专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US09040336B2 Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap 有权
标题翻译：用于制造用于MEMS部件的盖的方法和具有这种盖的混合集成部件
公开(公告)号：US09040336B2
公开(公告)日：2015-05-26
申请号：US14058806
申请日：2013-10-21
申请人： Johannes Classen , Axel Franke , Jens Frey , Heribert Weber , Frank Fischer , Patrick Wellner
发明人： Johannes Classen , Axel Franke , Jens Frey , Heribert Weber , Frank Fischer , Patrick Wellner
IPC分类号： H01L21/00 , B81C1/00 , B81B3/00 , B81B7/00
CPC分类号： B81C1/00015 , B81B3/0018 , B81B7/0058
摘要： A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.
摘要翻译：一种用于具有MEMS部件的混合垂直集成部件的盖的制造方法，具有较低的洞穴内部压力的相对较大的洞穴体积以及用于MEMS部件的微机械结构的可靠的过载保护。在多步骤各向异性蚀刻中，在平盖基板中制造盖结构，并且包括至少一个安装框架，该安装框架具有至少一个安装表面和止动结构，在盖内侧具有至少一个止动表面，掩模基板被掩模用于具有由不同材料制成的至少两个掩模层的多步各向异性蚀刻，并且选择掩模层的布局以及蚀刻步骤的数量和持续时间，使得安装表面，止动表面和帽内侧位于帽结构的不同表面水平处。

32. 发明申请

US20150123222A1 Sensor Protective Coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US20150123222A1
公开(公告)日：2015-05-07
申请号：US14069633
申请日：2013-11-01
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： B81C1/00 , B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A method of fabricating a sensor device includes forming a plurality of sensor structures on a wafer, covering the plurality of sensor structures with a polymer layer, and dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer.
摘要翻译：制造传感器装置的方法包括在晶片上形成多个传感器结构，用聚合物层覆盖多个传感器结构，并且在每个传感器结构保持被聚合物层覆盖的同时将晶片切割成多个模具。

33. 发明授权

US09024432B1 Bottom port multi-part surface mount MEMS microphone 有权
标题翻译：底端口多部件表面贴装MEMS麦克风
公开(公告)号：US09024432B1
公开(公告)日：2015-05-05
申请号：US14149372
申请日：2014-01-07
申请人： Knowles Electronics, LLC
发明人： Anthony D. Minervini
IPC分类号： H01L23/12 , H04R11/04 , H01L21/00 , H04R31/00 , B81B7/00 , B81B3/00 , H01L23/10 , H04R19/01 , H04R19/04 , H01L21/78 , H04R19/00
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
摘要翻译：公开了一种用于微机电系统（MEMS）麦克风管芯的表面安装封装。表面安装封装具有带有金属焊盘的基板，用于将封装表面安装到器件的印刷电路板上，并用于在麦克风封装和器件的电路板之间进行电气连接。表面安装麦克风封装具有侧壁间隔件和盖子，并且MEMS麦克风管芯被衬底安装并声耦合到衬底中的声学端口。基板，侧壁间隔件和盖子被连接在一起以形成MEMS麦克风，并且基板，侧壁间隔件和盖子协作以形成用于基板安装的MEMS麦克风管芯的声室。

34. 发明授权

US09011581B1 Venting array and manufacturing method 有权
标题翻译：排气阵列及制造方法
公开(公告)号：US09011581B1
公开(公告)日：2015-04-21
申请号：US14564297
申请日：2014-12-09
申请人： W. L. Gore & Associates, Inc.
发明人： Andrew J. Holliday
IPC分类号： B01D53/22 , B81B7/00 , B32B37/18 , B32B38/00 , B01D71/06 , B01D69/12
CPC分类号： B81B7/0061 , B01D53/228 , B01D69/12 , B01D71/06 , B23B3/00 , B32B3/266 , B32B37/18 , B32B38/0004 , B81B7/0041 , B81B7/0058 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81C1/00293 , H04R1/28 , H04R25/456 , H04R2460/11 , Y10T156/1052 , Y10T428/24331
摘要： The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions.
摘要翻译：本发明涉及一种排气阵列，其包括多个排气区域，包括多孔PTFE基体材料和非孔隙材料，其包含具有多个穿孔的基底材料，其中所述基底材料填充多孔PTFE基质材料的孔以形成无孔区域，连接多个通气区域的无孔区域。

