 35. 发明申请
    • Optical Inspector
    • 光学检查员
    • US20140218724A1
    • 2014-08-07
    • US13757099
    • 2013-02-01
    • Steven W. MeeksRusmin KudinarHung P. Nguyen
    • Steven W. MeeksRusmin KudinarHung P. Nguyen
    • G01N21/95
    • G01N21/9501G01N21/94G01N21/9505G01N21/956G01N21/958
    • An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a separating minor, and a first and second detector. The radiating source is configured to irradiate a first position on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The telecentric scan lens directs specular reflection and near specular scattered radiation to the time varying beam reflector. The specular reflection is directed by the separating mirror to the first detector. The near specular scattered radiation is not reflected by the separating minor and propagates to the second detector. In response, the optical inspector determines the total reflectivity, the surface slope, or the near specular scattered radiation intensity of the sample.
    • 光学检查器包括辐射源,时变光束反射器,远心扫描透镜,分离光和第一和第二检测器。 辐射源被配置成用源光束照射时变光束反射器上的第一位置。 时变光束反射器将源光束引导到远心扫描透镜,然后将远光扫描透镜引导到源样品。 远心扫描透镜将镜面反射和近镜面散射辐射引导到时变光束反射器。 镜面反射由分离镜引导到第一检测器。 近镜面散射的辐射不会被分离的小分子反射并传播到第二个检测器。 作为响应,光学检查器确定样品的总反射率,表面斜率或近镜面散射辐射强度。
    • 37. 发明申请
    • INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD
    • 检查装置,接合系统和检查方法
    • US20140055599A1
    • 2014-02-27
    • US13967938
    • 2013-08-15
    • TOKYO ELECTRON LIMITED
    • Shinji KOGAAkinori MIYAHARAHiroshi TOMITAShuji IWANAGATakeshi TAMURA
    • G01N21/95H04N5/33
    • G01N21/9503G01N21/9501G01N21/9505H01L22/12H04N5/33
    • An inspection device for inspecting the interior of an overlapped substrate produced by bonding one substrate and another substrate, comprising: a first holding unit configured to hold the rear surface of the overlapped substrate and include a cutout formed to expose a portion of the rear surface of the overlapped substrate when viewed from the top; a second holding unit configured to hold and rotate the overlapped substrate; an infrared irradiator configured to irradiate the rear surface or front surface exposed from the cutout of the overlapped substrate held on the first holding unit with an infrared ray; and an image pickup unit configured to receive the infrared ray emitted from the infrared irradiator and image the overlapped substrate held on the first holding unit in division for each of regions exposed from the cutout.
    • 一种检查装置,用于检查通过粘合一个基板和另一个基板而产生的重叠基板的内部,包括:第一保持单元,其构造成保持重叠基板的后表面,并且包括切口,其形成为将背面的一部分 从顶部观察时的重叠基板; 第二保持单元,其构造成保持并旋转所述重叠的基板; 红外线照射器,被配置为用从红外线照射被保持在第一保持单元上的重叠基板的切口露出的后表面或前表面; 以及图像拾取单元,被配置为接收从所述红外线照射器发射的红外线,并且对于从所述切口暴露的每个区域划分,对保持在所述第一保持单元上的重叠基板进行成像。
    • 40. 发明授权
    • Refraction assisted illumination for imaging
    • 折射辅助照明成像
    • US08450688B2
    • 2013-05-28
    • US13190264
    • 2011-07-25
    • Stephen La LumondiereTerence YeohMartin Siu Wo LeungNeil A. IvesWilliam T. LotshawSteven C. Moss
    • Stephen La LumondiereTerence YeohMartin Siu Wo LeungNeil A. IvesWilliam T. LotshawSteven C. Moss
    • G01J5/02
    • G01N21/9505H04N5/2256
    • Various embodiments are directed to systems and methods for imaging subsurface features of a semiconductor object comprising a first region having a first doping property and a second region having a second doping property. The semiconductor object may comprise subsurface features and material between a surface of the semiconductor object and the subsurface features. The material may have an index of refraction that is greater than an index of refraction of a surrounding medium in contact with the surface of the semiconductor object. For example, a system may comprise an imaging device comprising an objective. The imaging device may be sensitive to a first wavelength. The system may also comprise an illumination source to emit illumination substantially at the first wavelength. The illumination may be directed towards the surface of the semiconductor object at a first angle relative to a normal of the surface. The first angle is greater than an acceptance angle of the objective of the imaging device. Also, the first wavelength may have a photonic energy substantially equal to a bandgap of the first region.
    • 各种实施例涉及用于对包括具有第一掺杂特性的第一区域和具有第二掺杂特性的第二区域的半导体物体的次表面特征进行成像的系统和方法。 半导体物体可以包括半导体物体的表面和地下特征之间的地下特征和材料。 材料可以具有大于与半导体物体的表面接触的周围介质的折射率的折射率。 例如,系统可以包括包括物镜的成像装置。 成像装置可能对第一波长敏感。 该系统还可以包括基本上以第一波长发射照明的照明源。 照明可以相对于表面的法线以第一角度指向半导体物体的表面。 第一角度大于成像装置的物镜的接受角度。 此外,第一波长可以具有基本上等于第一区域的带隙的光子能量。