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31. 发明授权

US07755026B2 Generating signals representative of sensed light that is associated with writing being done by a user 失效
标题翻译：生成表示与由用户完成的写入相关联的感测光的信号
公开(公告)号：US07755026B2
公开(公告)日：2010-07-13
申请号：US11418987
申请日：2006-05-04
申请人： Arkady Pittel , Andrew M. Goldman , Stanislav V. Elektrov , Sergey Liberman
发明人： Arkady Pittel , Andrew M. Goldman , Stanislav V. Elektrov , Sergey Liberman
IPC分类号： G01J1/04
CPC分类号： G06F3/0428 , B23K26/042 , B23K26/705
摘要： An array of sensitive pixel elements is configured to generate signals representative of sensed light that is associated with writing being done by a user, and an optical system concentrates light from a light source across a section of the array of sensitive pixel elements, the signals being useful to compute a subpixel measurement of a position of the light source.
摘要翻译：敏感像素元件的阵列被配置为产生代表由用户完成的写入的感测光的信号，并且光学系统将来自光源的光聚焦在敏感像素元件阵列的一部分上，该信号为用于计算光源的位置的子像素测量。

32. 发明申请

US20100039680A1 LASER PROCESSING APPARATUS AND METHOD 失效
标题翻译：激光加工设备和方法
公开(公告)号：US20100039680A1
公开(公告)日：2010-02-18
申请号：US12334429
申请日：2008-12-12
申请人： Do Young YOON , Gi Lyong NA , Young Jin JUN
发明人： Do Young YOON , Gi Lyong NA , Young Jin JUN
IPC分类号： H04N1/04
CPC分类号： B23K26/0853 , B23K26/042 , B23K26/082 , B23K26/382 , B23K2101/38
摘要： A laser processing apparatus includes a stage unit moving a substrate having a plurality of work sections along longitudinal and lateral axes and rotating the substrate at a predetermined angle about a rotational axis, a laser beam oscillating unit oscillating laser beams to process holes in the substrate, a camera unit taking and providing an image of each of the work sections, and a controller correcting a processing location data using the image taken by the camera unit to allow the laser oscillating unit and the scanner unit to accurately process the holes in the substrate.
摘要翻译：一种激光加工设备，包括：台架单元，沿着纵向轴线和横向轴线移动具有多个工作部分的基板，并以基于旋转轴线的预定角度旋转所述基板;激光束振荡单元，其振荡激光束以处理所述基板中的孔; 照相机单元，拍摄和提供每个工作部分的图像;以及控制器，使用由相机单元拍摄的图像来校正处理位置数据，以允许激光振荡单元和扫描仪单元精确地处理基板中的孔。

33. 发明申请

US20090184234A1 METHOD FOR ADJUSTING POSITION OF LASER EMITTING DEVICE 审中-公开
标题翻译：用于调整激光发射装置的位置的方法
公开(公告)号：US20090184234A1
公开(公告)日：2009-07-23
申请号：US12302334
申请日：2007-08-27
申请人： Takehiro Shindo , Tsutomu Hiroki
发明人： Takehiro Shindo , Tsutomu Hiroki
IPC分类号： G01J1/44
CPC分类号： B23K26/046 , B23K26/042 , B23K26/705 , H01L21/681
摘要： Performed is a process of setting, on a mounting table, an adjustment substrate, which is provided with a slit of a preset width extended toward a center from a peripheral portion of the adjustment substrate; irradiating the laser beam toward a light receiving surface of a light energy measuring device, which is disposed on a front surface side of the adjustment substrate, from a rear surface side of the adjustment substrate through the slit; and measuring a variation in an energy amount of the laser beam irradiated onto the light receiving surface by the light energy measuring device while moving the laser emitting device in the optical axis direction, and adjusting a position of the laser emitting device in the optical axis direction to a desired position based on the variation in the energy amount on the light receiving surface.
摘要翻译：执行的是在安装台上设置调整基板的处理，该调整基板设置有从调整基板的周边部向中心延伸的预定宽度的狭缝; 从配置在调整用基板的前表面侧的光能测量装置的受光面朝向通过狭缝的调整基板的背面侧照射激光束; 并且在沿着光轴方向移动激光发射装置的同时测量由光能测量装置照射到光接收表面上的激光束的能量的变化，并且调整激光发射装置在光轴方向上的位置基于光接收表面上的能量的变化而到达期望位置。

