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    • 36. 发明申请
    • ELECTROCHEMICAL SENSOR FOR DISINFECTANTS
    • 电化学传感器
    • US20110241650A1
    • 2011-10-06
    • US13164723
    • 2011-06-20
    • Ying Zhang
    • Ying Zhang
    • G01R19/00
    • G01N27/404
    • An electrochemical sensor to measure disinfectants is provided. In accordance with one aspect of the invention, the sensor has a silver working electrode disposed in an electrolyte proximate a porous membrane. There is a reference electrode made of silver in contact with the electrolyte. The chemical composition of electrolyte contains one or more anions that make the potential at the reference electrode higher than 0.35 V versus standard hydrogen electrode. The anions form silver salt with solubility higher than the solubility of silver chloride. The voltage at the working electrode versus the reference electrode is maintained negative to keep the background current small enough while maintains the feasibility to reduce disinfectants. Solid phase silver salt of the anions is added within the sensor body, which will prevent poisoning the reference electrode by halide anions diffused into the electrolyte.
    • 提供了一种测量消毒剂的电化学传感器。 根据本发明的一个方面,传感器具有设置在靠近多孔膜的电解质中的银工作电极。 存在与电解质接触的由银制成的参比电极。 电解液的化学成分含有一个或多个阴极,使参考电极的电位高于0.35V,而不是标准氢电极。 阴离子形成银盐,其溶解度高于氯化银的溶解度。 工作电极与参比电极的电压保持不变,以保持背景电流足够小,同时保持降低消毒剂的可行性。 阴离子的固相银盐被添加到传感器体内,这将防止参比电极通过扩散到电解质中的卤化物阴离子中毒。
    • 40. 发明授权
    • Resist stripping methods using backfilling material layer
    • 使用回填材料层的抗剥落方法
    • US07935637B2
    • 2011-05-03
    • US11839934
    • 2007-08-16
    • Nicholas C. M. FullerSivananda KanakasabapathyYing Zhang
    • Nicholas C. M. FullerSivananda KanakasabapathyYing Zhang
    • H01L21/302H01L21/461
    • H01L21/31133H01L21/31058H01L21/31138
    • A method for fabricating a microelectronic structure provides for forming a backfilling material layer at least laterally adjacent, and preferably laterally adjoining, a resist layer located over a substrate. Preferably, the resist layer comprises a surface treated resist layer. Optionally, the backfilling material layer may be surface treated similarly to the surface treated resist layer. Under such circumstances: (1) surface portions of the backfilling material layer and resist layer; and (2) remaining portions of the backfilling material layer and resist layer, may be sequentially stripped using a two step etch method, such as a two step plasma etch method. Alternatively, a surface portion of the surface treated resist layer only may be stripped while using a first etch method, and the remaining portions of the resist layer and backfilling material layer may be planarized prior to being simultaneously stripped while using a second etch method.
    • 用于制造微电子结构的方法提供了形成位于衬底上方的至少侧向邻近且优选地横向邻接的抗蚀剂层的回填材料层。 优选地,抗蚀剂层包括表面处理的抗蚀剂层。 任选地,回填材料层可以与表面处理的抗蚀剂层类似地进行表面处理。 在这种情况下:(1)回填材料层和抗蚀剂层的表面部分; 和(2)回填材料层和抗蚀剂层的剩余部分可以使用两步蚀刻方法,例如两步等离子体蚀刻方法来顺序剥离。 或者,仅使用第一蚀刻方法剥离表面处理的抗蚀剂层的表面部分,并且可以在使用第二蚀刻方法同时剥离之前将抗蚀剂层和回填材料层的其余部分平坦化。