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    • 36. 发明授权
    • Method of manufacturing a semiconductor integrated circuit device
    • 制造半导体集成电路器件的方法
    • US07064090B2
    • 2006-06-20
    • US10942860
    • 2004-09-17
    • Shinichi MinamiYoshiaki KamigakiHideki YasuokaFukuo Owada
    • Shinichi MinamiYoshiaki KamigakiHideki YasuokaFukuo Owada
    • H01L21/00
    • H01L27/11526H01L27/0629H01L27/105H01L27/1052H01L27/11521H01L27/11546Y10S438/983
    • A manufacturing technique for a zener diode which includes forming a first semiconductor region in a region such as a well region at a primary face of a semiconductor substrate and then forming a second semiconductor region of opposite conductivity type thereover. The second semiconductor region covers an area greater than the underlying first semiconductor region. The method further calls for forming an insulating film on the primary face of the substrate followed by the forming connection holes in the insulating film to expose an upper part of the second semiconductor region located outside the area covered by the junction affected between the first and second semiconductor regions. This is followed by the formation of a wire at the upper part of the insulating film in which an electrical connection is affected between the wire and the second semiconductor region through the plural connection holes which are distributively arranged.
    • 一种用于齐纳二极管的制造技术,其包括在半导体衬底的初级面的诸如阱区域的区域中形成第一半导体区域,然后在其上形成相反导电类型的第二半导体区域。 第二半导体区域覆盖大于下面的第一半导体区域的面积。 该方法还要求在衬底的主面上形成绝缘膜,然后在绝缘膜中形成连接孔,以暴露第二半导体区域的上部,该第二半导体区域的上部位于由第一和第二 半导体区域。 接着在绝缘膜的上部形成通过分布布置的多个连接孔在电线和第二半导体区域之间形成电连接的导线。