34. 发明授权

US07498237B2 Method of manufacturing devices, positioning method, dicing method and dicing apparatus 失效
标题翻译：制造装置的方法，定位方法，切割方法和切割装置
公开(公告)号：US07498237B2
公开(公告)日：2009-03-03
申请号：US11584630
申请日：2006-10-23
申请人： Toshikazu Furui
发明人： Toshikazu Furui
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/042 , B23K26/354 , B23K26/40 , B23K2103/50 , B23K2103/52 , B23K2103/56 , H01L21/6836 , H01L23/544 , H01L2221/68327 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： In a dicing method, a dicing is performed in such a way that in such a way that a device substrate, on which two or more devices and alignment marks for positioning are formed, is positioned in accordance with the alignment mark. The dicing method comprises: a substrate fixing step of fixing the device substrate on a fixed stand in a state that the device substrate is covered with coagulant and the coagulant is coagulated; a positioning step of performing a positioning based on the alignment mark in such a manner that a partial area, in which the alignment mark on the device substrate fixed on the fixed stand is formed, is locally heated to melt the coagulant at the partial area, so that the alignment mark is observed through the melted coagulant; and a dicing step of dicing the device substrate and separating the device substrate into the individual device elements.
摘要翻译：在切割方法中，以这样的方式进行切割，使得其上形成有两个或更多个装置和用于定位的对准标记的装置基板根据对准标记定位。切割方法包括：基板固定步骤，在装置基板被凝结剂覆盖并凝结凝结的状态下将装置基板固定在固定支架上; 基于对准标记进行定位的定位步骤，其中局部地加热固定在固定台上的装置基板上的对准标记的局部区域，以在部分区域熔化凝结剂，使得通过熔化的凝结剂观察到对准标记; 以及切割步骤，用于切割器件基板并将器件基板分离成各个器件元件。

35. 发明申请

US20080223839A1 Laser Machining Apparatus 审中-公开
标题翻译：激光加工设备
公开(公告)号：US20080223839A1
公开(公告)日：2008-09-18
申请号：US12033932
申请日：2008-02-20
申请人： Shigenobu Maruyama , Hiroshi Aoyama , Masayuki Shiga , Goichi Ohmae
发明人： Shigenobu Maruyama , Hiroshi Aoyama , Masayuki Shiga , Goichi Ohmae
IPC分类号： B23K26/02
CPC分类号： B23K26/043 , B23K26/03 , B23K26/032 , B23K26/04 , B23K26/042 , B23K26/066 , B23K26/0738 , B23K26/0861 , B23K2101/40 , B23K2101/42
摘要： A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey.
摘要翻译：一种激光加工装置，其能够将掩模图案精确地投影到工件上，并且加工精度优异。提供自动对焦单元。自动对焦单元包括用于观察形成在工件表面上的对准标记以便能够测量投影透镜的焦距的电视摄像机。将工件的主扫描方向伸缩比Ex与其设计值和工件的副扫描方向扩大/缩小比Ey相对应的设计值。校正投影透镜的成像倍率M以补偿膨胀/收缩比Ex。考虑到投影透镜的成像倍率M来校正工件的移动速度和/或工件的移动速度，以补偿膨胀/收缩比Ey。

36. 发明申请

US20080190902A1 Wafer dividing method and laser beam processing machine 有权
标题翻译：晶圆分割法和激光束加工机
公开(公告)号：US20080190902A1
公开(公告)日：2008-08-14
申请号：US12068334
申请日：2008-02-05
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： B23K26/38 , H01L21/78
CPC分类号： H01L21/78 , B23K26/042 , B23K26/40 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052
摘要： A method of dividing a wafer, comprising the steps of forming a deteriorated layer along streets in the inside of the wafer; affixing an adhesive film to the rear surface of the wafer; affixing the adhesive film side of the wafer to a dicing tape mounted on an annular frame; dividing the wafer into individual devices along the streets where the deteriorated layer has been formed by expanding the dicing tape; forming a dividing groove along the outer periphery of each individual device in the adhesive film by applying a laser beam through the spaces between adjacent devices while the dicing tape is expanded by carrying out the first tape expanding step; and dividing the adhesive film along the dividing grooves by further expanding the dicing tape from the state in which the first tape expanding step has been carried out.
摘要翻译：一种分割晶片的方法，包括以下步骤：沿晶片内部的街道形成劣化层; 将粘合剂膜粘附到晶片的后表面; 将晶片的粘合膜侧固定到安装在环形框架上的切割带; 通过扩大切割胶带，将晶圆分割成已形成劣化层的街道上的各个装置; 通过施加激光束穿过相邻装置之间的空间，沿着每个单独装置的外周形成分隔槽，同时通过执行第一带扩展步骤来扩大切割带; 并且通过从已经进行第一带扩展步骤的状态进一步扩大切割带，沿着分割槽分割粘合剂膜。