35. 发明授权

US08956444B2 Venting array and manufacturing method 有权
公开(公告)号：US08956444B2
公开(公告)日：2015-02-17
申请号：US13795580
申请日：2013-03-12
申请人： Gore Enterprise Holdings, Inc.
发明人： Andrew J. Holliday
IPC分类号： B01D53/22 , B81B7/00 , B32B3/26 , B23B3/00
CPC分类号： B81B7/0061 , B01D53/228 , B01D69/12 , B01D71/06 , B23B3/00 , B32B3/266 , B32B37/18 , B32B38/0004 , B81B7/0041 , B81B7/0058 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81C1/00293 , H04R1/28 , H04R25/456 , H04R2460/11 , Y10T156/1052 , Y10T428/24331
摘要： The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions.

36. 发明申请

US20140374859A1 SENSOR DEVICE 有权
标题翻译：传感器设备
公开(公告)号：US20140374859A1
公开(公告)日：2014-12-25
申请号：US14376945
申请日：2013-02-26
申请人： OMRON Corporation
发明人： Takashi Kasai
IPC分类号： B81B7/00
CPC分类号： B81B7/0058 , B81B7/0064 , B81B2201/0257 , B81B2201/0292 , B81B2207/115 , B81C1/00246 , H04R1/04 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/006
摘要： A sensor device has a substrate, a sensor section provided on an upper surface of the substrate, a circuit section provided on the upper surface of the substrate, a plurality of connection pads that electrically conduct with the sensor section or the circuit section, and a metal protective film covering at least a part of the circuit section from above.
摘要翻译：传感器装置具有衬底，设置在衬底的上表面上的传感器部分，设置在衬底的上表面上的电路部分，与传感器部分或电路部分导电的多个连接焊盘，以及金属保护膜从上方覆盖电路部分的至少一部分。

37. 发明申请

US20140374855A1 PRESSURE SENSOR AND METHOD OF PACKAGING SAME 审中-公开
标题翻译：压力传感器及其包装方法
公开(公告)号：US20140374855A1
公开(公告)日：2014-12-25
申请号：US13924633
申请日：2013-06-24
申请人： Wai Yew Lo
发明人： Wai Yew Lo
IPC分类号： B81B7/00 , B81B3/00 , B81C1/00
CPC分类号： B81B7/0058 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81C1/0023 , H01L24/73 , H01L24/97 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/16195 , H01L2224/32225 , H01L2924/00012 , H01L2224/85 , H01L2224/83
摘要： A method of packaging a pressure sensor die begins with patterning and etching a metal strip and forming metal traces on the strip. Further build-up is performed to transform the metal strip into a layered substrate. Cavity walls are formed on one side of the strip with a molding process and then the metal on the back side of the strip is removed. Next semiconductor dies are attached to the strip within the cavities and electrically connected to pads formed on the surface of the strip and/or to pads on other ones of the dies. A gel coating is deposited over the dies and then a metal lid is secured over the cavity. The strip is then singulated along ones of the cavity walls to form multiple sensor devices.
摘要翻译：包装压力传感器模具的方法开始于图案化和蚀刻金属条并在条上形成金属迹线。进行进一步的堆积以将金属条变形成层状基板。通过模制工艺在带的一侧上形成腔壁，然后去除带的背侧上的金属。下一个半导体管芯在空腔内连接到条带上，并且电连接到形成在条带表面上的焊盘和/或其它裸片上的焊盘。将凝胶涂层沉积在模具上，然后将金属盖固定在空腔上。然后将带条沿着空腔壁中的一个划分成多个传感器装置。