37. 发明申请

US20080121819A1 Substrate with Marker, Manufacturing Method Thereof, Laser Irradiation Apparatus, Laser Irradiation Method, Light Exposure Apparatus, and Manufacturing Method of Semiconductor Device 有权
标题翻译：带标记的基板，其制造方法，激光照射装置，激光照射方法，曝光装置和半导体装置的制造方法
公开(公告)号：US20080121819A1
公开(公告)日：2008-05-29
申请号：US11942133
申请日：2007-11-19
申请人： Koichiro Tanaka , Takatsugu Omata
发明人： Koichiro Tanaka , Takatsugu Omata
IPC分类号： H01L33/00 , H01L21/00 , H01S3/098 , A61N5/00
CPC分类号： H01L21/02675 , B23K26/042 , B23K26/0738 , B23K26/0853 , G03F7/7085 , G03F9/7065 , G03F9/7076 , G03F9/7088 , H01L21/02678 , H01L21/2026 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/1285 , Y10S438/942
摘要： To provide a laser irradiation apparatus which performs alignment of an irradiated object and emits a laser beam precisely, a laser irradiation method, and a manufacturing method of a TFT with high reliability with the use of a method for precisely targeting a desired irradiation position of the laser beam. A substrate with marker is mounted on a stage formed using a material which transmits infrared light; a marker, which is provided in the substrate with marker mounted on the stage, is detected using a camera capable of sensing infrared light, and a position of the stage is controlled; a laser beam is emitted from a laser oscillator; the laser beam emitted from the laser oscillator is processed into a linear shape by an optical system, and the substrate with marker mounted on the stage is irradiated with the laser beam.
摘要翻译：为了提供一种激光照射装置，其通过使用精确地瞄准所需照射位置的方法，可以精确地瞄准被照射物体的对准并发射激光束，激光照射方法和具有高可靠性的TFT的制造方法激光束。具有标记的基板安装在使用透射红外光的材料形成的台上; 使用能够感测红外光的照相机检测在基板中设置有安装在平台上的标记的标记，并且控制台的位置; 从激光振荡器发射激光束; 从激光振荡器发射的激光束通过光学系统被处理为线状，并且用激光束照射安装在台上的标记的基板。

38. 发明申请

US20080121627A1 Methods and systems for semiconductor structure processing using multiple laser beam spots 有权
标题翻译：使用多个激光束点进行半导体结构处理的方法和系统
公开(公告)号：US20080121627A1
公开(公告)日：2008-05-29
申请号：US11980872
申请日：2007-10-30
申请人： Kelly J. Bruland , Stephen N. Swaringen , Brian W. Baird , Ho Wai Lo , David Martin Hemenway , Brady Nilsen
发明人： Kelly J. Bruland , Stephen N. Swaringen , Brian W. Baird , Ho Wai Lo , David Martin Hemenway , Brady Nilsen
IPC分类号： B23K26/38 , B23K26/03
CPC分类号： H01L23/5258 , B23K26/042 , B23K26/0613 , B23K26/067 , H01L2924/0002 , H01L2924/00
摘要： Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.
摘要翻译：方法和系统使用多个激光束选择性地照射半导体衬底上或其中的结构。结构可以是激光可分割的导电连接，并且照射的目的可以是切断所选择的连接。

39. 发明授权

US07372878B2 Method and system for preventing excessive energy build-up in a laser cavity 失效
标题翻译：用于防止激光腔内过多能量积聚的方法和系统
公开(公告)号：US07372878B2
公开(公告)日：2008-05-13
申请号：US10931460
申请日：2004-08-31
申请人： Brady Nilsen , Steve Stone
发明人： Brady Nilsen , Steve Stone
IPC分类号： H01S3/10
CPC分类号： B23K26/0853 , B23K26/032 , B23K26/042 , B23K26/046 , B23K26/0622 , H01S3/0085
摘要： A method and system decrease the amount of undesired laser radiation reaching a workpiece from a laser having a laser cavity and a Q-switch. The laser operates at any given time in one of at least two modes. In a first mode the laser emits pulses at a PRF (pulse repetition frequency) for selectively irradiating targets on or within a workpiece, and the pulses propagate along a propagation path to the workpiece. In a second mode less or no laser radiation desirably reaches the workpiece. The method is operable during the second mode. The method opens the Q switch more than the Q switch is open in the first mode, thereby limiting the amount of energy that builds up in the laser cavity and decreasing the peak energy of the laser radiation emitted in the second mode.
摘要翻译：一种方法和系统减少从具有激光腔和Q开关的激光到达工件的不需要的激光辐射的量。激光在任何给定的时间以至少两种模式之一操作。在第一模式中，激光器以PRF（脉冲重复频率）发射脉冲，用于选择性地在工件上或在工件上照射靶，并且脉冲沿着传播路径传播到工件。在第二模式中，较少或根本没有激光辐射到达工件。该方法在第二模式期间可操作。该方法比第一模式中的Q开关更多地打开Q开关，从而限制在激光腔中积聚的能量的量并且降低在第二模式中发射的激光辐射的峰值能量。

40. 发明申请

US20080043220A1 LASER MARKING SYSTEM 有权
标题翻译：激光打标系统
公开(公告)号：US20080043220A1
公开(公告)日：2008-02-21
申请号：US11850022
申请日：2007-09-04
申请人： George Kaplan , Avigdor Shachrai , Oded Anner , Leonid Gurvich
发明人： George Kaplan , Avigdor Shachrai , Oded Anner , Leonid Gurvich
IPC分类号： B23K26/36 , B23K26/02 , G01N21/00
CPC分类号： B23K26/032 , B23K26/04 , B23K26/042 , B23K26/043 , B23K26/06 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0665 , B23K26/0861 , B23K26/361 , B23K2103/30 , B23K2103/50 , B41M5/262 , B44B3/009 , B44B7/007 , B44C1/228 , G01N21/87 , G06K1/126
摘要： A laser energy microinscribing system, comprising a semiconductor excited Q-switched solid state laser energy source; a cut gemstone mounting system, allowing optical access to a mounted workpiece; an optical system for focusing laser energy from the laser energy source onto a cut gemstone; a displaceable stage for moving said gemstone mounting system with respect to said optical system so that said focused laser energy is presented to desired positions on said gemstone, having a control input; an imaging system for viewing the gemstone from a plurality of vantage points; and a rigid frame supporting said laser, said optical system and said stage in fixed relation, to resist differential movements of said laser, said optical system and said stage and increase immunity to vibrational misalignments. The laser energy source is preferably a semiconductor diode excited Q-switched Nd:YLF laser with a harmonic converter having an output of about 530 nm. The system may further comprise an input for receiving marking instructions; a processor for controlling said displaceable stage based on said marking instructions and said imaging system, to selectively generate a marking based on said instructions and a predetermined program; and a storage system for electronically storing information relating to images of a plurality of workpieces. A secure certificate of authenticity of a marked workpiece is also provided.
摘要翻译：一种激光能量微分系统，包括半导体激发的Q开关固体激光能量源; 切割宝石安装系统，允许光学访问安装的工件; 用于将来自激光能量源的激光能量聚焦到切割的宝石上的光学系统; 可移动台，用于相对于所述光学系统移动所述宝石安装系统，使得所述聚焦的激光能量呈现在具有控制输入的所述宝石上的期望位置; 用于从多个有利位置观察宝石的成像系统; 以及刚性框架，其支撑所述激光器，所述光学系统和所述平台处于固定关系，以抵抗所述激光器，所述光学系统和所述平台的差动运动，并增加对振动失准的抵抗力。激光能量源优选是具有输出约530nm的谐波转换器的半导体二极管激励的Q开关Nd：YLF激光器。系统还可以包括用于接收标记指令的输入; 用于基于所述标记指令和所述成像系统控制所述可移位级的处理器，以基于所述指令和预定程序选择性地生成标记; 以及用于电子地存储与多个工件的图像有关的信息的存储系统。还提供了标记工件的真实性的安全证书。

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