38. 发明申请

US20140339656A1 MEMS PRESSURE TRANSDUCER ASSEMBLY 有权
标题翻译： MEMS压力变送器总成
公开(公告)号：US20140339656A1
公开(公告)日：2014-11-20
申请号：US14450870
申请日：2014-08-04
申请人： Mark E. Schlarmann , Yizhen Lin
发明人： Mark E. Schlarmann , Yizhen Lin
IPC分类号： B81B7/00 , B81B3/00
CPC分类号： B81B7/0048 , B81B3/0021 , B81B3/0072 , B81B7/0058 , B81B2203/0118 , B81B2203/0127 , B81B2203/051 , B81B2207/115 , B81C1/00309 , G01L9/0042 , G01L9/0052 , G01L19/147 , H01L2224/48137
摘要： An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate overlying the device. A trench (54) is produced extending through both the cap layer and the substrate, and the trench surrounds a cantilevered platform (48) at which the diaphragm resides. The MEMS die is suspended above a substrate (26) so that a clearance space (60) is formed between the cantilevered platform and the substrate. The diaphragm is exposed to an external environment (68) via the aperture, the clearance space, and an external port.
摘要翻译：组件（20）包括具有形成在基板（44）上的压力传感器装置（40）和盖层（38）的MEMS管芯（22）。包装工艺（74）需要在基板上形成装置（40），通过装置（40）的隔膜（46）下面的基板的后侧（58）产生孔（70），并且将帽层（38）到覆盖该器件的衬底的前侧。产生延伸穿过盖层和衬底的沟槽（54），并且沟槽围绕隔膜所在的悬臂平台（48）。 MEMS模具悬挂在基板（26）上方，使得在悬臂平台和基板之间形成间隙空间（60）。隔膜经由孔，间隙空间和外部端口暴露于外部环境（68）。

39. 发明授权

US08889451B2 MEMS pressure transducer assembly and method of packaging same 有权
标题翻译： MEMS压力传感器组件及其包装方法相同
公开(公告)号：US08889451B2
公开(公告)日：2014-11-18
申请号：US13400966
申请日：2012-02-21
申请人： Mark E. Schlarmann , Yizhen Lin
发明人： Mark E. Schlarmann , Yizhen Lin
IPC分类号： H01L21/02
CPC分类号： B81B7/0048 , B81B3/0021 , B81B3/0072 , B81B7/0058 , B81B2203/0118 , B81B2203/0127 , B81B2203/051 , B81B2207/115 , B81C1/00309 , G01L9/0042 , G01L9/0052 , G01L19/147 , H01L2224/48137
摘要： An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate (44) underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate (44) overlying the device (40). A trench (54) is produced extending through both the cap layer (38) and the substrate (44), and surrounds a cantilevered platform (48) at which the diaphragm (46) resides. The die (22) is suspended above a substrate (26) so that a clearance space (60) is formed between the platform (48) and the substrate (26). The diaphragm (46) is exposed to an external environment (68) via the aperture (70) and the space (60), and an external port.
摘要翻译：组件（20）包括具有形成在基板（44）上的压力传感器装置（40）和盖层（38）的MEMS管芯（22）。包装工艺（74）需要在基板上形成装置（40），通过装置（40）的隔膜（46）下方的基板（44）的后侧（58）产生孔（70），以及将覆盖层（38）耦合到覆盖所述器件（40）的衬底（44）的前侧。制造延伸穿过盖层（38）和基板（44）的沟槽（54），并且围绕隔膜（46）所在的悬臂平台（48）。模具（22）悬挂在基板（26）上方，使得在平台（48）和基板（26）之间形成间隙空间（60）。隔膜（46）经由孔（70）和空间（60）和外部端口暴露于外部环境（68）。

40. 发明申请

US20140291782A1 METHODS AND DEVICES FOR PACKAGING INTEGRATED CIRCUITS 有权
标题翻译：用于封装集成电路的方法和装置
公开(公告)号：US20140291782A1
公开(公告)日：2014-10-02
申请号：US13853645
申请日：2013-03-29
申请人： STMICROELECTRONICS PTE LTD.
发明人： Kim-Yong Goh , Yiyi Ma , Wei Zhen Goh
IPC分类号： B81C1/00 , B81B7/00
CPC分类号： B81B7/0058 , B81C2203/0109 , H01L2224/48091 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H01L2924/00014
摘要： Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
摘要翻译：集成电路封装的方法和装置。封装的装置可以包括集成电路，包括图案化表面的第一包装部件和第二包装部件。第一包装部件的图案化表面可以粘合地耦合到第二包装部件的表面或集成电路的表面。集成电路可以至少部分地封装在第一和第二封装部件之间。包装方法可以包括图案化集成电路封装的封装部件的表面。包装部件的表面可以用于粘合地耦合到第二部件以至少部分地封装集成电路封装中的集成电路。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式